JPH02134571A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPH02134571A JPH02134571A JP28947388A JP28947388A JPH02134571A JP H02134571 A JPH02134571 A JP H02134571A JP 28947388 A JP28947388 A JP 28947388A JP 28947388 A JP28947388 A JP 28947388A JP H02134571 A JPH02134571 A JP H02134571A
- Authority
- JP
- Japan
- Prior art keywords
- conductors
- probe card
- insulating body
- probe
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 12
- 239000011111 cardboard Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプローブカードに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a probe card.
第3図は従来のプローブカードの一例の断面図である。 FIG. 3 is a sectional view of an example of a conventional probe card.
プローブカードは、プローブカード基板6.にプローブ
針8を接続し、モールド7により針先位置を固定した構
造となっていた。The probe card includes a probe card board 6. A probe needle 8 was connected to the probe needle 8, and the position of the needle tip was fixed by a mold 7.
上述した従来10−ブカードは、プローブ針自身の機械
的強度で位置精度を保っており、プローブ針を細くして
せまい間隔で並べることが難しいという欠点があった。The above-mentioned conventional 10-book card maintains positional accuracy by the mechanical strength of the probe needles themselves, and has the disadvantage that it is difficult to make the probe needles thinner and arrange them at narrow intervals.
本発明のプローブカードはプローブ端子間隔に対応する
厚さの絶縁膜物の板に端子導体を形成した前記プローブ
端子を複数個貼合わたプローブ群を有して構成されてい
る。The probe card of the present invention includes a probe group in which a plurality of probe terminals each having a terminal conductor formed on an insulating film plate having a thickness corresponding to the distance between the probe terminals are pasted together.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図(a)〜(C)は本発明の第1図の実施例のブロ
ービングモジュール部分の断面図、側面図及び下面図で
ある。1A to 1C are a cross-sectional view, a side view, and a bottom view of the blobbing module portion of the embodiment of the present invention shown in FIG.
導体1は絶縁体2ではさみ接着固定する。The conductor 1 is sandwiched between the insulators 2 and fixed by adhesive.
ここで絶縁体2は導体1が設計された端子間隔になるよ
うに厚さを調整しておく。Here, the thickness of the insulator 2 is adjusted so that the conductor 1 has the designed terminal spacing.
導体1は半導体ウェーハ3に接触する部分を除き大部分
を絶縁物で固定することにより強度を保つ。The strength of the conductor 1 is maintained by fixing most of the conductor 1 with an insulating material, except for the part that contacts the semiconductor wafer 3.
厚さを調整するため絶縁体2は平板の方が都合がよいの
で、プローブカード基板6に実装する際には第1図(C
)に示すようにプローブカード導体6と絶縁体2を一辺
分貼り合わせたものをブロービングモジュール5として
位置を合わせして基板に接着する。In order to adjust the thickness, it is convenient for the insulator 2 to be a flat plate, so when mounting it on the probe card board 6, please use the
), a probe card conductor 6 and an insulator 2 are bonded together on one side, and the probe card conductor 6 and insulator 2 are bonded together to form a blobbing module 5, which is aligned and bonded to a substrate.
電気的接続は導体の長さが異なるなめ余裕をもってラン
ド4へ接続が可能である。Electrical connection can be made to the land 4 with lick margins for different conductor lengths.
第2図(a)及び(b)は本発明の第2の実施例のブロ
ービングモジュール部分の側面及び下面図である。FIGS. 2(a) and 2(b) are side and bottom views of a blobbing module portion according to a second embodiment of the present invention.
端子導体1.は絶縁体2で固定されているが、第1の実
施例とは異なり、絶縁体2.は平板ではない。Terminal conductor 1. are fixed by the insulator 2, but unlike the first embodiment, the insulator 2. is not a flat plate.
また端子導体11の間に接地導体1bを端子間のクロス
トークを防ぐ目的で入れである。Further, a ground conductor 1b is inserted between the terminal conductors 11 for the purpose of preventing crosstalk between the terminals.
この実施例では、絶縁体2.がテーパー状のため絶縁体
2.の厚さ、すなわち端子間隔を矢印A方向からの切削
により調整できる利点がある。In this example, insulator 2. Because it is tapered, insulator 2. There is an advantage that the thickness, that is, the terminal spacing, can be adjusted by cutting in the direction of arrow A.
また端子導体間に絶縁体2.以外のものを不可的に挿入
してもよい。Also, there is an insulator 2 between the terminal conductors. You may insert something other than the
以上説明したように本発明は、プローブ端子導体の横方
向寸法を小さくすることと、その導体の間を絶縁物でほ
ぼ全面的に固定することで導体の横ずれを防ぐことによ
り、端子間隔のせまいプローブカードを容易に実現する
ことができた。As explained above, the present invention reduces the distance between the terminals by reducing the lateral dimension of the probe terminal conductor and fixing the space between the conductors almost entirely with an insulator to prevent the conductor from shifting laterally. A probe card could be easily realized.
第1図(a)〜(c)は本発明の第1の実施例のブロー
ビングモジュール部分の断面図、側面図及び下面図、第
2図(a)及び(b)は本発明の第2の実施例のブロー
ビングモジュール部分の側面図及び下面図、第3図は従
来のプローブカードの一例の断面図である。
1.1.・・・導体、2.2.・・・絶縁体、3・・・
半導体ウェーハ、4・・・ランド、5・・・ブロービン
グモジュール、6・・・プローブカード。
代覗人弁理士内原 晋
$ 2 図
箒 / 図
千 3 図FIGS. 1(a) to (c) are cross-sectional views, side views, and bottom views of the blobbing module portion of the first embodiment of the present invention, and FIGS. 2(a) and (b) are the second embodiment of the present invention. FIG. 3 is a sectional view of an example of a conventional probe card. 1.1. ...Conductor, 2.2. ...Insulator, 3...
Semiconductor wafer, 4... Land, 5... Blobbing module, 6... Probe card. Representative Patent Attorney Susumu Uchihara $ 2 Zuhoki / Zuen 3 Illustrations
Claims (1)
導体を形成した前記プローブ端子を複数個貼合わせたプ
ローブ端子群を有することを特徴とするプローブカード
。1. A probe card comprising a probe terminal group in which a plurality of probe terminals each having a terminal conductor formed on a plate of an insulating film having a thickness corresponding to the distance between the probe terminals are pasted together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28947388A JPH02134571A (en) | 1988-11-15 | 1988-11-15 | Probe card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28947388A JPH02134571A (en) | 1988-11-15 | 1988-11-15 | Probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02134571A true JPH02134571A (en) | 1990-05-23 |
Family
ID=17743732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28947388A Pending JPH02134571A (en) | 1988-11-15 | 1988-11-15 | Probe card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02134571A (en) |
-
1988
- 1988-11-15 JP JP28947388A patent/JPH02134571A/en active Pending
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