JPH02132972U - - Google Patents

Info

Publication number
JPH02132972U
JPH02132972U JP4109789U JP4109789U JPH02132972U JP H02132972 U JPH02132972 U JP H02132972U JP 4109789 U JP4109789 U JP 4109789U JP 4109789 U JP4109789 U JP 4109789U JP H02132972 U JPH02132972 U JP H02132972U
Authority
JP
Japan
Prior art keywords
substrate
individual electrodes
plating electrode
plating
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4109789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4109789U priority Critical patent/JPH02132972U/ja
Publication of JPH02132972U publication Critical patent/JPH02132972U/ja
Pending legal-status Critical Current

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  • Electronic Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は一実施例を示す平面図、第2図は従来
例を示す平面図である。 11……セラミツク基板、12……発熱抵抗体
、13……共通電極、14……選択電極、15…
…入力側電極、16……駆動IC、19……ブレ
ークライン、20……検査用抵抗体。
FIG. 1 is a plan view showing one embodiment, and FIG. 2 is a plan view showing a conventional example. DESCRIPTION OF SYMBOLS 11...Ceramic substrate, 12...Heating resistor, 13...Common electrode, 14...Selection electrode, 15...
...Input side electrode, 16...Drive IC, 19...Break line, 20...Resistor for inspection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に形成されてメツキが施される複数の個
別の電極が抵抗体を介して共通のメツキ用電極に
接続されており、メツキ処理後に前記個別の電極
とメツキ用電極の間で基板が切断される電子装置
用基板。
A plurality of individual electrodes formed on the substrate to be plated are connected to a common plating electrode via a resistor, and after the plating process, the substrate is cut between the individual electrodes and the plating electrode. Substrates for electronic devices.
JP4109789U 1989-04-07 1989-04-07 Pending JPH02132972U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4109789U JPH02132972U (en) 1989-04-07 1989-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4109789U JPH02132972U (en) 1989-04-07 1989-04-07

Publications (1)

Publication Number Publication Date
JPH02132972U true JPH02132972U (en) 1990-11-05

Family

ID=31551469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4109789U Pending JPH02132972U (en) 1989-04-07 1989-04-07

Country Status (1)

Country Link
JP (1) JPH02132972U (en)

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