JPH02119079A - Ic plating-contact type socket - Google Patents

Abstract

PURPOSE:To make it possible to depress IC leads nearly at right angles and nearly simultaneously by attaching an IC depressing member adjustably to a depressing cover. CONSTITUTION:A depressing cover 12 is rotatably provided by means of a hinge 13 provided at the end of a socket base plate 11. The socket base plate 11 has a contact 14 disposed in an area for carrying an IC 18. A depressing member 18 is pivoted to the depressing cover 12 with a shaft 19' disposed in an IC carrying area. A lead depressing pad 16a is provided integrally with the depressing member 16 corresponding to contact arrangement. Placing the IC 18 below the depressing member 16 and turning the depressing cover 12, the right and left leads 15 of the IC 18 are pressed against the contact 14 nearly simultaneously and perpendicularly.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC in which an IC lead is placed on a socket board of a socket board and a contact pressure is obtained by closing a presser cover.
1ii related to tangential sockets.

Conventional technology and problems FIG. 1 shows a typical example of a conventional IC-mounted socket.

In this socket, a large press cover 2 is rotatably attached to one end of a socket board 1 via a hinge 3, and this is closed on the board 1 on which an IC 8 is mounted, thereby allowing the IC lead 5 mounted on the contact 4 to be connected to the socket board 1. Press against the elasticity of contact 4
IC is installed on the inner surface of the presser cover 2.
It has a large pressing pad 6 which is protruded to press the lead 5. In the figure, reference numeral 7 denotes a lock lever provided to keep the presser cover 2 closed.

As mentioned above, in the conventional IC socket, the presser pad 6 is provided integrally with the presser cover 2.

Therefore, when attempting to hold down an IC using the presser cover 2 having the above structure, as the presser cover 2 rotates, the presser pad 6 on the hinge 3 side will inevitably be placed first and placed on the hinge 3 side. The IC lead 5 is pressed, and then the presser pad 6 on the free end side of the cover 2 presses the IC lead 5 arranged on the free end side, making it difficult to simultaneously suppress the cover 2 on the lead 5 that is horizontal to the hinge. -2 There is a drawback that an unbalanced load is applied during the closing process. This may lead to deformation of the IC lead 5 which was previously suppressed.

Furthermore, since the pressing force λ is sequentially applied to the IC leads 5 arranged in tandem with the hinge from one end side (hinge side) to the other end side (cover free end side) of the lead row, the same lead 5
A biasing force in the width direction acts on the material, which may similarly cause deformation or lateral displacement.

Purpose of the Invention The present invention is capable of properly holding an IC lead without applying an uneven load to the IC lead as described above when the presser cover is closed, and without causing deformation or lateral displacement of the IC lead due to the uneven load. IC that enables
This provides a mounting type socket.

Structure of the Invention The present invention is a step toward achieving the above object, in that when the presser cover is closed, the lead holding member can adjust itself to press the IC leads in each row substantially simultaneously with a substantially perpendicular pressing force. This is what I tried to do.

Practical Examples of the Invention Examples of the present invention will be described below with reference to FIGS. 2 to 7.

As in the above embodiments, an embodiment of the present invention will be described by taking as an example a socket in which a presser cover 12 is rotatably attached to one end of a socket board 11 via a hinge 13.

The socket substrate 11 has contacts 14 arranged in the region where the ICl3 is mounted. On the other hand, ICl3 has leads 15 protruding from two or four sides thereof. The contacts 14 are arranged in rows on two or four sides of the IC1ii region corresponding to the IC leads 15.

The presser cover 12 can be opened and closed via the hinge 13 with respect to the upper surface of the socket board 11 on which the contacts are disposed, and as described above, the lead presser and the IC are held by closing, and released by releasing.

In order to maintain the two-leg closure, a lock lever 17 is provided at the free end of the presser cover 12 to be engaged with and disengaged from the socket board 11. The lock lever 17 may be provided on the board 11 side as a socket.

As the lead pressing means, a lead pressing member 16 is provided on the pressing cover 12 so as to be adjustable. As an embodiment of the adjustment structure, the lead holding member 16 is disposed above the IC mounting area, and is pivotally connected to the holding cover 12 by a shaft 19.
9 as a fulcrum and is rotatable in the one-dot suppression direction.

The presser cover 12 is attached to the hinge 13 like the target socket shown in the figure.
If the presser cover 12 is rotatably attached, it is rotatable in the opening/closing direction of the presser cover 12.

The lead presser member 16 as described above is integrally provided with a lead presser pad 16a corresponding to the do arrangement (contact arrangement) marked with @.

FIG. 2 shows the cover 12 holding the center part of the lead holding member 16.
The shaft is pivoted on an axis parallel to the rotation axis of the rod, allowing the lever to move.
The IC holding pads 16a are provided on both ends of the shaft 19 and on a side parallel to the shaft 19 with the shaft 19 in between.

In the embodiment of FIG. 3, the hinge 13 of the presser member 16
The side end portion is pivotally supported on an axis parallel to the rotating axis of the presser cover 12, and the free end ρN1 portion of the presser cover is elastically supported by a spring 20 that biases in the presser direction. Figures 2 and 3
The illustrated embodiments each show a case in which the shaft can be adjusted in the negative position using the shaft as the fulcrum.

FIG. 4 shows the presser member 1 in each embodiment shown in FIGS. 2 and 3.
An embodiment is shown in which 6 is adjustably connected via a universal joint mechanism instead of a pivot mechanism. That is, the pressing member 16
and a presser cover 12 on either side of the ball 19°
It is possible to adjust it in all directions.

Further, FIG. 5 shows an embodiment in which the presser member 16 is movably attached to the presser cover 12, the presser member 16 is provided with an outward flange 16b, and the outward flange 16b is attached to the presser cover 12.
12 Space provided on the inner surface +2a1. :J together with the corresponding blank space 12
By engaging with the inward flange 12I3 provided at part a, it can be attached so as to be able to move horizontally and vertically, thereby adjusting the position when holding the IC. In this case, the inner surface 12e of the space 12a facing the upper surface of the holding member 16 is sloped so as to protrude at the center.

Each of the embodiments described above has a presser member 1 formed of a single member.
In contrast, in the embodiment shown in FIG. 6, the holding member 16 that operates as described above is composed of a plurality of members. .

For example, when the contacts 14 and the IC leads 15 are arranged in four directions, as shown in the figure, the pressing member 16° that presses the pair of opposing glue leads 15 is rotatably supported at @19a in the left and right direction, and the other A pressing member 16'' to press a pair of opposing leads 15 is rotatably supported by a shaft 19b in the front-rear direction so as to obtain adjustment when pressing the leads.

Further, FIG. 7 shows an embodiment in which, like the embodiment shown in FIG. 7ysS, a plurality of lead press members 16 are carried by the press cover 12 so that the IC leads 15 arranged in each direction can be pressed row by row. As shown in the figure, a pedestal 12b is provided on the inner surface of the presser cover 12, and a space 12a is formed inside the pedestal 12b. , a hole 2 in which a presser pad 16a provided integrally with the presser member 16 is provided in the pedestal 12b.
The lead holding member 1 can be inserted into the lead holding member 1 and protruded outward to be movable laterally and vertically.
The upper limit of upward movement is set on the top surface of the presser cover 12 by the inner surface of the presser cover 12 or another regulating member provided integrally with the presser cover 12 to generate a pressing force.

In the embodiment described above, the presser cover is connected to the socket board via a hinge so that it can be opened and closed, but it can also be closed and closed if the presser cover is not connected to the socket board and is separated. Depending on the posture, problems similar to those of the embodiment may occur.9 The present invention can be implemented and expected to be effective even when the presser cover is separated in this way.

As described in detail, according to the present invention, when the presser cover is closed, the presser member adjusts itself to absorb and correct the incorrect suppressing posture for the XC lead, and always suppresses the lead in an appropriate pressing posture. I'm happy with what I can get. Therefore, inconveniences caused by the rA@ position of the presser cover, such as those of conventional mounting type IC sockets in which a lead presser is provided integrally with the presser cover, are particularly important when the IC lead is closed when the presser cover is rotated to close. Deformation and lateral displacement can be effectively prevented, and highly reliable mounting of contacts and IC leads can be ensured.

Further, even when the presser cover is not hingedly connected to the socket substrate but is separated from it, a similar problem occurs depending on its closed posture, and the present invention can be expected to have the above-mentioned effects in this case as well.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of a conventional IC @ contact type socket, and Fig. 2 is a cross-sectional view of a C-mounted socket showing an embodiment of the present invention.
3 is a sectional view of the same showing the other side, FIG. 4 is a sectional view of the same showing the other side, FIG. 5 is a sectional view of the same showing the other side, and FIG. 6 is a sectional view of the holding member showing the other side. FIG. 7 is a cross-sectional view of the IC mounting type IC socket showing the other side. 11... Socket board, 12... Presser cover 13.
... Hinge, 14... Contact, 15... IC lead, 16... Holding member, 18... IC, 19...
·shaft. Figure 1 Figure 5 Figure 6 Figure 3 Figure 4 Figure 7

Claims (1)

[Claims] Mount the IC on a socket board, place the IC lead on the contact of the socket board, close the holding cover on the socket board, press the IC lead with the holding member provided on the holding cover, and apply pressure to the contact. An IC mounting type socket, characterized in that the IC lead holding member is adjustably attached to the holding cover.