JPH02127034U - - Google Patents

Info

Publication number
JPH02127034U
JPH02127034U JP3680789U JP3680789U JPH02127034U JP H02127034 U JPH02127034 U JP H02127034U JP 3680789 U JP3680789 U JP 3680789U JP 3680789 U JP3680789 U JP 3680789U JP H02127034 U JPH02127034 U JP H02127034U
Authority
JP
Japan
Prior art keywords
substrate
chip
conductive
plated
conductive lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3680789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3680789U priority Critical patent/JPH02127034U/ja
Publication of JPH02127034U publication Critical patent/JPH02127034U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP3680789U 1989-03-30 1989-03-30 Pending JPH02127034U (bs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3680789U JPH02127034U (bs) 1989-03-30 1989-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3680789U JPH02127034U (bs) 1989-03-30 1989-03-30

Publications (1)

Publication Number Publication Date
JPH02127034U true JPH02127034U (bs) 1990-10-19

Family

ID=31543364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3680789U Pending JPH02127034U (bs) 1989-03-30 1989-03-30

Country Status (1)

Country Link
JP (1) JPH02127034U (bs)

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPH02127034U (bs)
JPS6237939U (bs)
JPH0268452U (bs)
JPS62134254U (bs)
JPS61153373U (bs)
JPS6413144U (bs)
JPS63187330U (bs)
JPS5842940U (ja) 混成集積回路装置
JPS6192064U (bs)
JPS6247171U (bs)
JPH01166565U (bs)
JPS62166636U (bs)
JPH01125541U (bs)
JPS60118242U (ja) Ｉｃチツプ用パツケ−ジ
JPS63197356U (bs)
JPS59109150U (ja) Ｉｃチツプ用パツケ−ジ
JPS6310571U (bs)
JPS5986095U (ja) 磁気バブルメモリデバイス
JPS62140775U (bs)
JPH03124643U (bs)
JPS63201369U (bs)
JPS6138954U (ja) 半導体装置
JPS5881940U (ja) 半導体素子の取付構造
JPS6066030U (ja) ボンデイング装置