KR100309129B1 - Wire bonding apparatus and bonding method using the same - Google Patents
Wire bonding apparatus and bonding method using the same Download PDFInfo
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- KR100309129B1 KR100309129B1 KR1019950045976A KR19950045976A KR100309129B1 KR 100309129 B1 KR100309129 B1 KR 100309129B1 KR 1019950045976 A KR1019950045976 A KR 1019950045976A KR 19950045976 A KR19950045976 A KR 19950045976A KR 100309129 B1 KR100309129 B1 KR 100309129B1
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
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- Wire Bonding (AREA)
Abstract
Description
제 1 도는 와이어 본딩이 실시된 상태의 리드 프레임의 평면도.1 is a plan view of a lead frame in a state where wire bonding is performed.
제 2A 도 내지 제 2D 도는 와이어 본딩공정을 실시하기 위한 초기과정시 본딩 볼의 형성과정을 단계별로 도시한 측면도.2A to 2D are side views illustrating a step of forming a bonding ball during an initial process for performing a wire bonding process.
제 3 도는 본 발명의 일부 평면도.3 is a partial plan view of the present invention.
제 4 도는 제 1 도의 측면도.4 is a side view of FIG.
제 5 도는 본 발명에 이용된 보조 본딩 테이프 장치의 측단면도.5 is a side cross-sectional view of an auxiliary bonding tape device used in the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
5 : 와이어 5A 및 5B : 테일 및 본딩 볼5: wire 5A and 5B: tail and bonding ball
40 : 본딩 유니트 41 : X-Y 테이블40: bonding unit 41: X-Y table
43 : 캐필러리 50 : 보조 본딩 테이프 장치43: capillary 50: auxiliary bonding tape device
51 및 52 : 제 1 및 제 2 롤러51 and 52: first and second roller
53 : 엔빌 54 : 보조 테이프53: Anvil 54: Auxiliary Tape
본 발명은 와이어 본딩장치 및 본딩방법에 관한 것으로서, 특히 장치 가동 초기에 캐필러리 하단에의 본딩 볼 형성을 보조 테이프에서 실시하는 와이어 본딩장치 및 본딩방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus and a bonding method, and more particularly, to a wire bonding apparatus and a bonding method for forming a bonding ball at the lower end of a capillary with an auxiliary tape at the beginning of the apparatus operation.
반도체 제조공정에서, 리드 프레임의 패드 표면에 다이를 부착하는 다이 부착공정후 다이의 본딩 패드와 리드 프레임의 각 내측 리드를 와이어를 이용하여 연결하는 와이어 본딩을 실시하게 된다.In the semiconductor manufacturing process, after the die attaching step of attaching the die to the pad surface of the lead frame, wire bonding is performed to connect the bonding pads of the die and each inner lead of the lead frame with a wire.
즉, 제 1 도는 와이어 본딩이 실시된 상태의 리드 프레임의 평면도로서, 상술한 바와같이 리드 프레임(1)의 패드(2)에 부착된 다이(3)와 리드 프레임(1)의 내측 리드(4)간에 와이어(5)가 본딩된 상태를 도시하고 있다.That is, FIG. 1 is a plan view of a lead frame in a state where wire bonding is performed, and as described above, the die 3 attached to the pad 2 of the lead frame 1 and the inner lead 4 of the lead frame 1. The state in which the wires 5 are bonded between the layers is shown.
와이어 본딩장치를 가동한 직후의 초기작동시 또는 와이어를 교환한 후에는 다이(3)의 본딩 패드에 와이어(5)를 본딩하기 위한 본딩 볼(bonding ball)을 형성하여야 하며, 본딩 볼을 형성하는 위치로는 리드 프레임(1)의 패드(2) 표면이 이용되고 있다.In the initial operation immediately after the wire bonding device is started or after the wire is replaced, a bonding ball for bonding the wire 5 to the bonding pad of the die 3 should be formed, and a position for forming the bonding ball. As the furnace, the surface of the pad 2 of the lead frame 1 is used.
제 2A 도 내지 제 2D 도는 와이어 본딩공정을 실시하기 위하여 필요한 본딩 볼을 형성하는 과정을 단계별로 도시한 부분 측면도로서, 와이어의 교체 또는 와이어 본딩장비의 초기화 조치후 와이어 본딩장치의 캐필러리(43; capillary) 하단에 일정규격의 본딩 볼(5B)을 형성하여야 하며 이를 위하여 캐필러리(43)를 리드 프레임(1)의 패드(2) 표면에 접촉하여 와이어(5)를 본딩시킨다(제 2A 도의 상태). 이후 캐필러리(43)를 상향이동시키며(제 2B 도), 캐필러리(43)가 일정높이 이동된 후 캐필러리(43) 상부에 위치한 와이어 클램핑(44)를 이용하여 와이어(5)를 고정시킴으로서 패드(2)의 본딩된 부분에서 와이어(5)가 분리됨과 동시에 캐필러리(43) 하단에 소정길이의 와이어(5A)가 노출(이하 이를 "테일(tail)"이라 칭함)된 상태가 된다(제 2C도의 상태). 이 테일(5A)을 토치 블레이드(12; torch blade)에 근접시켜 스파크를 발생시킴으로서 본딩 볼(5B)이 형성된다(제 2D 도의 상태). 하단에 본딩 볼(5B)이 형성된 캐필러리(43)를 리드 프레임에 부착된 다이의 본딩 패드로 이송시킨후 초음파를 이용하여 본딩 볼(5B)을 압착시키며 이후 대응하는 내측 리드로 캐필러리(43)를 이송(이때 와이어는 제 1 도에 도시된 바와같이 루프(loop)를 형성함)시켜 와이어(5)를 리드 표면에 압착시키게 된다. 리드 표면에 와이어(5)를 압착시킨후 캐필러리(43)를 상승시킴으로서 캐필러리(43) 하단에 일정길이의 테일이 형성되며, 이 테일을 토치 블레이드에 접촉시켜 스파크를 발생시켜 본딩 볼을 형성한후 상술한 과정(즉, 리드에서 캐필러리를 상승시켜 본딩 볼을 형성한후 다이의 또다른 본딩 패드에 본딩 볼을 본딩하고 이와 대응하는 내측 리드에 와이어를 본딩시킴)을 반복적으로 실시한다.2A to 2D are partial side views illustrating a step of forming a bonding ball necessary to perform a wire bonding process, and the capillary 43 of the wire bonding apparatus after a wire replacement or an initialization measure of the wire bonding equipment. ; Bonding balls 5B of a certain size should be formed at the bottom of the capillary, and for this purpose, the capillary 43 contacts the surface of the pad 2 of the lead frame 1 to bond the wires 5 (2A). State of degrees). After the capillary 43 is moved upward (FIG. 2B), the capillary 43 is moved to a predetermined height, and then the wire 5 is formed by using the wire clamping 44 positioned on the capillary 43. The wire 5 is separated from the bonded portion of the pad 2 while the wire 5A of a predetermined length is exposed at the bottom of the capillary 43 (hereinafter referred to as a “tail”). It becomes a state (state of FIG. 2C). Bonding ball 5B is formed by bringing this tail 5A close to the torch blade 12 to generate a spark (state of FIG. 2D). The capillary 43 having the bonding ball 5B formed at the bottom thereof is transferred to a bonding pad of a die attached to the lead frame, and then the bonding ball 5B is compressed using ultrasonic waves, and then the capillary is formed with a corresponding inner lead. The 43 is conveyed (where the wire forms a loop as shown in FIG. 1) to squeeze the wire 5 to the lead surface. After pressing the wire 5 on the lead surface, the capillary 43 is raised to form a tail of a certain length at the bottom of the capillary 43, and the tail is brought into contact with the torch blade to generate a spark to bond the ball. After forming the film, the above-described process (ie, raising the capillary from the lead to form a bonding ball, then bonding the bonding ball to another bonding pad of the die and bonding the wire to the corresponding inner lead) is repeated. Conduct.
그러나, 이상에서 설명한 바와같이 와이어의 끊어짐 등으로 인한 와이어 본딩장치의 초기화 또는 와이어를 교체한뒤 와이어 본딩 공정을 재실시하기 전에 다이의 본딩 패드에 와이어를 본딩하기 위한 본딩 볼을 형성하기 위하여 캐필러리를 리드 프레임의 패드에 접촉시킴으로서 열압착으로 인하여 캐필러리가 접촉된 부위에 캐필러리의 가압자국이 남게되어 리드 프레임의 패드 표면에 코팅된 알루미늄 막에 손상이 발생되며, 또한 본딩된 와이어가 불필요하게 존재하게 됨으로서 제품의 불량을 초래하게 된다.However, as described above, the capillary is formed in order to form a bonding ball for bonding the wire to the bonding pad of the die before the wire bonding process is re-initiated or the wire bonding process is restarted after the wire is replaced. By contacting the pad to the pad of the lead frame, the pressurization marks of the capillary remain in the area where the capillary is contacted due to thermal compression, which causes damage to the aluminum film coated on the pad surface of the lead frame, and no bonded wire is required. Existence will result in product defects.
본 발명은 와이어 본딩공정시 발생하는 상술한 문제점을 해결하기 위한 것으로서, 초기의 본딩 볼 형성을 리드 프레임 상에서 실시하지 않도록 구성된 와이어 본딩장치 및 이를 이용한 와이어 본딩방법을 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems occurring in the wire bonding process, and an object thereof is to provide a wire bonding apparatus and a wire bonding method using the same, which are not configured to perform initial bonding ball formation on a lead frame.
상술한 목적을 실현하기 위한 본 발명에 따른 와이어 본딩장치는 리드 프레임 스트립의 이송을 안내하는 가이드의 일측에 캐필러리 하단에 초기 본딩 볼을 형성하기 위한 보조 본딩 테이프 장치를 설치하여 보조 본딩 테이프 장치의 테이프 표면에 1차로 와이어를 본딩하여 캐필러리 하단에 일정길이의 와이어를 노출시켜 노출된 와이어를 본딩 볼로 형성할수 있도록 구성하였다.The wire bonding apparatus according to the present invention for realizing the above object is to install an auxiliary bonding tape device for forming the initial bonding ball at the bottom of the capillary on one side of the guide for guiding the transfer of the lead frame strip auxiliary bonding tape device Bonding the wire primarily to the tape surface of the capillary was configured to expose a certain length of wire to the bottom of the capillary to form the exposed wire as a bonding ball.
본 발명에 따른 와이어 본딩방법은 캐필러리 하단에 일정규격의 본딩 볼을 형성하기 위하여 캐필러리를 보조 본딩 테이프 장치상으로 이송시키는 단계와, 캐필러리가 하강하여 테이프 표면에 와이어를 본딩시키는 단계와, 캐필러리를 상향이동시켜 테이프 표면의 본딩된 부분에서 와이어를 분리시키는 단계와, 캐필러리 하단에 소정길이 노출된 와이어에 스파크를 발생시켜 본딩 볼을 형성하는 단계와, 캐필러리를 리드 프레임에 부착된 다이의 본딩 패드상으로 이송시켜 본딩 볼을 다이의 본딩 패드 표면에 열 압착시키는 단계와, 내측 리드로 캐필러리를 이송시켜 와이어를 리드 표면에 본딩시킨후 정상적인 와이어 본딩을 계속적으로 실시하는 단계로 이루어진다.The wire bonding method according to the present invention comprises the steps of transferring the capillary on the auxiliary bonding tape device to form a bonding ball of a certain size at the bottom of the capillary, and the capillary is lowered to bond the wire to the tape surface And separating the wire from the bonded portion of the tape surface by moving the capillary upward, generating sparks on the wire exposed to the predetermined length at the bottom of the capillary to form a bonding ball, and the capillary Transfer the bonding ball onto the bonding pad surface of the die attached to the lead frame to thermally compress the bonding ball, transfer the capillary to the inner lead to bond the wire to the lead surface, and then continue normal wire bonding. It consists of the steps performed.
이하, 본 발명을 첨부한 도면을 참고하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings of the present invention will be described in detail.
제 3 도는 본 발명의 일부 평면도, 제 4 도는 제 1 도의 측면도로서, 편의상 와이어 본딩장치중 본딩공정이 실시되는 부분만을 도시하였다.3 is a partial plan view of the present invention, and FIG. 4 is a side view of FIG. 1 and shows only a portion of the wire bonding apparatus in which a bonding process is performed.
와이어 본딩장치에서, 와이어 본딩이 실시되는 리드 프레임 스트립(20; 상술한 다이 부착공정이 각각 실시된 다수의 리드 프레임이 상,하 사이드 레일에 일체화된 상태임)은 양측의 가이드(31)에 의하여 본딩 영역(B)으로 이송되어져 오며, 본딩 영역(B) 직상부에는 본딩을 실시하는 본딩 유니트(40; unit)가 위치한다. 본딩 유니트(40)는 크게 X 및 Y방향(도면 기준임)으로 이동가능한 X-Y 테이블(41)과, 테이블(41)에서 가이드(31)를 향하여 연장된 아암(42) 및 아암(42) 단부에 고정설치된 캐필러리(43)로 구성된다. 캐필러리(43)의 내부에는 와이어가 통과되는 통로가 구성되며, 그 상부에는 와이어를 클램핑시키는 와이어 클램프(제 2A 도 내지 제 2D 도의 44)가 구성되어 있다.In the wire bonding apparatus, the lead frame strip 20 to which wire bonding is performed (a plurality of lead frames each of which has been subjected to the above-described die attach process is integrated with upper and lower side rails) is formed by guides 31 on both sides. It is transferred to the bonding area B, and the bonding unit 40 which performs bonding is located directly above the bonding area B. As shown in FIG. The bonding unit 40 is provided with an XY table 41 which is largely movable in the X and Y directions (based on the drawing), and ends of the arm 42 and the arm 42 extending from the table 41 toward the guide 31. It is composed of a capillary 43 fixedly installed. A passage through which a wire passes is formed in the capillary 43, and a wire clamp (44 in FIGS. 2A to 2D) is clamped at the upper portion thereof.
본 발명의 가장 큰 특징은 리드 프레임 스트립(20)을 안내하는 가이드(31)의 일측에 초기의 본딩 볼을 형성하기 위한 보조 본딩 테이프 장치(50)를 설치한 점이다. 이때, 보조 본딩 테이프 장치(50)는 본딩 유니트(40)의 이송영역, 즉 X-Y 테이블의 이송영역(본딩영역(B)와 동일함)내에 설치되어야 한다.The biggest feature of the present invention is that the auxiliary bonding tape device 50 for forming the initial bonding ball on one side of the guide 31 for guiding the lead frame strip 20 is provided. At this time, the auxiliary bonding tape apparatus 50 should be installed in the transfer area of the bonding unit 40, that is, the transfer area of the X-Y table (same as the bonding area B).
이상과 같은 본 발명의 동작을 제 1 도, 제 2A 도 내지 제 2D 도(제 2A 도 및 제 2D의 패드(2)는 이하 설명에서 테이프로 칭하기로 한다) 및 제 3 도를 통하여 설명하면 다음과 같다.The operation of the present invention as described above will be described with reference to FIGS. 1, 2A through 2D (the pads 2 of FIGS. 2A and 2D are referred to as tapes in the following description) and FIG. Same as
와이어의 교체 또는 와이어 본딩장비의 초기화 조치후 와이어 본딩장치의 캐필러리(43) 하단에 일정규격의 본딩 볼(5B)을 형성하기 위하여 X-Y 유니트(41)를 작동시켜 캐필러리(43)를 보조 본딩 테이프 장치(50)상으로 이송시키며, 이후 캐필러리(43)가 하강(테이블의 하강에 의함)하여 보조 테이프(도시되지 않음) 표면에 와이어(5)를 본딩시킨다(제 2A 도와 동일한 상태). 이후 캐필러리(43)를 상향이동시키며(제 2B 도와 동일한 상태), 캐필러리(43)가 일정높이 이송된 후 와이어 클램프(제 2C도의 44)를 이용하여 와이어(5)를 고정시킴으로서 테이프(제 5 도의 54) 표면의 본딩된 부분에서 와이어(5)가 분리됨과 동시에 캐필러리(43) 하단으로 부터 소정길이의 와이어(5A; 테일)가 노출된다(제 2C도와 동일한 상태). 이 테일(5A)을 토치 블레이드(12; torch blade)에 근접시켜 고전압으로 인한 스파크를 발생시킴으로서 본딩 볼(5B)이 형성된다(제 2D 도와 동일한 상태). 캐필러리(43) 하단에 본딩 볼(5B)을 형성한 후 X-Y 테이블(41)을 작동시켜 캐필러리(43)를 리드 프레임의 패드상에 부착된 다이의 본딩 패드상으로 이송시키며, 캐필러리(43) 하강 후 초음파를 이용하여 본딩 볼(5B)을 다이의 본딩 패드 표면에 열 압착시키게 된다. 계속하여 대응하는 내측 리드로 캐필러리(43)를 이송시켜 와이어를 리드 표면에 본딩시키며 리드 표면에의 와이어 본딩후 캐필러리(43)를 상승시켜 정상적인 와이어 본딩단계, 즉 캐필러리(43)의 일정높이 상승후 캐필러리(43) 상부의 와이어 클램프(44)가 와이어를 클램핑함으로서 리드의 본딩위치에서 와이어가 절단됨과 동시에 캐필러리(43) 하단에 일정길이의 테일이 형성되며 이 테일을 토치 블레이드에 근접시켜 스파크를 발생시켜 본딩 볼을 형성한후 상술한 과정을 반복적으로 실시한다.After replacing the wire or initializing the wire bonding equipment, the XY unit 41 is operated by operating the XY unit 41 to form a bonding ball 5B of a predetermined size at the bottom of the capillary 43 of the wire bonding apparatus. Transferred onto the auxiliary bonding tape device 50, and then the capillary 43 descends (by the lowering of the table) to bond the wire 5 to the surface of the auxiliary tape (not shown) (same as the second A degree. condition). After the capillary 43 is moved upward (the same state as the second B), the capillary 43 is transferred to a certain height, and then the wire clamp (44 in FIG. 2C) is used to fix the wire 5 by fixing the tape. (54 in Fig. 5) At the bonded portion of the surface, the wire 5 is separated and at the same time, the wire 5A (tail) of a predetermined length is exposed from the lower end of the capillary 43 (the same state as in Fig. 2C). Bonding ball 5B is formed by bringing this tail 5A close to the torch blade 12 to generate a spark due to a high voltage (the same state as the 2D diagram). After forming the bonding ball 5B at the bottom of the capillary 43, the XY table 41 is operated to transfer the capillary 43 onto the bonding pad of the die attached to the pad of the lead frame, After the pillar 43 is lowered, the bonding ball 5B is thermally pressed onto the bonding pad surface of the die by using ultrasonic waves. Subsequently, the capillary 43 is transferred to the corresponding inner lead to bond the wire to the lead surface, and after the wire bonding to the lead surface, the capillary 43 is raised to normal wire bonding step, that is, the capillary 43 After the fixed height rises, the wire clamp 44 on the upper portion of the capillary 43 clamps the wire so that the wire is cut at the bonding position of the lead, and a tail of a predetermined length is formed at the bottom of the capillary 43. The tail is close to the torch blade to generate a spark to form a bonding ball, and then the above-described process is repeatedly performed.
이러한 단계는 와이어 본딩공정 중에 와이어의 끊어짐 등으로 인하여 와이어 본딩장치의 가동을 중지시켜 불량요인을 제거한 후 본딩장치의 초기화 상태에서 재차 실시한다.This step is performed again in the initializing state of the bonding apparatus after removing the defective factors by stopping the operation of the wire bonding apparatus due to breakage of the wire during the wire bonding process.
이와같이 본딩장치 작동 초기에 캐필러리(43) 하단에 본딩 볼(5B)을 형성시키기 위한 보조 테이프 장치(50)의 구성을 제 5 도를 통하여 설명하면, 제 5 도는 본 발명에 이용된 보조 본딩 테이프 장치의 측단면도로서, 회전 가능하게 설치된 제 1 및 제 2 롤러(51 및 52)와 제 1 및 제 2 롤러(51 및 52) 사이에 고정설치된 엔빌(53; anvil)로 이루어 진다. 제 1 롤러(51)에는 보조 테이프(54)가 감겨져 있으며, 제 2 롤러(52)에는 사용된 보조 테이프(54)가 감겨지게 된다. 앤빌(53)은 캐필러리(43)가 테이프(54)를 가압할시 테이프(54)를 지지하는 목적으로 설치된다. 한편, 엔빌(53)에는 관통홀(53H)을 설치하여 진공압을 공급함으로서 테이프(54)를 엔빌(53) 표면에 견고하게 접촉시키게 되며, 따라서 와이어의 본딩시 테이프(54)의 유동을 방지할수 있으며, 진공센서와 연결시킴으로서 테이프(54)의 유무를 감지하여 캐필러리(43)의 불필요한 오동작을 방지할수 있다.As described above, the configuration of the auxiliary tape device 50 for forming the bonding ball 5B at the lower end of the capillary 43 at the beginning of the bonding device operation will be described with reference to FIG. 5. A side cross-sectional view of the tape device, which comprises an anvil 53 fixedly installed between the first and second rollers 51 and 52 and the first and second rollers 51 and 52 rotatably provided. The auxiliary tape 54 is wound around the first roller 51, and the used auxiliary tape 54 is wound around the second roller 52. The anvil 53 is installed for the purpose of supporting the tape 54 when the capillary 43 presses the tape 54. On the other hand, the anvil 53 is provided with a through hole 53H to supply a vacuum pressure to firmly contact the tape 54 with the surface of the anvil 53, thus preventing the flow of the tape 54 when bonding the wire. By connecting with the vacuum sensor, it is possible to detect the presence of the tape 54 to prevent unnecessary malfunction of the capillary 43.
상술한 바와같이 보조 본딩 테이프 장치(50)의 테이프(54) 표면에는 캐필러리(43)가 접촉된후 열 압착으로 와이어가 본딩되어지며, 한번 와이어가 본딩된 영역에 재차 와이어 본딩이 실시되는 것을 방지하기 위하여 와이어 본딩 유니트(40)의 X-Y 테이블(41)에 테이프(54)의 본딩위치에 대한 좌표값을 프로그래밍 시키며 따라서 테이프(54) 표면에 중복 본딩되는 경우가 없이 순차적으로 본딩이 실시된다. 테이프(54)의 설정된 모든 본딩 영역에 와이어 본딩이 실시되면 제 2 롤러(52)가 회전하여 본딩완료된 테이프(54)를 감게되고 따라서 제 1 롤러(51)에 감겨진 새로운 테이프가 엔빌(53)상으로 이송된다. 한편, 와이어가 본딩되는 테이프(54)는 리드 프레임과 동일한 재질로 이루어짐으로서 만족할 만한 와이어 본딩 효과를 얻을 수 있다.As described above, after the capillary 43 contacts the surface of the tape 54 of the auxiliary bonding tape device 50, the wires are bonded by thermal compression, and the wire bonding is performed again in the area where the wires are bonded. In order to prevent this, the coordinate values for the bonding position of the tape 54 are programmed in the XY table 41 of the wire bonding unit 40, and thus bonding is performed sequentially without overlapping bonding to the tape 54 surface. . When wire bonding is applied to all of the set bonding areas of the tape 54, the second roller 52 rotates to wind the completed tape 54 so that the new tape wound on the first roller 51 is anvil 53 Transferred to the bed. On the other hand, since the tape 54 to which the wire is bonded is made of the same material as the lead frame, a satisfactory wire bonding effect can be obtained.
한편, 보조 본딩 테이프 장치를 설치하지 않고 본딩 유니트의 이송 영역내에 정품이 아닌 리드 프레임을 장착함으로서 동일한 효과를 얻을수 있음은 물론이다.On the other hand, the same effect can be obtained by mounting a non-genuine lead frame in the transfer area of the bonding unit without installing the auxiliary bonding tape device.
이상과 같은 본 발명은 와이어 본딩장치의 초기화 조치후 캐필러리 하단에의 본딩 볼 형성을 본딩영역내에 설치된 보조 본딩 테이프 장치의 테이프 표면에 실시함으로서 와이어 본딩 공정시 캐필러리의 가압으로 인한 프레임의 패드 표면을 보호할수 있으며, 이로인한 불량을 현저하게 감소시킬수 있다.The present invention as described above, by forming the bonding ball at the bottom of the capillary after the initial action of the wire bonding apparatus on the tape surface of the auxiliary bonding tape device installed in the bonding area, the pad of the frame due to the pressurization of the capillary during the wire bonding process The surface can be protected and the defects caused by this can be significantly reduced.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950045976A KR100309129B1 (en) | 1995-12-01 | 1995-12-01 | Wire bonding apparatus and bonding method using the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950045976A KR100309129B1 (en) | 1995-12-01 | 1995-12-01 | Wire bonding apparatus and bonding method using the same |
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| KR970053157A KR970053157A (en) | 1997-07-29 |
| KR100309129B1 true KR100309129B1 (en) | 2001-12-17 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03183141A (en) * | 1989-12-12 | 1991-08-09 | Toshiba Seiki Kk | Wire bonding apparatus |
| JPH04206841A (en) * | 1990-11-30 | 1992-07-28 | Mitsubishi Electric Corp | Wire bonding equipment for semiconductor device |
| KR940012553A (en) * | 1992-11-27 | 1994-06-23 | 김주용 | Ultra Low Wire Bonding Method |
| US5326015A (en) * | 1993-03-29 | 1994-07-05 | Kulicke And Soffa Investments, Inc. | Wire bonder tail length monitor |
-
1995
- 1995-12-01 KR KR1019950045976A patent/KR100309129B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03183141A (en) * | 1989-12-12 | 1991-08-09 | Toshiba Seiki Kk | Wire bonding apparatus |
| JPH04206841A (en) * | 1990-11-30 | 1992-07-28 | Mitsubishi Electric Corp | Wire bonding equipment for semiconductor device |
| KR940012553A (en) * | 1992-11-27 | 1994-06-23 | 김주용 | Ultra Low Wire Bonding Method |
| US5326015A (en) * | 1993-03-29 | 1994-07-05 | Kulicke And Soffa Investments, Inc. | Wire bonder tail length monitor |
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| KR970053157A (en) | 1997-07-29 |
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