JPH02119149A - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JPH02119149A
JPH02119149A JP1232791A JP23279189A JPH02119149A JP H02119149 A JPH02119149 A JP H02119149A JP 1232791 A JP1232791 A JP 1232791A JP 23279189 A JP23279189 A JP 23279189A JP H02119149 A JPH02119149 A JP H02119149A
Authority
JP
Japan
Prior art keywords
bonding
wire
load
cam
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1232791A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0381301B2 (enrdf_load_stackoverflow
Inventor
Yuzo Taniguchi
雄三 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1232791A priority Critical patent/JPH02119149A/ja
Publication of JPH02119149A publication Critical patent/JPH02119149A/ja
Publication of JPH0381301B2 publication Critical patent/JPH0381301B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1232791A 1989-09-11 1989-09-11 ワイヤボンディング装置 Granted JPH02119149A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1232791A JPH02119149A (ja) 1989-09-11 1989-09-11 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1232791A JPH02119149A (ja) 1989-09-11 1989-09-11 ワイヤボンディング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP62001601A Division JPS62247538A (ja) 1987-01-09 1987-01-09 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPH02119149A true JPH02119149A (ja) 1990-05-07
JPH0381301B2 JPH0381301B2 (enrdf_load_stackoverflow) 1991-12-27

Family

ID=16944810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1232791A Granted JPH02119149A (ja) 1989-09-11 1989-09-11 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPH02119149A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0381301B2 (enrdf_load_stackoverflow) 1991-12-27

Similar Documents

Publication Publication Date Title
US4653681A (en) Voice coil actuated fine wire clamp
US4563964A (en) Sewing machine drive control
JPH02119149A (ja) ワイヤボンディング装置
JPS62247538A (ja) ワイヤボンデイング装置
JPS60257747A (ja) 巻線機
US3940047A (en) Bonding apparatus utilizing pivotally mounted bonding arm
US4677925A (en) Method of initially setting a stepping motor in a sewing machine
JPH0232391B2 (ja) Shishunuimishinnosokudoseigyosochi
JPS6243336B2 (enrdf_load_stackoverflow)
JPS6113377B2 (enrdf_load_stackoverflow)
JPH05278943A (ja) 巻線のテンション制御装置
JP2558673B2 (ja) ワイヤボンデイング装置
JPS6221234A (ja) ワイヤボンダ
US4947772A (en) Finish-up stitching control in an electronic sewing machine
JP2940259B2 (ja) ボンディング方法
JPH0779113B2 (ja) ワイヤボンディング装置
EP0227132A2 (en) Sewing machine with control device for the needle driving motor
JPH0897590A (ja) 自動押し当て方法及び装置
JPS6219345Y2 (enrdf_load_stackoverflow)
JPH0153505B2 (enrdf_load_stackoverflow)
JP2725102B2 (ja) ワイヤボンディング方法
JPS633895A (ja) ミシン
JPH0337960B2 (enrdf_load_stackoverflow)
JPH0693471B2 (ja) ワイヤボンデイング装置
JPH05854B2 (enrdf_load_stackoverflow)