JPS6466960A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6466960A
JPS6466960A JP22464187A JP22464187A JPS6466960A JP S6466960 A JPS6466960 A JP S6466960A JP 22464187 A JP22464187 A JP 22464187A JP 22464187 A JP22464187 A JP 22464187A JP S6466960 A JPS6466960 A JP S6466960A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
pins
package body
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22464187A
Other languages
Japanese (ja)
Inventor
Toru Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22464187A priority Critical patent/JPS6466960A/en
Publication of JPS6466960A publication Critical patent/JPS6466960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable accurate positioning easily by forming a plurality of pins being inserted into holes previously shaped to a printed wiring board and conducting the positioning of mounting to the surface, to which a lead terminal for a package body is projected and formed. CONSTITUTION:When a semiconductor device with a plurality of lead terminals 2, which are projected from the opposed two side faces of a package body and noses of which are folded back to a J shape, is loaded onto a printed wiring board 3a, pins 5 formed to the base of the package body 1a are inserted into holes 6 previously shaped to the printed wiring board 3a. Accurate positioning and temporary fixing to the printed wiring board are performed under the state, and the lead terminals 2 and electrode terminals 4 are soldered-joined respectively, thus attaining electrical connection and mechanical fixing. When three pins are fitted, erroneous mounting can be prevented because the direction of mounting is determined.
JP22464187A 1987-09-07 1987-09-07 Semiconductor device Pending JPS6466960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22464187A JPS6466960A (en) 1987-09-07 1987-09-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22464187A JPS6466960A (en) 1987-09-07 1987-09-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6466960A true JPS6466960A (en) 1989-03-13

Family

ID=16816900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22464187A Pending JPS6466960A (en) 1987-09-07 1987-09-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6466960A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012219145A1 (en) * 2012-10-19 2014-05-08 Robert Bosch Gmbh Electronics assembly has spacer structure that is projected in direction of circuit board when electrical contact is arranged on bottom side of electronic component, and that includes contact portion which is contacted to circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012219145A1 (en) * 2012-10-19 2014-05-08 Robert Bosch Gmbh Electronics assembly has spacer structure that is projected in direction of circuit board when electrical contact is arranged on bottom side of electronic component, and that includes contact portion which is contacted to circuit board

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