JPS6048689U - Socket for semiconductor devices - Google Patents

Socket for semiconductor devices

Info

Publication number
JPS6048689U
JPS6048689U JP14128283U JP14128283U JPS6048689U JP S6048689 U JPS6048689 U JP S6048689U JP 14128283 U JP14128283 U JP 14128283U JP 14128283 U JP14128283 U JP 14128283U JP S6048689 U JPS6048689 U JP S6048689U
Authority
JP
Japan
Prior art keywords
socket
semiconductor device
semiconductor devices
lid
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14128283U
Other languages
Japanese (ja)
Inventor
工藤 元文
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14128283U priority Critical patent/JPS6048689U/en
Publication of JPS6048689U publication Critical patent/JPS6048689U/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のフラット型パッケージ構造を有する半導
体装置のためのソケットの概略図である。第2図は本考
案によるフラット型パッケージ構造を有する半導体装置
のためのソケットの一実施例の概略図であり、第3図は
その断面の概略図である。 なお図において、1・・・・・・ソケットの蓋、−2・
・・・・・ソケット本体、3・・・・・・ソケット本体
とその蓋の固定用穴、4・・・・・・ソケットの蓋の支
持ピン、5・・・・・・半導体装置のパッケージ、6・
・・・・・半導体装置の電極ピン、7・・・・・・発熱
ヒータ部用電極ピン、8・・・・・・5eebeek 
 effectを用いた熱電対用電極゛ピン、9・・・
・・・ソケット電極、10・・・・・・位置指定ガイド
ピン、11・・・・・・ソケット蓋の内部に埋め込まれ
た発熱ヒータ部、12−−−−−−3eebeck  
effectを用いた熱電対、13・・・・・・熱電対
と半導体装置のパッケージを密着させるためのバネ、1
4・・・・・・熱電対を支持するソケットの蓋の一部分
、15・・・・・・外部コントロール部、である。
FIG. 1 is a schematic diagram of a socket for a semiconductor device having a conventional flat package structure. FIG. 2 is a schematic diagram of an embodiment of a socket for a semiconductor device having a flat package structure according to the present invention, and FIG. 3 is a schematic cross-sectional diagram thereof. In addition, in the figure, 1... the lid of the socket, -2...
... Socket body, 3 ... Fixing hole for socket body and its lid, 4 ... Support pin for socket lid, 5 ... Semiconductor device package ,6・
...Electrode pin for semiconductor device, 7...Electrode pin for heat generating heater part, 8...5eebeek
Thermocouple electrode pin using effect, 9...
... Socket electrode, 10 ... Position designation guide pin, 11 ... Heat generating heater section embedded inside the socket lid, 12 ------3eebeck
Thermocouple using effect, 13... Spring for bringing the thermocouple and semiconductor device package into close contact, 1
4... Part of the lid of the socket that supports the thermocouple, 15... External control section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラット励パッケージ構造を有する半導体装置用のソケ
ットにおいて、前記ソケットの蓋の内部に発熱ヒータ部
及び前記ソケットの前記半導体装置との接触部に温度検
出部を併せ持つことを特徴とする半導体装置用ソケット
1. A socket for a semiconductor device having a flat excitation package structure, characterized in that the socket has a heat generating heater section inside a lid of the socket and a temperature detecting section at a contact section of the socket with the semiconductor device.
JP14128283U 1983-09-12 1983-09-12 Socket for semiconductor devices Pending JPS6048689U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14128283U JPS6048689U (en) 1983-09-12 1983-09-12 Socket for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14128283U JPS6048689U (en) 1983-09-12 1983-09-12 Socket for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6048689U true JPS6048689U (en) 1985-04-05

Family

ID=30316035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14128283U Pending JPS6048689U (en) 1983-09-12 1983-09-12 Socket for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6048689U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317550A (en) * 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ic loading and contacting type socket
JPH02119079A (en) * 1989-09-20 1990-05-07 Yamaichi Electric Mfg Co Ltd Ic plating-contact type socket

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317550A (en) * 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ic loading and contacting type socket
JPH02119079A (en) * 1989-09-20 1990-05-07 Yamaichi Electric Mfg Co Ltd Ic plating-contact type socket

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