JPH02122639A - Wire bonding apparatus - Google Patents
Wire bonding apparatusInfo
- Publication number
- JPH02122639A JPH02122639A JP63277845A JP27784588A JPH02122639A JP H02122639 A JPH02122639 A JP H02122639A JP 63277845 A JP63277845 A JP 63277845A JP 27784588 A JP27784588 A JP 27784588A JP H02122639 A JPH02122639 A JP H02122639A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- air
- arrow
- tension
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造装置に関し、特に、ワイヤー
ボンディング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device manufacturing apparatus, and particularly to a wire bonding apparatus.
従来、半導体装置（ＩＣ，ＬＳＩ、トランジスタ等）の
半導体チップの電極パッドとリードフレームの内部リー
ドとの接続は金やアルミニウムの細線により接続されて
いる。この接続作業を行なうのがワイヤーボンディング
装置で、作業効率向上のために、インデックス速度ある
いは接続信頼性等ために種々の改善がなされてきた。Conventionally, electrode pads of a semiconductor chip of a semiconductor device (IC, LSI, transistor, etc.) and internal leads of a lead frame have been connected using thin gold or aluminum wires. Wire bonding equipment performs this connection work, and various improvements have been made in order to improve work efficiency, such as indexing speed and connection reliability.
第３図は従来のワイヤーボンディング装置の側面図、第
４図（ａ＞及び（ｂ）は第３図中のＢＢ矢視図である。FIG. 3 is a side view of a conventional wire bonding device, and FIGS. 4 (a> and (b) are views taken along arrow BB in FIG. 3.
ワイヤーボンディング装置の動作を説明すると、まず、
接続ツール２の中心にある穴を通る金属細線（以下ワイ
ヤーと言う）１、例えば、３０μｍ程度の直径をもつア
ルミニウム線の先端をトーチロッド３の放電により溶融
し球状に成形し球状部分１４を作る。このとき、第４図
（ｂ）に示すように、ワイヤー１が供給されないように
、ガイド１２のガイド穴１３を通過したワイヤー１を、
カットクランパ７の両側の突起部１１を、図面には示し
ていないが、電磁ソレノイドで動かして挟み固定する。To explain the operation of wire bonding equipment, first,
The tip of a thin metal wire (hereinafter referred to as wire) 1, for example, an aluminum wire with a diameter of about 30 μm, passing through a hole in the center of the connection tool 2 is melted by the discharge of a torch rod 3 and formed into a spherical shape to form a spherical portion 14. . At this time, as shown in FIG. 4(b), the wire 1 that has passed through the guide hole 13 of the guide 12 is
Although not shown in the drawing, the protrusions 11 on both sides of the cut clamper 7 are moved by an electromagnetic solenoid and clamped and fixed.
次に、接続ツール２を支持するボンディングアーム４を
移動させて、接続ツール２を半導体チ・ツブの電極パッ
ド（図示せず）の上に位置決めする。次に、接続ツール
２を下降させ電極パッドにワイヤー１の球状部分１４を
押つけ圧着する。次に、第４図（ａ＞に示すように、ワ
イヤー１を挟み固定しているカットクランパ７を緩めて
、接続ツール２を上昇させる。この操作により、ワイヤ
ー１は電極パッドにワイヤー１の一端を接続し、他端は
接続ツール２を通してスプール９に巻かれたままの状態
になっている。Next, the bonding arm 4 supporting the connection tool 2 is moved to position the connection tool 2 over the electrode pad (not shown) of the semiconductor chip. Next, the connection tool 2 is lowered to press and press the spherical portion 14 of the wire 1 onto the electrode pad. Next, as shown in FIG. 4 (a), the cut clamper 7 that clamps and fixes the wire 1 is loosened, and the connection tool 2 is raised. Through this operation, the wire 1 is attached to the electrode pad at one end of the wire 1. is connected, and the other end remains wound around the spool 9 through the connection tool 2.
次に、ボンディングアーム４を移動させ、リードフレー
ム（図示せず）の内部リードの溶接すべき位置の上に接
続ツール２を位置決めする。このとき、ワイヤーの弛み
によりワイヤー１が過剰に供給されないように、ワイヤ
ー１を締付けるフェル１−テンション８の摩擦力と、テ
ンション機構１０の二つアーム１５とテンション機構１
０の中央から矢印Ａの方向に直接ワイヤー１に空気を吹
き付けることによりワイヤー１に張力を働かせ、ワイヤ
ー１の弛み防止を行なう。次に、接続ツール２を下降さ
せ、リードフレームの内部リードにワイヤー１を圧着接
続する。次に、第４図（ｂ）に示すように、再び、カッ
トクランパ７でワイヤー１を挟み固定した後、接続ツー
ル２を上昇させる。Next, the bonding arm 4 is moved to position the connection tool 2 over the position where the internal leads of the lead frame (not shown) are to be welded. At this time, in order to prevent the wire 1 from being excessively supplied due to slack in the wire, the friction force between the felt 1 and the tension 8 that tightens the wire 1, and the two arm 15 of the tension mechanism 10 and the tension mechanism 1
By blowing air directly onto the wire 1 from the center of the wire in the direction of arrow A, tension is exerted on the wire 1 to prevent the wire 1 from loosening. Next, the connection tool 2 is lowered and the wire 1 is crimped and connected to the internal lead of the lead frame. Next, as shown in FIG. 4(b), the wire 1 is again clamped and fixed by the cut clamper 7, and then the connection tool 2 is raised.
この接続ツール２の上昇力によりワイヤー１の接続端と
カットクランパ７により固定された部分との間に張力を
働かせることにより、溶接端付近でワイヤー１を切断す
る。ここまでの動作により、一つの電極パッドとリード
フレームの一つの内部リードとをワイヤーで接続したこ
とになる。再び、ｌ・−チロラド３の放電によりワイヤ
ー１の先端を球状に成形する。この一連の操作を複数回
繰り返して複数個の電極パッドとリードフレームの内部
リートとをワイヤー１で接続して配線接続作業を完了す
る。By exerting tension between the connecting end of the wire 1 and the portion fixed by the cut clamper 7 by the rising force of the connecting tool 2, the wire 1 is cut near the welding end. Through the operations up to this point, one electrode pad and one internal lead of the lead frame have been connected with a wire. Again, the tip of the wire 1 is shaped into a spherical shape by discharging the l·-tyrorad 3. This series of operations is repeated a plurality of times to connect the plurality of electrode pads and the internal lead of the lead frame with the wire 1, thereby completing the wiring connection work.
上述したワイヤーボンディング装置では、テンションＦ
Ｒ横のワイヤー１に対する空気の吹き付ける方向及び空
気の当る量が常に一定せず、不安定であるため、ワイヤ
ー１の引張力が変動する。ときには、空気がワイヤー１
に充分当らず、操作中に弛むことがしばしば起きる。こ
の弛みがワイヤー１の過剰供給をさせ、電極パッドとリ
ードフレームの内部リードとを接続するワイヤーに弛み
を引起し、この弛んだワイヤーが他の電極やワイヤーに
接触するという問題がある。In the wire bonding device described above, the tension F
Since the direction of air blowing and the amount of air hitting the wire 1 on the R side are not always constant and unstable, the tensile force of the wire 1 fluctuates. Sometimes the air is wire 1
It often happens that the bolts do not hit sufficiently and come loose during operation. This slack causes an oversupply of the wire 1, causing slack in the wire connecting the electrode pad and the internal lead of the lead frame, and there is a problem that the slack wire comes into contact with other electrodes or wires.
本発明の目的は、半導体チップの電極パッドとＪ−ドフ
レームの内部フレームとを接続するワイヤーに過剰な弛
みを引起さない接続作業が行ない得るワイヤーボンディ
ング装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a wire bonding device that can perform a connection operation that does not cause excessive slack in the wires that connect the electrode pads of a semiconductor chip and the internal frame of a J-frame.
本発明のワイヤーボンディング装置は、半導体装置の電
極パッドとリードフレームとを金属細線で接続を行なう
ワイヤーボンディング装置において、前記金属細線を供
給する細孔を有し、前記細孔の出入り口が互いに向き合
うテーパ状に形成され且つ前記部材の前記金属細線の出
口の外周囲がテーパ状に形成される第１の部材と、前記
第１の部材の内部形状と類似の内部形状に形成され且つ
前記第１の部材の前記細孔より大きい細孔を有する第２
の部材と、前記両部材を所定の間隔をもって前記両部材
の外周囲を包んで固定する外郭部材と、前記外郭部材の
外周囲にあって前記両部材でなる前記間隔の空間に連な
る圧縮空気口が形成されてなるテンション機構を有し、
前記テンション機構が前記金属細線を巻き付けられたス
プールの後段に位置する前記金属細線締付は機構とカッ
トクランパとの間に配置されることを含んで構成される
。The wire bonding device of the present invention is a wire bonding device for connecting an electrode pad of a semiconductor device and a lead frame with a thin metal wire, and the wire bonding device has a pore for supplying the thin metal wire, and the opening and exit of the pore are tapered so as to face each other. a first member having a tapered outer periphery at the outlet of the thin metal wire; a second member having pores larger than the pores of the member;
an outer shell member that wraps and fixes the outer circumferences of the two members at a predetermined interval, and a compressed air port that is located on the outer circumference of the outer shell member and connects to the space between the two members. It has a tension mechanism formed by
The tension mechanism is located downstream of the spool around which the thin metal wire is wound, and the thin metal wire tightening mechanism is disposed between the mechanism and the cut clamper.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示すワイヤーボンディング
装置の側面図、第２図はテンション機構のノズルの断面
図である。このワイヤーボンディング装置は、テンショ
ン機構１０を除いたスプール９、フェルトテンション８
、カットクランパ７、ホンディングアーム４及び接続ツ
ール２は従来例と同じである。第２図に示すように、テ
ンション機構１０はノズル５とそれに接続する空気供給
管１６及び空気流量を調節するバルブ６から構成されて
いる。まず、フェルトテンション８のワイヤー１を締付
けるときの摩擦力より小さい程度の張力が生ずる程度に
、外部から供給する空気流量をバルブ６を調整しノズル
５に圧縮空気を供給して、フェルトテンション８とノズ
ル５間のワイヤー１の弛みを一定にする。次に、ノズル
５の構造を説明すると、第２図に示すように、ノズル５
は中央にワイヤー１よりやや大きめの細孔２４が貫通し
ており、この細孔２４はワイヤーの直径より１０〜６０
μｍ大きい直径で開けられている。ワイヤー１の供給側
すなわちフェルＩ・テンション８側に大きな口径をもつ
テーバ状の第１の吸気孔１７をもち、逆側にはより小い
さめの口径をもつテーバ状の吹き出し口１つをもってい
る。また、ノズル５の外郭筒２０中夫の側面には、空気
入口管１６が取付けられており、ノズル５の外郭筒２０
の内側に接するように形成された溝２１に通じている。FIG. 1 is a side view of a wire bonding apparatus showing an embodiment of the present invention, and FIG. 2 is a sectional view of a nozzle of a tension mechanism. This wire bonding device includes a spool 9 excluding a tension mechanism 10, a felt tension 8
, cut clamper 7, honding arm 4, and connection tool 2 are the same as in the conventional example. As shown in FIG. 2, the tension mechanism 10 includes a nozzle 5, an air supply pipe 16 connected thereto, and a valve 6 for adjusting the air flow rate. First, compressed air is supplied to the nozzle 5 by adjusting the flow rate of air supplied from the outside to an extent that generates a tension smaller than the frictional force when tightening the wire 1 of the felt tension 8. The slack of the wire 1 between the nozzles 5 is made constant. Next, to explain the structure of the nozzle 5, as shown in FIG.
A pore 24, which is slightly larger than the wire 1, passes through the center, and this pore 24 is 10 to 60 mm larger than the wire diameter.
It is opened with a diameter larger than μm. A tapered first intake hole 17 with a large diameter is provided on the supply side of the wire 1, that is, the Fell I/Tension 8 side, and one tapered air outlet with a smaller diameter is provided on the opposite side. Further, an air inlet pipe 16 is attached to the side surface of the inner tube of the outer tube 20 of the nozzle 5.
It communicates with a groove 21 formed so as to be in contact with the inside of the .
満２１の一端はノズル５の中央に位置するテーバ状の排
気口１８の側壁と連なり、他端は第２の吸気口２２の側
壁に連なるように形成されている９次に、ノズル５の作
用を説明すると、まず、空気入口管１６より圧縮空気を
導入すると、空気の流れは矢印Ｃから満２１を通り、矢
印りの方向に流れ、細孔２４よりやや大きめの穴２３を
矢印Ｅの方向に流れて吹き出し口１９に排出される。空
気が矢印Ｃから矢印Ｅに流れることにより、第１の吸気
孔１７と吹き出し口１つとの間に圧力差が生じ、空気は
矢印Ｆの方向に導入され、導入された空気は、細孔２４
を通り、排気口１８を抜けて、矢印Ｃからの空気と合流
して吹き出し口１９に排出される。この空気の流体抵抗
によりワイヤー１は常に空気の流れの方向に一定の力で
引張られるのて′、ノズル５によりフェルトエンジョン
８と１妾続ツール２との間のワイヤー１は常に一定の引
張力で張られていることになる。One end of the filler 21 is connected to the side wall of the tapered exhaust port 18 located at the center of the nozzle 5, and the other end is connected to the side wall of the second intake port 22. To explain this, first, when compressed air is introduced from the air inlet pipe 16, the air flows from arrow C, passes through 21, flows in the direction of the arrow, and passes through the hole 23, which is slightly larger than the pore 24, in the direction of arrow E. and is discharged to the air outlet 19. As the air flows from arrow C to arrow E, a pressure difference is created between the first intake hole 17 and one outlet, and the air is introduced in the direction of arrow F, and the introduced air flows through the small hole 24.
, passes through the exhaust port 18 , merges with the air from arrow C, and is discharged to the air outlet 19 . Due to the fluid resistance of the air, the wire 1 is always pulled with a constant force in the direction of the air flow. It will be stretched by force.
以上説明したように本発明のワイヤーボンディング装置
は、ワイヤー給出するスプールとワイヤーを接続固定す
る接続ツール間に、ワイヤーに一定の流体抵抗力による
引張力を与えるテンション機構を設けて、ワイヤーの弛
みをなくすことが出来るので、半導体チップの電極パッ
ドとリードフレームの内部リードの接続線に過剰な弛み
起さないで配線接続出来るワイヤーボンディング装置が
得られるという効果がある。As explained above, the wire bonding device of the present invention is provided with a tension mechanism that applies a tensile force to the wire due to a certain fluid resistance force between the spool that feeds the wire and the connection tool that connects and fixes the wire. This has the effect of providing a wire bonding device that can connect the electrode pads of the semiconductor chip and the internal leads of the lead frame without causing excessive slack in the connection wires.
第１図は本発明の一実施例を示すワイヤーボンディング
装置の側面図、第２図はテンション機構のノズルの断面
図、第３図は従来のワイヤー給出シｉ メ図
第２図
躬５０
（ａ）
（ｂ）
第４図
手
続
補正
書
方
式
％式％
１ 事件の表示 昭和６３年特許願第２７７８４５号２
、発明の名称 ワイヤーボンディング装置３、補正をす
る者
事件との関係 出 願 人使 所
熊本県熊本市へ幡町１００番地名 称 九州日
本電気株式会社代表者 中 村 秀Fig. 1 is a side view of a wire bonding device showing an embodiment of the present invention, Fig. 2 is a sectional view of a nozzle of a tension mechanism, and Fig. 3 is a diagram of a conventional wire feeding system. a) (b) Figure 4 Procedural Amendment Form % Formula % 1 Indication of Case Patent Application No. 277845 of 1988 2
, Title of the invention Wire bonding device 3, Relationship with the case of the person making the amendment Application Embassy
To Kumamoto City, Kumamoto Prefecture 100 Hatacho Name Name Kyushu NEC Co., Ltd. Representative Hide Nakamura
Claims (1)
線で接続を行なうワイヤーボンディング装置において、
前記金属細線を供給する細孔を有し、前記細孔の出入り
口が互いに向き合うテーパ状に形成され且つ前記部材の
前記金属細線の出口の外周囲がテーパ状に形成される第
１の部材と、前記第１の部材の内部形状と類似の内部形
状に形成され且つ前記第１の部材の前記細孔より大きい
細孔を有する第２の部材と、前記両部材を所定の間隔を
もつて前記両部材の外周囲を包んで固定する外郭部材と
、前記外郭部材の外周囲にあって前記両部材でなる前記
間隔の空間に連なる圧縮空気口が形成されてなるテンシ
ョン機構を有し、前記テンション機構が前記金属細線を
巻き付けられたスプールの前段に位置する前記金属細線
締付け機構とカットクランパとの間に配置されることを
特徴とするワイヤーボンディング装置。In wire bonding equipment that connects electrode pads and lead frames of semiconductor devices with thin metal wires,
a first member having a pore for supplying the thin metal wire, the entrance and exit of the pore are formed in a tapered shape facing each other, and the outer periphery of the outlet of the thin metal wire of the member is formed in a tapered shape; a second member having an internal shape similar to the internal shape of the first member and having pores larger than the pores of the first member; The tension mechanism includes an outer shell member that wraps around and fixes the outer circumference of the member, and a compressed air port that is formed on the outer circumference of the outer shell member and that connects to the space between the two members, the tension mechanism. is arranged between the thin metal wire tightening mechanism and the cut clamper, which are located upstream of the spool around which the thin metal wire is wound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277845A JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277845A JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122639A true JPH02122639A (en) | 1990-05-10 |
| JP2617541B2 JP2617541B2 (en) | 1997-06-04 |
Family
ID=17589070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63277845A Expired - Lifetime JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2617541B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6619530B2 (en) * | 2000-09-07 | 2003-09-16 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
| CN102630338A (en) * | 2009-12-25 | 2012-08-08 | Adamant工业株式会社 | Air tension apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002064118A (en) | 2000-08-22 | 2002-02-28 | Shinkawa Ltd | Wire bonding apparatus |
-
1988
- 1988-11-01 JP JP63277845A patent/JP2617541B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6619530B2 (en) * | 2000-09-07 | 2003-09-16 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
| CN102630338A (en) * | 2009-12-25 | 2012-08-08 | Adamant工业株式会社 | Air tension apparatus |
| JP5750644B2 (en) * | 2009-12-25 | 2015-07-22 | アダマンド株式会社 | Air tension device |
| CN102630338B (en) * | 2009-12-25 | 2015-08-19 | Adamant工业株式会社 | Air tension device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2617541B2 (en) | 1997-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4700633B2 (en) | Wire cleaning guide | |
| KR100412110B1 (en) | Wire bonding apparatus | |
| JPH07335688A (en) | Ball bonding method of improved capillary and fine pitch | |
| US20060091181A1 (en) | Wire tensioner for a wire bonder | |
| JPH02122639A (en) | Wire bonding apparatus | |
| JPH0225044A (en) | Oxidization-proof system for wire bonder | |
| US6520400B2 (en) | Wire tensioning apparatus | |
| JP3260531B2 (en) | Extra fine wire tension generator by air | |
| JPS6015938A (en) | Wire bonding device | |
| JP3503700B2 (en) | Air tension device for wire bonder | |
| JPS61229776A (en) | Fine wire feeding device | |
| JPS6141231Y2 (en) | ||
| JPH0310228B2 (en) | ||
| JP4760736B2 (en) | Wire bonding method and wire bonding apparatus | |
| KR20060004299A (en) | Wire bonder | |
| JP2586679B2 (en) | Wire bonding method | |
| JPH0320900B2 (en) | ||
| JPH0245943A (en) | Wire-bonding method and wire-bonding device | |
| JPH03273651A (en) | Joining method of resin-coated bonding small-gage wire with semiconductor device | |
| JP2559539B2 (en) | Bonding device | |
| JPH0917817A (en) | Semiconductor manufacture and device | |
| KR20000002376A (en) | A wire bonding device having a anion generator | |
| KR100309129B1 (en) | Wire bonding apparatus and bonding method using the same | |
| KR19990038224A (en) | Wire supply device for wire bonding process of semiconductor package | |
| JPH0737889A (en) | Semiconductor manufacturing device |