JPS63219188A - Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition - Google Patents
Electrodeposition of resist film of printed wiring board and apparatus for electrodepositionInfo
- Publication number
- JPS63219188A JPS63219188A JP5265287A JP5265287A JPS63219188A JP S63219188 A JPS63219188 A JP S63219188A JP 5265287 A JP5265287 A JP 5265287A JP 5265287 A JP5265287 A JP 5265287A JP S63219188 A JPS63219188 A JP S63219188A
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposition
- tank
- substrate
- opening
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004070 electrodeposition Methods 0.000 title claims description 46
- 239000000758 substrate Substances 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000003973 paint Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
イ 発明の目的
ａ 産業上の利用分野
本発明は、プリント配線板の製造時に感光性レジスＩＩ
ＦＪを電着する方法、およびその実施のための装置に関
するものである。Detailed Description of the Invention A. Purpose of the Invention
The present invention relates to a method of electrodepositing FJ and an apparatus for its implementation.
ｂ 従来の技術
プリント配線板の製造時に、銅または半田スルホール法
にて回路パターンを形成するため、銅張積層基板に感光
性レジスト膜を塗布する手段としては、従来例えばスル
ホールを穴埋め後に、スクリーン印刷で液体レジストを
塗布するスクリーン印刷法や、ドライフィルムをラミネ
ートするテンティング法等がある。b. Conventional technology When manufacturing printed wiring boards, circuit patterns are formed using the copper or solder through-hole method. Conventionally, as a means of applying a photosensitive resist film to a copper-clad laminate board, for example, after filling the through-holes, screen printing is used. There are screen printing methods that apply liquid resist, and tenting methods that laminate dry films.
しかし上記スクリーン印刷法は、全てのスルホールを穴
埋めする手間を要するので、生産性が良くない。またテ
ンティング法は、銅張積層基板とドライフィルムとの寸
法の組み合わせによっては、ドライフィルムにかなりの
ロスを生じて不経済で有るし、銅箔表面に傷があるとそ
こは被覆されず、エツチング時に断線や短路が生じる、
等の問題があった。However, the above-mentioned screen printing method requires time and effort to fill all the through holes, so productivity is not good. In addition, the tenting method is uneconomical as it may cause considerable loss in the dry film depending on the combination of dimensions of the copper-clad laminate board and dry film, and if there are scratches on the surface of the copper foil, they will not be covered. Disconnections and short circuits may occur during etching.
There were other problems.
そこで近時、例えば特開昭６１−２（１６２９３号公報
に見られる如く、感光性レジスト膜を電着塗装により形
成する方法が開発されている。電着塗装法は従来、自動
車の丁塗り塗装法として発展してきたものであるが、こ
れをプリント配線板の感光性レジスト膜の形成に利用で
きるようにしようとするものであり、銅張積層基板の表
面に感光性レジスト膜を均一で、かつ表面の傷をも被覆
させるとともに、レジスト膜材料のロスをなくし、また
完全自動化を図って生産性を向上させようとするもので
ある。Therefore, recently, a method of forming a photosensitive resist film by electrodeposition coating has been developed, for example, as seen in JP-A-61-2 (16293). This method has been developed as a method to form photosensitive resist films for printed wiring boards. The aim is to cover surface scratches, eliminate loss of resist film material, and aim for complete automation to improve productivity.
Ｃ発明が解決しようとする問題点
しかし従来の自動車の下塗り塗装等で用いられている電
着塗装手段は、被塗装物を電着塗料の入った電着槽に上
下移動で浸漬させたり、あるいは被塗装物をコンベアで
斜め移行させながら、電着槽内に浸漬させるものである
。この電着塗装手段をそのままプリント配線板用に利用
したのでは、小径のスルホールに液が入りきらず気泡が
残り、感光性レジスト膜を確実に電着させることは不可
能である。C Problems to be Solved by the Invention However, conventional electrodeposition coating methods used in undercoating automobiles, etc., involve immersing the object to be coated in an electrodeposition bath containing electrodeposition paint by moving it up and down, or The object to be coated is moved diagonally by a conveyor and immersed in an electrodeposition bath. If this electrodeposition coating method were used as is for printed wiring boards, the liquid would not fill the small diameter through holes, leaving bubbles, making it impossible to reliably electrodeposit a photosensitive resist film.
特に近時は、電子機器が小型・軽量・高性能化するに伴
い、半導体素子とともにプリント配線板も高密度・微細
回路化・高信頼性が要求されている。そのような基板の
小径・多数のスルホールに、」二記従来の電着塗装手段
ではなおさら気泡が残り、確実に感光性レジス） ＩＩ
Ｑを電着させることができない、という問題点がある。Particularly in recent years, as electronic devices have become smaller, lighter, and more sophisticated, printed wiring boards as well as semiconductor elements are required to have higher density, finer circuits, and higher reliability. In the small diameter and numerous through-holes of such substrates, bubbles remain even more when using conventional electrodeposition coating methods (see section 2), ensuring photosensitive resists.
There is a problem that Q cannot be electrodeposited.
本発明は、プリント配線板の感光性レジス） Ｉｆｆ電
着形成に用いる方法、および装置に関し、Ｆ記従来の問
題点を解決しようとするものである。即ち本発明の目的
は、基板の小径・多数のスルホールにも親水性を与える
ことで、気泡を生じず確実に感光性レジスト膜を電着可
能として、電着塗装手段が有する長所を生かすことによ
り、高密度・微細回路化・高信頼性のプリント配線板を
製造できるようにすることにある。The present invention relates to a method and an apparatus used for forming (Iff) photosensitive resists for printed wiring boards by electrodeposition, and is intended to solve the conventional problems listed in F. That is, the purpose of the present invention is to impart hydrophilicity to the small diameter and large number of through-holes of the substrate, thereby making it possible to reliably electrodeposit a photosensitive resist film without producing bubbles, and by making use of the advantages of electrodeposition coating means. The goal is to make it possible to manufacture printed wiring boards with high density, fine circuitry, and high reliability.
口 発明の構成
ａ 問題点を解決するための手段
本発明に係るプリント配線板のレジスト膜電着装置は、
スルホール（２）付の銅張積層基板（１）を、電着本槽
（１３）の電着塗料化された感光性レジスト液（３）中
で電着処理する前に、該基板（１）を、同じレジスト液
（３）が加圧されて流れる前処理槽（Ａ）中に、その流
れを遮蔽する如く通過させて、基板（１）のスルホール
（２）に液（３）を通ずことにより、スルホール（２）
内の空気の追出しと親水性を与えるようにしたものであ
る。Arrangement of the Invention a Means for Solving the Problems The resist film electrodeposition apparatus for printed wiring boards according to the present invention comprises:
Before the copper-clad laminate substrate (1) with through-holes (2) is subjected to electrodeposition treatment in the photosensitive resist solution (3) which has been turned into an electrodeposition paint in the main electrodeposition tank (13), the substrate (1) is is passed through the pretreatment tank (A) in which the same resist solution (3) flows under pressure, so as to block the flow, and the solution (3) is not passed through the through holes (2) of the substrate (1). By this, throughhole (2)
It is designed to expel the air inside and provide hydrophilic properties.
また本発明に係るプリント配線板のレジスト膜電着装置
は、電着本槽（Ｂ）の前に前処理槽（ハ）を設けてなり
、いずれにも電着塗料化された感光性レジスト液（３）
が連続供給可能とし、前記前処理槽（Ａ） は、レジス
ト液（３）が加圧されて流れるようにするとともに、そ
こを通過するスルホール（２）付の銅張積層基板（１）
で、液（３）の流れを遮蔽可能な開口部（４）を設けて
なるものである。Further, the resist film electrodeposition apparatus for printed wiring boards according to the present invention is provided with a pretreatment tank (c) before the main electrodeposition tank (B), and both of them are equipped with a photosensitive resist solution that has been made into an electrodeposition paint. (3)
The pretreatment tank (A) allows the resist solution (3) to flow under pressure, and also has a copper-clad laminate substrate (1) with a through hole (2) passing through it.
It is provided with an opening (4) that can block the flow of the liquid (3).
上記構成において、電着本槽（Ｂ）の形状は、第１図・
第２図・第３図・第５図で示す如く、本槽（Ｂ）で満溢
した液（３）を前処理槽（Ａ）へ供給するものでは、蓋
板のある圧力槽形とする。また第６図・第７図・第８図
のように、前処理槽（Ａ）へ後記リザーブＮ（５）から
液（３）を直接供給するものでは、蓋板のない非圧力槽
にすればよい。該本Ｍ（Ｂ）への感光性レジスト液（３
）の供給は、例えば別に設けたりリザーブ槽（５）から
ポンプ（６）により連続供給可能としておく。該本槽（
Ｂ）の前・後側壁（７１（８１には基板通過用のスリッ
ト（９） ＱＯ）を設けてあり、それら（９１ＧＯ）は
第１図ないし第７図に示す如く、基板（１）を水平状で
移行する場合には水平状に形成し、第８図のように垂直
状で移行する場合には垂直状に形成しである。In the above configuration, the shape of the main electrodeposition tank (B) is as shown in Figure 1.
As shown in Fig. 2, Fig. 3, and Fig. 5, the one that supplies the liquid (3) overflowing from the main tank (B) to the pretreatment tank (A) is a pressure tank with a lid plate. . In addition, as shown in Figures 6, 7, and 8, in the case where the liquid (3) is directly supplied from the reserve N (5) described later to the pretreatment tank (A), the liquid (3) is directly supplied to the pretreatment tank (A) from the reserve N (5) described below. Bye. Photosensitive resist solution (3) to the book M (B)
) can be supplied separately, for example, or continuously by a pump (6) from a reserve tank (5). The main tank (
B) has front and rear side walls (71 (81 has slits (9) QO for board passage), and these (91GO) are used to hold the board (1) horizontally as shown in Figures 1 to 7. In the case of a vertical transition as shown in FIG. 8, it is formed horizontally, and in the case of a vertical transition as shown in FIG. 8, it is formed vertically.
電着本ｍ （Ｂ）および前処理槽（Ａ）へ供給する感光
性レジスト液（３）は、アニオン型で例えばカルボン酸
樹脂を有機アミンで中和し、水溶化または水分酸化した
ものを用いればよい。The photosensitive resist solution (3) to be supplied to the electrodeposition book m (B) and the pretreatment tank (A) is an anionic type, for example, a carboxylic acid resin that has been neutralized with an organic amine and made water-solubilized or water-oxidized. Bye.
αＤは本槽（Ｂ）に設けた陰極板で、前記スリット（９
１ＱＱ）と同一面上の両側に設けである。また第１図・
第２図・第３図・第５図で示す如く、本槽（Ｂ）で満溢
した液（３）を前処理槽（Ａ）へ供給する場合では、液
流出口αゐを設けてお（。αD is the cathode plate provided in the main tank (B), and αD is the cathode plate provided in the main tank (B).
1QQ) on both sides on the same surface. Also, Figure 1.
As shown in Figures 2, 3, and 5, when supplying the liquid (3) overflowing from the main tank (B) to the pretreatment tank (A), a liquid outlet αi is provided. (.
前処理槽（Ａ）は、第１図ないし第７図で示す如く、基
板（１）が水平状に通過するものでは、通過する基板（
１）によって遮蔽される開口部（４）、および本槽（Ｂ
）のスリット（９）θ０）と同一面上に設けた基板通路
Ｑ３）も水平状で、第８図のように基板＋１）が垂直状
のものではそれら＋４＞ （１３）も垂直状に設けであ
る。As shown in FIGS. 1 to 7, the pretreatment tank (A) is one in which the substrate (1) passes horizontally.
1), and the main tank (B
) The substrate passage Q3) provided on the same plane as the slit (9) θ0) is also horizontal, and if the substrate +1) is vertical as shown in Fig. It is.
前処理槽（Ａ）にはレジスト液（３）の液流入口（１４
）を設はてあり、それ（１４）は第１図・第２図・第３
図・第４図・第６図で示す如く、基板（１）が開口部（
４）の上面を通過するものでは、基板通路（１３）より
下位置に設ける。しかし第５図・第７図や第８図のよう
に基板（１）が開口部（４）の下面または側面を通過す
るものでは、基板通路（１３）より−Ｌ位置または側部
に設けておく。The pretreatment tank (A) has a liquid inlet (14) for the resist liquid (3).
) is provided, and it (14) is shown in Figure 1, Figure 2, and Figure 3.
As shown in Figures 4 and 6, the substrate (1) has an opening (
4) If the device passes through the upper surface of the substrate, it is provided at a position below the substrate passageway (13). However, in the case where the substrate (1) passes through the lower surface or side surface of the opening (4) as shown in FIGS. put.
また前処理槽（Ａ）の開口部（４）の大きさは、そこを
通過する基板（１）により遮蔽可能に、基板（１）とほ
ぼ同じ大きさとする。例えば小幅の基板（１）のため、
開口部（４）両側に調節用補助板を設置可能としておく
のがよい。前処理槽（＾）へのレジスト液（３）の供給
は、第１図・第２図・第３図・第５図で示す如（、電着
本槽（Ｂ）で溢流した液（３）を供給してもよいし、第
６図ないし第８図で示すように、本槽（Ｂ）へのリザー
ブ槽（５）からポンプ（１６）で供給させてもよく、さ
らには上記両者を並用してもよい。０ωはガイド部であ
り、開口部（４）での基板ｔ１）が液（３）による加圧
を受けても遮蔽状態を解かぬように、例えば基板（１）
両側縁を係止可能な凹溝を形成しておく。Further, the size of the opening (4) of the pretreatment tank (A) is set to be approximately the same size as the substrate (1) so that it can be shielded by the substrate (1) passing therethrough. For example, due to the small width of the board (1),
It is preferable to allow adjustment auxiliary plates to be installed on both sides of the opening (4). The resist solution (3) is supplied to the pretreatment tank (^) as shown in Figure 1, Figure 2, Figure 3, and Figure 5. 3) may be supplied, or as shown in FIGS. 6 to 8, it may be supplied from the reserve tank (5) to the main tank (B) with a pump (16), or both of the above may be supplied. 0ω is a guide part, and the shielding state is not released even if the substrate t1) at the opening (4) is pressurized by the liquid (3), for example, the substrate (1)
Concave grooves are formed in which both side edges can be locked.
なお前処理槽（Ａ）において、基板（１）は開口部（４
）を通過後そのまま前側壁（７）のスリット（９）から
本槽（Ｂ）に送ればよいが、開口部（４）を遮蔽する如
くタクト式に浸漬させた後に一旦前処理槽（Ａ）より引
き上げてから、本槽（Ｂ）へ入れるようにすることも可
能である。また図示は省略するが、前処理槽（Ａ）に超
音波発生装置を付設してもよい。In the pretreatment tank (A), the substrate (1) has an opening (4
) can be directly sent to the main tank (B) through the slit (9) of the front side wall (7), but after being immersed in a tact manner so as to cover the opening (4), it is first sent to the pretreatment tank (A). It is also possible to raise it further and then put it into the main tank (B). Although not shown, an ultrasonic generator may be attached to the pretreatment tank (A).
ｂ 作 用
上記構成のレジスト膜電着方法および装置の使用状態は
、次の如くである。b. Effect The resist film electrodeposition method and apparatus having the above structure are used as follows.
スルホール（２）付の銅張積層基板（１）を、電着水槽
（Ｂ）へ送る前に前処理槽（Ａ）を通す。そこでは本１
（Ｂ） と同じ電着塗料化された感光性レジスト液（
３）が、加圧された状態で開口部（４）を流通しており
、前記基板（１）は開口部（４）においてその液（３）
の流れを遮蔽する。そのために液（３）は、一層圧力が
加わった状態になって基板（１）の各スルホール（２）
に流入し、そこから流出することになる。それゆえ基板
（１）の各スルホール（２）は、空気が完全に追い出さ
れるとともに、各スルホール（２）内壁に親水性が与え
られる。A copper-clad laminate substrate (1) with through holes (2) is passed through a pretreatment tank (A) before being sent to an electrodeposition water tank (B). There book 1
A photosensitive resist solution made into the same electrodeposition paint as (B) (
3) is flowing through the opening (4) in a pressurized state, and the substrate (1) is exposed to the liquid (3) at the opening (4).
to block the flow of water. Therefore, the liquid (3) is under even more pressure, and the liquid (3) is exposed to each through hole (2) of the substrate (1).
It will flow into and flow out from there. Therefore, air is completely expelled from each through hole (2) of the substrate (1), and the inner wall of each through hole (2) is rendered hydrophilic.
この状態で基板＋１）が電着水槽（Ｂ）に送られると、
各スルホール（２）に気泡が生じぬとともに、仮に気泡
が生じてもスルホール（２）内壁には親水性が与えられ
ているため、小さなスルホール（２）にも液（３）が容
易に浸入して、気泡を追い出して残さない。When the substrate +1) is sent to the electrodeposition water tank (B) in this state,
No air bubbles are formed in each through hole (2), and even if air bubbles are formed, the liquid (3) can easily penetrate into the small through holes (2) because the inner walls of the through holes (2) are hydrophilic. to remove air bubbles and leave them behind.
したがって電着水槽（Ｂ）においては、各スルホール（
２）内はレジスト液（３）が完全に満しており、充分な
通電と反応が行われて、各スルホール（２）内壁に感光
性レジスト膜が確実に電着・形成される。Therefore, in the electrodeposited water tank (B), each through hole (
2) is completely filled with the resist solution (3), sufficient electricity is applied and reaction takes place, and a photosensitive resist film is reliably electrodeposited and formed on the inner wall of each through hole (2).
ハ 発明の効果
以上で明かな如く、本発明に係るプリント配線板のレジ
スト膜電着方法および装置によれば、その前処理槽を通
すことによって、銅張積層基板の小径・多数の各スルホ
ールから空気を追い出し、かつその内壁に親水性を与え
ることができる。そのため電着水槽においては、各スル
ホールが完全に液で満され、確実に感光性レジスト膜を
電着形成できることになる。したがって、プリント配線
板に今後まずまず要求される高密度・微細回路化−１）
−一
・高信頼性の達成が容易になる。C. Effects of the Invention As is clear from the above description, according to the method and apparatus for electrodepositing a resist film on a printed wiring board according to the present invention, by passing the resist film through the pretreatment tank, the resist film can be deposited from each of the small diameter and numerous through holes of the copper clad laminate board. It can expel air and impart hydrophilic properties to its inner walls. Therefore, in the electrodeposition water tank, each through hole is completely filled with liquid, and a photosensitive resist film can be reliably formed by electrodeposition. Therefore, higher density and finer circuits will be required for printed wiring boards in the future-1)
-1. It becomes easier to achieve high reliability.
図は本発明の実施例を示すもので、第１図は本発明を実
施中の電着装置の一部縦断正面図、第２図は第１図の要
部を拡大した一部縦断正面図、第３図は第１図の電着装
置の前処理槽の一部省略縦断正面図で、第４図はその前
処理槽の縦断側面図、第５図・第６図・第７図・第８図
は他の実施例の要部を示す一部縦断正面図である。
図面符号 （Ａ）−前処理槽、（Ｂ）−電着水槽、（１
）−銅張積層基板、（２）−スルホール、（３）−感光
性レジスト液、（４）−開口部、（１４）−液流入口。
Ｃつ
「ゝ−＝ −１
Ｔｈｖ″Ｌ−鞍
ば〕
＠ ♀−川
手 続 ネ市 正 書（方式）
昭和６２年１２月２２日
１、事件の表示
昭和６２年特許願第５２６５２号
２、発明の名称
３、補正をする者
事件との関係 特許出願人
４、代理人 〒５９０
７、補正の内容The figures show embodiments of the present invention. Figure 1 is a partially longitudinal front view of an electrodeposition apparatus in which the present invention is being carried out, and Figure 2 is a partially longitudinal front view of an enlarged main part of Fig. 1. , FIG. 3 is a partially omitted vertical sectional front view of the pretreatment tank of the electrodeposition apparatus shown in FIG. 1, FIG. 4 is a vertical sectional side view of the pretreatment tank, and FIGS. 5, 6, 7, and FIG. 8 is a partially longitudinal front view showing the main parts of another embodiment. Drawing code: (A)-pretreatment tank, (B)-electrodeposition water tank, (1
) - copper-clad laminate board, (2) - through hole, (3) - photosensitive resist liquid, (4) - opening, (14) - liquid inlet. Cゝ-=-1 Thv″L-Saddlebar〕 @♀-Kawate Procedure Ne City Official Book (Method) December 22, 1985 1, Incident Indication 1988 Patent Application No. 52652 2, Invention Name 3. Person making the amendment Relationship to the case Patent applicant 4. Agent 590 7. Contents of the amendment
Claims (1)
本槽（Ｂ）の電着塗料化された感光性レジスト液（３）
中で電着処理する前に、該基板（１）を、同じレジスト
液（３）が加圧されて流れる前処理槽（Ａ）中に、その
流れを遮蔽する如く通過させ、基板（１）のスルホール
（２）に液（３）を流入させることにより、スルホール
（２）内の空気の追出しと親水性を与えることを特徴と
する、プリント配線板のレジスト膜電着方法。 ２ 電着本槽（Ｂ）の前に前処理槽（Ａ）を設けてなり
、いずれにも電着塗料化された感光性レジスト液（３）
を連続供給可能とし、前記前処理槽（Ａ）は、レジスト
液（３）が加圧されて流れるようにするとともに、そこ
を通過時のスルホール（２）付の銅張積層基板（１）に
て、液（３）の流れが遮蔽可能に開口部（４）を設けた
ことを特徴とする、プリント配線板のレジスト膜電着装
置。 ３ 電着本槽（Ｂ）に、スルホール（２）付の銅張積層
基板（１）が水平状に通過可能なスリット（９）（１０
）を設けるとともに、該本槽（Ｂ）を圧力槽形として満
溢したレジスト液（３）の液流出口（１２）を設け、前
処理槽（Ａ）は、前記スリット（９）（１０）と同一高
さの基板通路（１３）より下位置に液流入口（１４）を
設けるとともに、基板通路（１３）よりやや下方に液（
３）がオーバフローする開口部（４）を設け、かつ開口
部（４）上を通過する基板（１）の浮上り防止用ガイド
部（１５）を設けてなる、特許請求の範囲第２項に記載
のプリント配線板のレジスト膜電着装置。 ４ 電着本槽（Ｂ）に、スルホール（２）付の銅張積層
基板（１）が水平状に通過可能なスリット（９）（１０
）を設けるとともに、該本槽（Ｂ）を圧力槽形として、
満溢したレジスト液（３）の液流出口（１２）を設け、
前処理槽（Ａ）は、前記スリット（９）（１０）と同一
高さの基板通路（１３）より上部に液流入口（１４）を
設けるとともに、基板通路（１３）よりやや上部に液（
３）が流下する開口部（４）を設け、かつ開口部（４）
下を通過する基板（１）の降下防止用ガイド部（１５）
を設けてなる、特許請求の範囲第２項に記載のプリント
配線板のレジスト膜電着装置。 ５ 電着本槽（Ｂ）に、スルホール（２）付の銅張積層
基板（１）が水平状に通過可能なスリット（９）（１０
）を設け、前処理槽（Ａ）は、前記スリット（９）（１
０）と同一高さの基板通路（１３）より下位置に液流入
口（１４）を設けて、ポンプ（１６）によりレジスト液
（３）を供給可能とするとともに、基板通路（１３）よ
り下方に液（３）がオーバフローする開口部（４）を設
け、かつ開口部（４）上を通過する基板（１）の浮上り
防止用ガイド部（１５）を設けてなる、特許請求の範囲
第２項に記載のプリント配線板のレジスト膜電着装置。 ６ 電着本槽（Ｂ）に、スルホール（２）付の銅張積層
基板（１）が水平状に通過可能なスリット（９）（１０
）を設け、前処理槽（Ａ）は、前記スリット（９）（１
０）と同一高さの基板通路（１３）よりやや上部に液（
３）が流下する開口部（４）を設けるとともに、その上
部の室（１９）にポンプ（１６）によりレジスト液（３
）を供給可能とし、かつ開口部（４）下を通過する基板
（１）の降下防止用ガイド部（１５）を設けてなる、特
許請求の範囲第２項に記載のプリント配線板のレジスト
膜電着装置。 ７ 電着本槽（Ｂ）に、スルホール（２）付の銅張積層
基板（１）が垂直状に通過可能なスリットを設け、前処
理槽（Ａ）は、前記スリットと同一面の基板通路（１３
）を間にした片側室（１７）に加圧されたレジスト液（
３）の液流入口（１４）を設けるとともに、他側室（１
８）へ液（３）が流入可能な開口部（４）を設け、かつ
開口部（４）における基板（１）の横ぶれ防止用ガイド
部（１５）を設けてなる、特許請求の範囲第２項に記載
のプリント配線板のレジスト膜電着装置。[Claims] 1. A copper-clad laminate substrate (1) with through holes (2) is coated with a photosensitive resist solution (3) which has been made into an electrodeposition paint in an electrodeposition main tank (B).
Before performing the electrodeposition process inside, the substrate (1) is passed through a pretreatment tank (A) in which the same resist solution (3) flows under pressure, so as to block the flow. A resist film electrodeposition method for a printed wiring board, characterized in that a liquid (3) is introduced into the through holes (2) to expel air from the through holes (2) and impart hydrophilicity to the through holes. 2. A pretreatment tank (A) is provided before the main electrodeposition tank (B), and both of them contain a photosensitive resist solution (3) that has been made into an electrodeposition paint.
The pretreatment tank (A) allows the resist solution (3) to flow under pressure, and the resist solution (3) flows through the pretreatment tank (A) to the copper-clad laminate substrate (1) with through holes (2). A resist film electrodeposition apparatus for a printed wiring board, characterized in that an opening (4) is provided so that the flow of the liquid (3) can be blocked. 3 The main electrodeposition tank (B) has slits (9) (10) through which the copper-clad laminate board (1) with through holes (2) can pass horizontally.
), and the main tank (B) is of a pressure tank type and is provided with a liquid outlet (12) for the resist solution (3) filled with water. A liquid inlet (14) is provided at a position below the substrate passage (13) at the same height as the substrate passage (13), and a liquid inlet (14) is provided at a position slightly below the substrate passage (13).
3) is provided with an opening (4) through which the substrate (1) overflows, and a guide portion (15) for preventing the substrate (1) from floating above the opening (4) is provided. A resist film electrodeposition apparatus for a printed wiring board as described above. 4 The main electrodeposition tank (B) has slits (9) (10) through which the copper-clad laminate board (1) with through holes (2) can pass horizontally.
), and the main tank (B) is of pressure tank type,
A liquid outlet (12) is provided for the overflowing resist liquid (3),
The pretreatment tank (A) has a liquid inlet (14) above the substrate passage (13) at the same height as the slits (9) and (10), and a liquid inlet (14) slightly above the substrate passage (13).
3) is provided with an opening (4) through which it flows, and the opening (4)
Guide part (15) to prevent the board (1) passing below from falling
A resist film electrodeposition apparatus for a printed wiring board according to claim 2, comprising: 5 The main electrodeposition tank (B) has slits (9) (10) through which the copper-clad laminate board (1) with through holes (2) can pass horizontally.
), and the pretreatment tank (A) is provided with the slits (9) (1
A liquid inlet (14) is provided at a position below the substrate passage (13) at the same height as the substrate passage (13) so that the resist liquid (3) can be supplied by the pump (16), and the liquid inlet (14) is provided at a position below the substrate passage (13) at the same height as Claim 1, further comprising an opening (4) through which the liquid (3) overflows, and a guide part (15) for preventing the substrate (1) from floating above the opening (4). 3. The resist film electrodeposition apparatus for a printed wiring board according to item 2. 6 Slits (9) (10) are provided in the electrodeposition main tank (B) through which the copper-clad laminate board (1) with through holes (2) can pass horizontally.
), and the pretreatment tank (A) is provided with the slits (9) (1
The liquid (
An opening (4) is provided through which the resist solution (3) flows down, and a pump (16) is used to pump the resist solution (3) into the upper chamber (19).
), and is provided with a guide portion (15) for preventing the board (1) from falling when passing under the opening (4), for a printed wiring board according to claim 2. Electrodeposition equipment. 7 The main electrodeposition tank (B) is provided with a slit through which the copper-clad laminate substrate (1) with through-holes (2) can pass vertically, and the pretreatment tank (A) is provided with a substrate passage on the same surface as the slit. (13
) A pressurized resist solution (
3), and the other side chamber (14) is provided.
8) is provided with an opening (4) through which the liquid (3) can flow, and a guide portion (15) for preventing horizontal wobbling of the substrate (1) in the opening (4). 3. The resist film electrodeposition apparatus for a printed wiring board according to item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265287A JPS63219188A (en) | 1987-03-06 | 1987-03-06 | Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265287A JPS63219188A (en) | 1987-03-06 | 1987-03-06 | Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63219188A true JPS63219188A (en) | 1988-09-12 |
| JPH0458196B2 JPH0458196B2 (en) | 1992-09-16 |
Family
ID=12920788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5265287A Granted JPS63219188A (en) | 1987-03-06 | 1987-03-06 | Electrodeposition of resist film of printed wiring board and apparatus for electrodeposition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63219188A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136359U (en) * | 1989-04-18 | 1990-11-14 | ||
| US5502345A (en) * | 1994-08-29 | 1996-03-26 | The United States Of America As Represented By The Secretary Of The Navy | Unitary transducer with variable resistivity |
-
1987
- 1987-03-06 JP JP5265287A patent/JPS63219188A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136359U (en) * | 1989-04-18 | 1990-11-14 | ||
| US5502345A (en) * | 1994-08-29 | 1996-03-26 | The United States Of America As Represented By The Secretary Of The Navy | Unitary transducer with variable resistivity |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458196B2 (en) | 1992-09-16 |
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