JPS6015938A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS6015938A JPS6015938A JP58123278A JP12327883A JPS6015938A JP S6015938 A JPS6015938 A JP S6015938A JP 58123278 A JP58123278 A JP 58123278A JP 12327883 A JP12327883 A JP 12327883A JP S6015938 A JPS6015938 A JP S6015938A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- capillary
- force
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
- H01L2224/78631—Means for wire tension adjustments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 ［技術分野］ 本発明は、ワイヤボンディング技術に関する。[Detailed description of the invention] [Technical field] The present invention relates to wire bonding technology.
［背景技術］
半導体装置の製造において、集積回路（ＩＣ）や大規模
集積回路（ＬＳＩ）等が形成されたベレットの電極パッ
ドを外部引出し用リードに電気的に接続する場合、ワイ
ヤボンディング装置を使用することが考えられる。[Background Art] In the manufacture of semiconductor devices, wire bonding equipment is used to electrically connect electrode pads of pellets on which integrated circuits (ICs), large-scale integrated circuits (LSIs), etc. are formed to external leads. It is possible to do so.
このようなワイヤボンディング装置において、電極パッ
ドとリードとの間に架橋されるボンディングワイヤのア
ーチ形状を適正に、かつばらつきなく安定に形成するた
めに、ワイヤにエアを富時吹き付けて走行路から膨出さ
せ、ワイヤにバックテンションを与える技術が知られて
いる（たとえば、特公昭５３−１０４２５号公報）。In such wire bonding equipment, in order to properly and stably form the arch shape of the bonding wire bridged between the electrode pad and the lead without any variation, air is frequently blown onto the wire to cause it to bulge out from the running path. A technique is known in which back tension is applied to the wire by causing the wire to come out (for example, Japanese Patent Publication No. 10425/1983).
しかし、かかる技術にあっては、ワイヤ切断後、エア吹
き付は力とワイヤのクランプ力との関係によりワイヤが
ボンディングツールから引き戻される場合があるため、
ワイヤのボンディングツールからの突出長さくテール長
さ）にばらつきが発生し、ボール成形のための放電不発
事故、ボール不成形によるワイヤの抜は事故が発生する
という問題点があることが、本発明者によって明らかに
された。However, with this technique, after the wire is cut, the wire may be pulled back from the bonding tool due to the relationship between the air blowing force and the clamping force of the wire.
The present invention solves the problem that variations occur in the protruding length (length (tail length) of the wire from the bonding tool), resulting in misfire accidents for ball forming, and accidents when the wire is pulled out due to ball non-forming. revealed by.
［発明の目的］
本発明の目的は、ワイヤの引き戻しを防止することがで
きるワイヤボンディング技術を提供することにある。[Object of the Invention] An object of the present invention is to provide a wire bonding technique that can prevent the wire from being pulled back.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
［発明の概要］
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.
すなわち、ワイヤに側方から力を付勢して、ワイヤに摩
擦が生じるようにしてバックテンションを与え、しかも
、ワイヤに引き戻し力を与えないようにしたものである
。That is, a force is applied to the wire from the side to create friction on the wire to provide back tension, but no pullback force is applied to the wire.
［実施例１］
第１図は本発明の一実施例である熱圧着式ワイヤボンデ
ィング装置（以下、ＮＴＣボンダという。[Example 1] FIG. 1 shows a thermocompression type wire bonding apparatus (hereinafter referred to as NTC bonder) which is an example of the present invention.
）を示す概略正面図、第２図はその拡大部分断面図であ
る。), and FIG. 2 is an enlarged partial sectional view thereof.
本実施例において、このＮＴＣボンダは、ボンディング
を実行するためのボンディングツールとしてのキャピラ
リ１を備えており、このキャピラリ１は、ボンディング
ステージ２上に保持された被ボンデイング体としての半
導体装置（以下、ＩＣという。）３に対し少なくともＸ
ＹＺ方向に相対移動するように構成されている。キャピ
ラリ１には、リール４にも巻装された金線（Ａｕ線）等
のワイヤ５が挿通され、ワイヤ５は必要時送給されるよ
うになっている。キャピラリ１の先方にはトーチ６が近
接して配設され、このトーチ６はワイヤ先端部を溶融さ
せることによりボールを適時作り出し得るように構成さ
れている。ボンディングツールであるキャピラリ１の上
方には、適時開閉動作されるクランパ７が配設され、こ
のクランパ７は閉成状態においてワイヤ５の中間部をク
ラップし得るように構成されている。In this embodiment, this NTC bonder is equipped with a capillary 1 as a bonding tool for performing bonding, and this capillary 1 is connected to a semiconductor device (hereinafter referred to as a bonding object) held on a bonding stage 2 as a bonding object. (referred to as IC) at least X for 3
It is configured to move relatively in the YZ direction. A wire 5 such as a gold wire (Au wire), which is also wound on a reel 4, is inserted through the capillary 1, and the wire 5 is fed when necessary. A torch 6 is disposed close to the tip of the capillary 1, and the torch 6 is configured to melt the tip of the wire to produce a ball at any time. A clamper 7, which is opened and closed at appropriate times, is disposed above the capillary 1, which is a bonding tool, and is configured to clamp the intermediate portion of the wire 5 in the closed state.
クランパ７の上方には挿通孔を有する部材であるガイド
８が配設され、このガイド８は第２図に示されるように
構成されている。このガイド８のほぼ中心線上には、ワ
イヤ５を挿通されて案内する挿通孔９が形成され、この
挿通孔９の内周面には複数の吸引口１０がワイヤ５の走
行方向に配列されて開設されている。A guide 8, which is a member having an insertion hole, is disposed above the clamper 7, and this guide 8 is constructed as shown in FIG. An insertion hole 9 through which the wire 5 is inserted and guided is formed approximately on the center line of the guide 8, and a plurality of suction ports 10 are arranged on the inner peripheral surface of the insertion hole 9 in the running direction of the wire 5. It has been established.
各吸引口１０には負圧ポンプ等の負圧発生装置（図示せ
ず）に連通された負圧供給路１１がそれぞれ接続されて
挿通孔に連通ずる通気管を形成している。前記吸引口１
０はワイヤ５に直角な吸引力を付勢してワイヤ５を挿通
孔９の内面の一部である摩擦面１２に接触させ得るよう
に構成されている。Each suction port 10 is connected to a negative pressure supply path 11 connected to a negative pressure generating device (not shown) such as a negative pressure pump, thereby forming a ventilation pipe communicating with the insertion hole. The suction port 1
0 is configured to apply a suction force perpendicular to the wire 5 to bring the wire 5 into contact with a friction surface 12 that is a part of the inner surface of the insertion hole 9 .
次に作用を説明する。Next, the action will be explained.
前記構成にがかるＮＴＣボンダにおいて、ＩＣ３のペレ
ット上に第１ボンディング部１３が形成されると、キャ
ピラリｌは第１ボンディング部１３に対し三次元的に相
対移動され、ＩＣ３のり−ド上における所定の第２ボン
ディング位置に移行される。このキャピラリ１の相対移
動により、ボンディングワイヤ１４において、第１図に
示されるようなアーチ形状が作り出される。このとき、
ワイヤ５に対するバックテンションが不安定であると、
キャピラリ１をワイヤ５との相関関係にばらつきが発生
され、アーチ形状が高すぎたり、低すぎたりすることに
なる。In the NTC bonder having the above configuration, when the first bonding part 13 is formed on the pellet of IC3, the capillary l is moved three-dimensionally relative to the first bonding part 13, and the capillary l is moved to a predetermined position on the IC3 glue. Transferred to a second bonding position. This relative movement of the capillary 1 creates an arch shape in the bonding wire 14 as shown in FIG. At this time,
If the back tension on the wire 5 is unstable,
Variations occur in the correlation between the capillary 1 and the wire 5, resulting in the arch shape being too high or too low.
キャピラリ１の相対移動中、ワイヤ５はガイド８におい
て吸引付勢力により摩擦面１２に接触されている。この
接触により、ワイヤ５に摩擦力が作用されてキャピラリ
１に対して相対的なハ・ツクテンションが与えられる。During the relative movement of the capillary 1, the wire 5 is brought into contact with the friction surface 12 in the guide 8 due to the suction biasing force. Due to this contact, a frictional force is applied to the wire 5 and a tension relative to the capillary 1 is applied.
この摩擦力は、ワイヤ５に対する直圧力、すなわち、吸
引付勢力と、摩擦面１２およびワイヤ５間の摩擦係数の
みに依存する。したがって、吸引付勢力が一定に制御さ
れれば、ハ・７クテンシヨンはばらつきなく殆ど一定に
なる。なお、ガイド８の摩擦面１２については、摩擦係
数とともにワイヤ５を汚染しない材質で形成され、かつ
耐摩耗性を考慮することが望ましい。This friction force depends only on the direct pressure on the wire 5, that is, the suction biasing force, and the friction coefficient between the friction surface 12 and the wire 5. Therefore, if the suction biasing force is controlled to be constant, the C.7 tension will be almost constant without variation. The friction surface 12 of the guide 8 is desirably made of a material that does not contaminate the wire 5 as well as its friction coefficient, and is desirably wear-resistant.
このようにして、ワイヤ５のキャピラリ１との相対的な
ハックテンションがばらつきなく安定であると、ボンデ
ィングワイヤ１４におけるアーチ形状が高すぎたり、低
すぎたりすることはなく、所定のアーチ形状がばらつき
なく常に安定に形成されることになる。In this way, if the hack tension of the wire 5 relative to the capillary 1 is stable without variations, the arch shape of the bonding wire 14 will not be too high or too low, and the predetermined arch shape will not vary. Therefore, it is always formed stably.
ＩＣ３のリード上にキャピラリ１が位置されると、キャ
ピラリ１によりワイヤ５がＩＣ３のリード上に熱圧着さ
れ、第２ボンディング部１５が形成される。When the capillary 1 is positioned on the lead of the IC 3, the wire 5 is thermocompressed onto the lead of the IC 3 by the capillary 1, and a second bonding portion 15 is formed.
第２ボンディング部１５が形成された後、クランパ７に
よりワイヤ５がクランプされ、この状態で、クランパ７
が第２ボンディング部１５に対し相対的に離間され、ワ
イヤ５は第２ボンデイング１５とのイク］げ根において
引きちぎられるように切断される。After the second bonding part 15 is formed, the wire 5 is clamped by the clamper 7, and in this state, the clamper 7
is spaced apart from the second bonding part 15, and the wire 5 is cut so as to be torn off at the point where it meets the second bonding part 15.
ワイヤ切断後、キャピラリ１からワイヤ５の先端部が突
出した状態となるが、この突出長さにより第１ボンデイ
ング用のボールの容積が決定されるため、この突出長さ
はばらつきなく一定に形成される必要がある。After the wire is cut, the tip of the wire 5 protrudes from the capillary 1, but since the length of this protrusion determines the volume of the first bonding ball, the length of the protrusion remains constant without variation. It is necessary to
た−とえば、ワイヤ５にエアを吹き付けてワイヤ５を脹
らませてワイヤ５にバンクテンションを与えた場合、ワ
イヤ５には引き戻し力が加わるため、クランパ７の挟持
力の変動に追従して、この引き戻し力によりワイヤ５が
クランパ７に対して摺動されることがあり、その結果、
ワイヤ５がキャピラリ１に対して引き戻され、ワイヤ５
のキャピラリ１からの突出長さにばらつきが発生してし
まう。For example, if a bank tension is applied to the wire 5 by blowing air onto the wire 5 to inflate the wire 5, a pullback force is applied to the wire 5, so that the wire 5 follows fluctuations in the clamping force of the clamper 7. , the wire 5 may be slid against the clamper 7 due to this pullback force, and as a result,
The wire 5 is pulled back against the capillary 1, and the wire 5
This causes variations in the length of the protrusion from the capillary 1.
本実施例において、ワイヤ５は吸引付勢力により摩擦面
１２に押し付けられているが、ワイヤ５の長さ方向には
付勢力が作用されない。すなわち、ワイヤ５には引き戻
し力が加わらないため、クランパ７の挟持力の変動にか
かわらず、ワイヤ５がクランパ７に対して摺動される現
象は全くない。In this embodiment, the wire 5 is pressed against the friction surface 12 by an attractive urging force, but no urging force is applied in the length direction of the wire 5. That is, since no pulling force is applied to the wire 5, there is no phenomenon in which the wire 5 slides with respect to the clamper 7, regardless of fluctuations in the clamping force of the clamper 7.
その結果、ワイヤ５がキャピラリ１に対して引き戻され
る危険も皆無であるため、ワイヤ５のキャピラリ１から
の突出長さにばらつきが発生する事態も皆無である。As a result, there is no danger that the wire 5 will be pulled back to the capillary 1, and therefore there will be no variation in the length of the wire 5 protruding from the capillary 1.
このようにして、ワイヤ５のキャピラリｌがらの突出長
さが安定であるため、トーチ６とワイヤ５とのギヤツブ
も一定となり、放電は席に確実に実行され、かつ放電に
より生成されるボールの大きさも常に一定になる。In this way, since the protruding length of the capillary l of the wire 5 is stable, the gear between the torch 6 and the wire 5 is also constant, and the discharge is reliably carried out at the seat, and the ball generated by the discharge is The size will always remain constant.
ボールが生成された後、キャピラリ１が下降するとき、
ワイヤ５にはガイド８の摩擦面１２において摩擦力が作
用されているため、ワイヤ５はキャピラリ１に対し相対
的に引き戻され、これにより、ボールはキャピラリエの
開先部に適正に当接される。このとき、前述したように
、ボールは常に確実に生成されているので、ワイヤ５が
キャピラリ１内に引き込まれることばない。After the ball is generated, when capillary 1 descends,
Since a frictional force is applied to the wire 5 at the friction surface 12 of the guide 8, the wire 5 is pulled back relative to the capillary 1, so that the ball properly contacts the groove of the capillary. . At this time, as described above, the wire 5 is never drawn into the capillary 1 because the ball is always generated reliably.
下降されたキャピラリ１によりＩＣ３のペレットの電極
バッドにワイヤ５のボールが熱圧着され、第１ボンディ
ング部１３が形成される。このとき、ボールの大きさが
常に一定に生成されているため、第１ボンディング部１
３の品質はばらつきな（常に一定になり、信頼性が向上
する。The ball of the wire 5 is thermocompression bonded to the electrode pad of the pellet of the IC 3 by the lowered capillary 1, thereby forming the first bonding portion 13. At this time, since the size of the ball is always constant, the first bonding part 1
The quality of 3 is variable (always constant, improving reliability).
［実施例２］
第３図は本発明の他の実施例を示す拡大部分断面図であ
る。[Embodiment 2] FIG. 3 is an enlarged partial sectional view showing another embodiment of the present invention.
本実施例において、キャピラリ１の上方には挿通孔を有
する部材であるガイド８Ａがクランパ７を介設されて設
けられており、このガイド８Ａのほぼ中心線上には、ワ
イヤ５を挿通されて案内する挿通孔９Ａが形成されてい
る。この挿通孔９Ａの内周面には複数の吹出口１６がワ
イヤ５の走行方向に配列されて開設され、各吹出口１６
にはエアポンプ等の正圧エア発生装置（図示せず）に連
通されたエア供給路１７がそれぞれ接続されている。挿
通孔９Ａの吹出口１６との対向面には複数の排出孔１８
が各吹出口に対向するように配設されており、吹出口１
６、エア供給路１７とで通気管を形成している。In this embodiment, a guide 8A, which is a member having an insertion hole, is provided above the capillary 1 with a clamper 7 interposed therebetween, and a wire 5 is inserted and guided approximately on the center line of the guide 8A. An insertion hole 9A is formed. A plurality of air outlets 16 are arranged in the running direction of the wire 5 and opened on the inner circumferential surface of this insertion hole 9A, and each air outlet 16
An air supply path 17 that communicates with a positive pressure air generator (not shown) such as an air pump is connected to each of the air pumps. A plurality of discharge holes 18 are provided on the surface of the insertion hole 9A facing the air outlet 16.
are arranged so as to face each outlet, and the outlet 1
6 and the air supply path 17 form a ventilation pipe.
次に作用を説明する。Next, the action will be explained.
吹出口１６からエアが吹き出されてワイヤ５に吹き付け
られると、ワイヤ５ばその吹き付は力により挿通孔９Ａ
の一部である摩擦面１２Ａに押し付けられる。これによ
り、ワイヤ５には摩擦力が作用され、この摩擦力がワイ
ヤ５のキャピラリ１に対する相対的なバックテンション
になる。このハックテンションにより、ボンディングワ
イヤにおけるアーチ形状は常に適正に作り出されること
になる。When air is blown out from the air outlet 16 and blown onto the wire 5, the force of the air blown onto the wire 5 causes the air to flow through the insertion hole 9A.
is pressed against the friction surface 12A, which is a part of the As a result, a frictional force is applied to the wire 5, and this frictional force becomes a back tension of the wire 5 relative to the capillary 1. This hack tension ensures that the arch shape in the bonding wire is always properly created.
この摩擦力によるパンクテンションはワイヤ５に対して
引き戻し力を付勢するものではないので、ワイヤ５がキ
ャピラリ１に対して引き戻されることばない。したがっ
て、ワイヤ切断後、ワイヤ５が引き戻されることによっ
て起こるワイヤのキャピラリー先端からの突出長さのば
らつき現象は、防止される。Since the puncture tension caused by this frictional force does not apply a pulling force to the wire 5, the wire 5 is not pulled back to the capillary 1. Therefore, a phenomenon in which the length of the wire protruding from the capillary tip varies due to the wire 5 being pulled back after the wire is cut is prevented.
［効果］
（１）、ワイヤに側方から力を付勢してワイヤを摩擦面
に接触させることにより、ワイヤにＦＩＪｔｑ力を作用
させることができるため、ワイヤの工具に対する相対的
なバックテンションを得ることができる。[Effects] (1) By applying force to the wire from the side and bringing the wire into contact with the friction surface, it is possible to apply FIJtq force to the wire, which reduces the back tension of the wire relative to the tool. Obtainable.
（２）、ワイヤに直角力を付勢してワイヤに摩擦力を作
用させることにより、ワイヤには長さ方向の引き戻し力
が作用しないため、ワイヤが工具に対し引き込まれる現
象を防止することができ、ワイヤの工具からの突出長さ
のばらつきの発生が防止できる。(2) By applying a perpendicular force to the wire and applying a frictional force to the wire, no pullback force is applied to the wire in the length direction, so it is possible to prevent the wire from being pulled into the tool. This makes it possible to prevent variations in the length of the wire protruding from the tool.
（３）、ワイヤ突出長さのばらつきが防止されることに
より、ボンディング化の変動、放電不発事故、ボーイレ
不成形等が防止できるため、ボンディング品質および信
頼性が向上でき、またワイヤ抜は事故の回避によって稼
動率が向上できる。(3) By preventing variations in the wire protrusion length, it is possible to prevent variations in bonding, discharge misfire accidents, and non-forming due to boiling, thereby improving bonding quality and reliability. Availability can be improved through avoidance.
（４）、吸引力および流体吹き付は力でワイヤを付勢す
ることにより、機械的外力のように物体がワイヤに接触
することなく、物体非接触にてワイヤを摩擦面に接触さ
せることができる。(4) By urging the wire with force, suction force and fluid spraying make it possible to bring the wire into contact with the friction surface without the object coming into contact with the wire, unlike mechanical external force. can.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.
たとえば、直角付勢力は吸引力、吹付力に限らず、機械
的外力でもよいし、磁力等でもよい。また吹付流体はエ
アに限定されない。For example, the right angle biasing force is not limited to an attractive force or a blowing force, but may be an external mechanical force, a magnetic force, or the like. Moreover, the spraying fluid is not limited to air.
また、直角に付勢することに限定されず、適当なかたむ
きをもってワイヤに付勢してもよい。Further, the wire is not limited to being biased at right angles, but may be biased with an appropriate angle.
［利用分野］
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である熱圧着式ワイヤボン
ディング装置に適用した場合について説明したが、それ
に限定されるものではなく、たとえば、サーモソニック
式ポンダ、超音波式ポンダ等にも適用できる。[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to a thermocompression type wire bonding device, which is the field of application that formed the background of the invention, but the invention is not limited to this, and for example, , thermosonic type ponder, ultrasonic type ponder, etc.
第１図は本発明の一実施例を示す概略正面図、第２図は
その拡大部分断面図、
第３図は本発明の他の実施例を示す拡大部分断面図であ
る。
１・・・キャピラリ （ボンディングツール）、２・・
・ボンディングステージ、３・・・ＩＣ。
４・・・リール、５・・・ワイヤ、６・・・トーチ、７
・・・クランパ、８，８Ａ・・・ガイド、９．９Ａ・・
・挿通孔、１０・・・吸引口、１１・・・負圧供給路、
１２．１２Ａ・・・摩擦面、１３・・・第１ボンディン
グ部、１４・・・ボンディングワイヤ、１５・・・第２
ボンディング部、１６・・・吹出口、１７・・・エア供
給路、１８・・・排気口。FIG. 1 is a schematic front view showing one embodiment of the present invention, FIG. 2 is an enlarged partial sectional view thereof, and FIG. 3 is an enlarged partial sectional view showing another embodiment of the invention. 1... Capillary (bonding tool), 2...
・Bonding stage, 3...IC. 4... Reel, 5... Wire, 6... Torch, 7
... Clamper, 8,8A... Guide, 9.9A...
・Insertion hole, 10... Suction port, 11... Negative pressure supply path,
12.12A...Friction surface, 13...First bonding part, 14...Bonding wire, 15...Second
Bonding part, 16... Air outlet, 17... Air supply path, 18... Exhaust port.
Claims (1)
しうるクランパと、ボンディングツールを有するワイヤ
ボンディング装置において、前記スプールとクランパ間
にワイヤ挿通孔を有する部材を設け、前記部材には挿通
孔が設けられ、その挿通孔に連通する通気管が取り付け
られていることを特徴とするワイヤボンディング装置。 ２、前記部材の挿通孔に挿通しているワイヤを、通気管
から真空吸引することにより、ワイヤが挿通孔の壁面と
接触するようにしたことを特徴とする特許請求の範囲第
１項記載のワイヤボンディング装置。 ３、前記部材の挿通孔に挿通しているワイヤを、通気管
からガスを吹き付けることにより、ワイヤが挿通孔の壁
面と接触するようにしたことを特徴とする特許請求の範
囲第１項記載のワイヤボンディング装置。[Scope of Claims] 1. A wire bonding apparatus having a spool wound with a wire, a clamper capable of clamping the wire, and a bonding tool, a member having a wire insertion hole is provided between the spool and the clamper, A wire bonding device characterized in that the member is provided with an insertion hole, and a ventilation pipe communicating with the insertion hole is attached. 2. The wire inserted into the insertion hole of the member is brought into contact with the wall surface of the insertion hole by vacuum suction from the ventilation pipe. Wire bonding equipment. 3. The wire inserted into the insertion hole of the member is made to come into contact with the wall surface of the insertion hole by blowing gas from a ventilation pipe. Wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58123278A JPS6015938A (en) | 1983-07-08 | 1983-07-08 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58123278A JPS6015938A (en) | 1983-07-08 | 1983-07-08 | Wire bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6015938A true JPS6015938A (en) | 1985-01-26 |
Family
ID=14856604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58123278A Pending JPS6015938A (en) | 1983-07-08 | 1983-07-08 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6015938A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296242A (en) * | 1988-05-24 | 1989-11-29 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| US5297321A (en) * | 1992-07-08 | 1994-03-29 | Yoshida Kogyo K.K. | Fastening device |
-
1983
- 1983-07-08 JP JP58123278A patent/JPS6015938A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296242A (en) * | 1988-05-24 | 1989-11-29 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| US5297321A (en) * | 1992-07-08 | 1994-03-29 | Yoshida Kogyo K.K. | Fastening device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4437604A (en) | Method of making fine wire interconnections | |
| JPS61502791A (en) | Bonding tools and clamp assemblies and wire handling methods | |
| JP2004221257A (en) | Wire bonding method and device thereof | |
| US4928871A (en) | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head | |
| GB1363042A (en) | Tailless wedge bonding of gold wire to palladium-silver cermets | |
| JPH0917819A (en) | Connection method in manufacturing of microelectronics device | |
| JPH10189647A (en) | Capillary for wire bonding and bonding method | |
| JPS6015938A (en) | Wire bonding device | |
| US20080272178A1 (en) | Vacuum wire tensioner for wire bonder | |
| TW201221273A (en) | Wire feeding apparatus for wire bonders | |
| JP2617541B2 (en) | Wire bonding equipment | |
| JPS58218131A (en) | Feeder for wire of nail head wire bonder | |
| JP3503700B2 (en) | Air tension device for wire bonder | |
| JP2005116603A (en) | Method for manufacturing semiconductor device | |
| JPH10256299A (en) | Wire-bonding method and device thereof | |
| JPH0515066B2 (en) | ||
| JPS61229776A (en) | Fine wire feeding device | |
| US6520400B2 (en) | Wire tensioning apparatus | |
| KR100413477B1 (en) | Bonderhead for Wire Bonder | |
| JPH04184947A (en) | Wire-bonding device | |
| JPS615536A (en) | Capillary and wire bonding device employing it | |
| JPS58148432A (en) | Wire bonding | |
| JPS6298628A (en) | Wire guide | |
| JPH07263477A (en) | Capillary for connecting coated bonding fine wire | |
| JPH11297736A (en) | Wire cutting method and ball bonding method |