JPH02132902A - Extra-high frequency circuit - Google Patents

Abstract

PURPOSE:To obtain a extra-high frequency circuit capable of deriving sufficiently the characteristic of an element for the circuit by providing a circuit substrate with plural through holes for grounding, and simultaneously, providing the surface of a grounding conductor with a gap in which the conductor is removed in a prescribed direction. CONSTITUTION:The ground terminals 12 of element 11 for the extra-high frequency circuit are connected to the ground conductor surface 14 located at the back side of the substrate 10 through the grounding through holes 13 penetrating from the front side to the back side of the dielectric substrate 10. Besides, a conductor pattern 15 connecting the terminal 12 and the through holes 13 and the terminal 12 are connected by soldering, etc. Further, the gap 16 formed on the conductor surface 14 is formed by removing the conductor in the direction rectangular to the forwarding direction A of a signal on the surface. Then, the through holes 13 are provided at the both sides of the gap 16 so as to interpose the gap 16. Through this constitution, a high frequency current to flow on the conductor surface 14 is obstructed in its way by the gap 16, and after passing through the through holes 13 and passing by the vicinity of the terminal 12, it flows in the conductor surface 14 at the reverse side of the gap 16 through the through holes 13. Accordingly, undersired inductance can be made small, and the high frequency characteristic can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to ultra-high frequency circuits. In particular, it relates to ultra-high frequency circuits having a grounding structure that can fully bring out the high frequency characteristics of ultra-high frequency circuit elements. [Prior Art] Conventionally, as shown in FIGS. 2(a) and 2(b), in a super high frequency circuit, a grounding terminal 2 of a super high frequency circuit element 1 is provided.
A grounding hole 5 is provided to connect to the grounding conductor surface 4 on the back side of the circuit board (i.e., dielectric board) 3.
The structure was such that grounding was achieved by connecting the conductor pattern 6 connected to the ground terminal 2 to the grounding terminal 2 by soldering or the like. [Problem to be solved] The above-mentioned conventional connection J′! ! In the structure, the inductance of the grounding hole 5 and the inductance of the conductor pattern 6 connecting the grounding terminal 2 and the grounding hole 5 are as follows.
Since it is placed between the grounding terminal 2 of the ultra-high frequency circuit element 1 and the I1i ground conductor surface 4, there is a problem in that the characteristics of the ultra-high frequency circuit element 1 cannot be fully brought out. The present invention has been made in view of the above-mentioned problems, and aims to provide an ultra-high frequency circuit that can fully bring out the characteristics of ultra-high frequency circuit elements. 1,000-step solution to the problem] To achieve the above object, the present invention provides an ultra-high frequency circuit in which a grounding conductor surface is provided on the opposite side to the mounting surface of the circuit board on which the ultra-high frequency circuit elements are attached. A plurality of conductive holes for grounding the elements are provided on the circuit board, and a gap is provided in the ground conductor surface in a direction perpendicular to the signal flow, excluding the conductor. Here, since the purpose of the gap is to temporarily transfer the high frequency current on the ground conductor surface to the surface where the high frequency circuit element is attached, the ground conductive holes may be provided on both sides of the gap so as to sandwich the gap. desirable. [Example] An example of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the ultra-high frequency circuit according to the present invention. This figure shows a state in which a high frequency circuit element 11 is attached to a dielectric substrate (that is, a circuit board) 10. A grounding terminal l2 of the high frequency circuit element 1l is connected to a grounding conductor surface 14 on the back surface of the induction board 10 through a grounding hole l3 penetrating the front and back sides of the dielectric board 10. Reference numeral 15 denotes a conductive pattern connecting the grounding terminal 12 and the grounding conductive hole 13, and the conductive pattern 15 and the grounding terminal 12 are connected by soldering or the like.
In this embodiment, two ground conductive holes 13 are provided for one ground terminal l2, but three or more may be provided. 16 is a gap between the ground conductor and the conductor 14, which is formed by removing the conductor in the direction perpendicular to the signal propagation direction A on the ground conductor surface 14. The grounding holes 13 are provided on both sides of the gap 16 so as to sandwich the gap 16 therebetween. With the above configuration, the high frequency current flowing through the grounding conductor surface l4 is blocked by the gap 16 provided in the direction perpendicular to the signal propagation direction A, and passes through the grounding conductive hole 13 to be grounded. After passing near the terminal 12, it flows through the other ground conductive hole 13 to the ground conductor surface l4 on the opposite side of the gap l6. [Effects of the Invention] As explained in 1 below, the present invention allows a high-frequency current to flow through the ground conductor surface close to the ground terminal of a high-frequency circuit element by means of the ground conduction hole and the gap provided in the ground conductor surface. Can be done. Therefore, compared to the conventional grounding structure of ultra-high frequency circuits, unnecessary inductance between the high-frequency circuit elements and the ground can be reduced, and the high-frequency characteristics can be improved.

[Brief explanation of drawings]

Figure 1(a). (b) is a perspective view of the front side and back side of one embodiment of the ultra-high frequency circuit according to the present invention, and FIG.
a). (b) is a perspective view of the front and back sides of a conventional high-frequency circuit. lO-dielectric substrate 11: High-frequency circuit element l2: Grounding terminal of high-frequency circuit element l3: Grounding conduction hole 14: Ground conductor surface l6: Gap

Claims (1)

[Claims] In an ultra-high frequency circuit having a grounding conductor surface on a surface opposite to the mounting surface of a circuit board on which an ultra-high frequency circuit element is attached, a plurality of conductive holes for grounding the ultra-high frequency circuit element are provided on the circuit board, and the ground conductor is provided on the circuit board. An ultra-high frequency circuit characterized by having a gap on the surface, excluding the conductor, in a direction perpendicular to the signal flow.