JPH02131340U - - Google Patents
Info
- Publication number
- JPH02131340U JPH02131340U JP4061889U JP4061889U JPH02131340U JP H02131340 U JPH02131340 U JP H02131340U JP 4061889 U JP4061889 U JP 4061889U JP 4061889 U JP4061889 U JP 4061889U JP H02131340 U JPH02131340 U JP H02131340U
- Authority
- JP
- Japan
- Prior art keywords
- section
- tape
- bonding
- angle correction
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003909 pattern recognition Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案によるＩ／Ｂ装置の一実施例の
動作を示すシーケンス図、第２図はボンデイング
時に、ＩＣのパターン認識を行わないようにする
ための制御回路の一例を示す図、第３図は従来の
Ｉ／Ｂ装置の動作を示すシーケンス図である。
８……リレー、８Ｂ……メーク接点。
FIG. 1 is a sequence diagram showing the operation of an embodiment of an I/B device according to the present invention, FIG. 2 is a diagram showing an example of a control circuit for preventing IC pattern recognition during bonding, and FIG. FIG. 3 is a sequence diagram showing the operation of a conventional I/B device. 8...Relay, 8B...Make contact.
Claims (1)
ＩＣ供給部、ＩＣ角度修正部及びボンデイング部
を有し、 ＩＣの供給、ＩＣの角度修正、ＩＣのパターン
認識、テープの送り、テープの位置決め、テープ
の検出、ボンデイング等の一連の工程が実行され
るインナリードボンデイング装置において、 上記ボンデイング時に、上記ＩＣの角度修正及
びパターン認識を行わないようにしたことを特徴
とするインナリードボンデイング装置。[Scope of utility model registration claim] Tape supply section, tape storage section, tape feeding section,
It has an IC supply section, an IC angle correction section, and a bonding section, and performs a series of processes such as IC supply, IC angle correction, IC pattern recognition, tape feeding, tape positioning, tape detection, and bonding. An inner lead bonding apparatus characterized in that angle correction and pattern recognition of the IC are not performed during the bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040618U JPH0711467Y2 (en) | 1989-04-06 | 1989-04-06 | Inner lead bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040618U JPH0711467Y2 (en) | 1989-04-06 | 1989-04-06 | Inner lead bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02131340U true JPH02131340U (en) | 1990-10-31 |
| JPH0711467Y2 JPH0711467Y2 (en) | 1995-03-15 |
Family
ID=31550559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989040618U Expired - Lifetime JPH0711467Y2 (en) | 1989-04-06 | 1989-04-06 | Inner lead bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711467Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165335A (en) * | 1982-03-26 | 1983-09-30 | Nec Corp | Method and apparatus for manufacturing semiconductor device using tape carrier system |
-
1989
- 1989-04-06 JP JP1989040618U patent/JPH0711467Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165335A (en) * | 1982-03-26 | 1983-09-30 | Nec Corp | Method and apparatus for manufacturing semiconductor device using tape carrier system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0711467Y2 (en) | 1995-03-15 |
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