JPH02136359U - - Google Patents
Info
- Publication number
- JPH02136359U JPH02136359U JP4598989U JP4598989U JPH02136359U JP H02136359 U JPH02136359 U JP H02136359U JP 4598989 U JP4598989 U JP 4598989U JP 4598989 U JP4598989 U JP 4598989U JP H02136359 U JPH02136359 U JP H02136359U
- Authority
- JP
- Japan
- Prior art keywords
- dip
- processing liquid
- printed board
- processing
- dip tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第1図は本考案のプリント板のデイツプ処理装
置の一例を示す正面断面図、第2図は第1図のA
−A断面図である。
1……デイツプ処理装置、2……デイツプ槽、
3……取付部材、4……側壁、5……開口部、6
……搬送装置、7……下側ローラ、8……上側ロ
ーラ、9……下側軸、10……上側軸、11,1
2……ベベルギヤ、13……スプレー手段、14
……主ヘツダー、15……分岐ヘツダー、16ス
プレーノズル、17……液留め、18……ポンプ
、19……配管、20……洗浄装置、21……ス
プレー手段、22……主ヘツダー、23……分岐
ヘツダー、24……スプレーノズル、25……液
留め、26……ポンプ、27……配管、28……
プリント板。
FIG. 1 is a front cross-sectional view showing an example of the printed board dip processing apparatus of the present invention, and FIG. 2 is an A of FIG.
-A sectional view. 1...Deep processing device, 2...Dip tank,
3... Mounting member, 4... Side wall, 5... Opening, 6
... Conveyance device, 7 ... Lower roller, 8 ... Upper roller, 9 ... Lower shaft, 10 ... Upper shaft, 11, 1
2...Bevel gear, 13...Spray means, 14
... Main header, 15 ... Branch header, 16 Spray nozzle, 17 ... Liquid retainer, 18 ... Pump, 19 ... Piping, 20 ... Cleaning device, 21 ... Spray means, 22 ... Main header, 23 ... Branch header, 24 ... Spray nozzle, 25 ... Liquid retainer, 26 ... Pump, 27 ... Piping, 28 ...
printed board.
Claims (1)
理する装置において、処理液を収容するデイツプ
槽2と、処理すべきプリント板を保持し前記デイ
ツプ槽2の処理液中を通過させる搬送装置6と、
処理液に浸漬されて前記デイツプ槽2を通過中の
プリント板の表面に向けて処理液の噴流を当てる
ためのスプレー手段13とを具備することを特徴
とするプリント板のデイツプ処理装置。 An apparatus for dip-processing printed boards having through-holes includes: a dip tank 2 containing a processing liquid; a conveying device 6 that holds the printed board to be processed and passes it through the processing liquid in the dip tank 2;
A dip processing apparatus for a printed board, comprising a spray means 13 for directing a jet of processing liquid toward the surface of the printed board immersed in the processing liquid and passing through the dip tank 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4598989U JPH02136359U (en) | 1989-04-18 | 1989-04-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4598989U JPH02136359U (en) | 1989-04-18 | 1989-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02136359U true JPH02136359U (en) | 1990-11-14 |
Family
ID=31560666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4598989U Pending JPH02136359U (en) | 1989-04-18 | 1989-04-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02136359U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237839A (en) * | 1985-06-21 | 1987-02-18 | アメリカン テレフオン アンド テレグラフ カムパニ− | Protector with circuit disabling apparatus |
JPS63219188A (en) * | 1987-03-06 | 1988-09-12 | 富士機工電子株式会社 | Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition |
-
1989
- 1989-04-18 JP JP4598989U patent/JPH02136359U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237839A (en) * | 1985-06-21 | 1987-02-18 | アメリカン テレフオン アンド テレグラフ カムパニ− | Protector with circuit disabling apparatus |
JPS63219188A (en) * | 1987-03-06 | 1988-09-12 | 富士機工電子株式会社 | Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition |
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