JPH02129876U - - Google Patents
Info
- Publication number
- JPH02129876U JPH02129876U JP3872989U JP3872989U JPH02129876U JP H02129876 U JPH02129876 U JP H02129876U JP 3872989 U JP3872989 U JP 3872989U JP 3872989 U JP3872989 U JP 3872989U JP H02129876 U JPH02129876 U JP H02129876U
- Authority
- JP
- Japan
- Prior art keywords
- temperature detection
- sockets
- test equipment
- temperature
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 238000000605 extraction Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図ないし第３図はこの考案に係る半導体装
置の温度測定治具の一実施例を示すもので、第１
図は試験装置を示す斜視図、第２図は測定用基板
を示す斜視図、第３図は試験装置のコネクター部
の裏面結線図、第４図は従来の試験装置を示す斜
視図、第５図は従来の測定用基板を示す斜視図で
ある。
図において１は試験装置本体、２はヒーター部
、３は熱風送り込み口、４は熱電対、５は基板ガ
イドレール、６はコネクター、７は試験槽、８は
端子板、９は測定用基板、１０はプリント板、１
１はソケツト、１２はカバー、１３は温度検出素
子、１４は温度検出用ソケツト、１５はピンであ
る。なお、図中、同一符号は同一、又は相当部分
を示す。
1 to 3 show an embodiment of the temperature measuring jig for a semiconductor device according to this invention.
The figure is a perspective view showing the test device, FIG. 2 is a perspective view showing the measurement board, FIG. The figure is a perspective view showing a conventional measurement board. In the figure, 1 is the main body of the test device, 2 is the heater section, 3 is the hot air inlet, 4 is the thermocouple, 5 is the board guide rail, 6 is the connector, 7 is the test chamber, 8 is the terminal board, 9 is the measurement board, 10 is a printed board, 1
1 is a socket, 12 is a cover, 13 is a temperature detection element, 14 is a temperature detection socket, and 15 is a pin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
いて、測定用基板に温度検出用に白金抵抗体など
のセンサーを埋め込んだ温度検出素子取り付け用
ＩＣソケツトを複数個実装し、裏面にソケツト対
応でパターン配線を備え、上記試験装置のコネク
ターと接続し、取り出し端子を設け、必要に応じ
いつでも温度測定が行えるようにしたことと、温
度検出用埋め込み素子を使用したことを特徴とす
る半導体装置の温度測定治具。 In test equipment that tests semiconductor devices at high and low temperatures, multiple IC sockets for mounting temperature detection elements with embedded sensors such as platinum resistors for temperature detection are mounted on the measurement board, and pattern wiring is provided on the back side to accommodate the sockets. A temperature measurement jig for a semiconductor device, which is equipped with a connector of the above test equipment, is provided with an extraction terminal, so that temperature measurement can be performed at any time as needed, and uses an embedded element for temperature detection. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3872989U JPH02129876U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3872989U JPH02129876U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129876U true JPH02129876U (en) | 1990-10-25 |
Family
ID=31547000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3872989U Pending JPH02129876U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007225496A (en) * | 2006-02-24 | 2007-09-06 | Espec Corp | Environmental testing device |
-
1989
- 1989-03-31 JP JP3872989U patent/JPH02129876U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007225496A (en) * | 2006-02-24 | 2007-09-06 | Espec Corp | Environmental testing device |
| JP4554535B2 (en) * | 2006-02-24 | 2010-09-29 | エスペック株式会社 | Environmental test equipment |
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