JPH02129734U - - Google Patents
Info
- Publication number
- JPH02129734U JPH02129734U JP1989038080U JP3808089U JPH02129734U JP H02129734 U JPH02129734 U JP H02129734U JP 1989038080 U JP1989038080 U JP 1989038080U JP 3808089 U JP3808089 U JP 3808089U JP H02129734 U JPH02129734 U JP H02129734U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- main plane
- heat sink
- bonded
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989038080U JPH02129734U (https=) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989038080U JPH02129734U (https=) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129734U true JPH02129734U (https=) | 1990-10-25 |
Family
ID=31545766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989038080U Pending JPH02129734U (https=) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129734U (https=) |
-
1989
- 1989-03-31 JP JP1989038080U patent/JPH02129734U/ja active Pending