JPH02117912A - Resin composition for laminate - Google Patents
Resin composition for laminateInfo
- Publication number
- JPH02117912A JPH02117912A JP27007288A JP27007288A JPH02117912A JP H02117912 A JPH02117912 A JP H02117912A JP 27007288 A JP27007288 A JP 27007288A JP 27007288 A JP27007288 A JP 27007288A JP H02117912 A JPH02117912 A JP H02117912A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- flame
- resin composition
- bromine
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 8
- 239000003063 flame retardant Substances 0.000 claims abstract description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 7
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract 1
- 230000008961 swelling Effects 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、半田耐熱性、耐ミーズリング性に潰れた積層
板用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a resin composition for a laminate that has excellent soldering heat resistance and measling resistance.
（従来の技術）
エポキシ樹脂を用いたエポキシ樹脂積層板は、最近、宇
宙機器、大形から小形のコンピューター、マイクロコン
ピュータ−１無線応用機器、工業計測機器、医療用機器
等、産業用機器への需要が多くなってきた。 そして、
そのいずれの場合も高度の特性および難燃性が要求され
ている。 これまでエポキシ樹脂の難燃化には、無機物
の充填剤を加える方法、難燃性付与剤を加える方法が採
用される場合もあるが、硬化特性、作業性などの観点か
ら、エポキシ樹脂自体を難燃化することが多い、 特に
、エポキシ樹脂積層板の難燃化の場合には、上記の理由
によって臭素化されたエポキシ樹脂によって難燃性を付
与しているが、臭素化エポキシ樹脂は耐熱性が低い欠点
があり、この樹脂を用いた積層板の半田耐熱性の試験を
行うと、ふくれやミーズリングが発生し、積層板の耐熱
性に限界があった。(Prior art) Epoxy resin laminates using epoxy resin have recently been used in industrial equipment such as space equipment, large to small computers, microcomputer-1 wireless application equipment, industrial measuring equipment, and medical equipment. Demand has increased. and,
In both cases, high properties and flame retardance are required. Up until now, methods of adding inorganic fillers or flame retardant agents have been adopted to make epoxy resins flame retardant, but from the viewpoint of curing characteristics and workability, the epoxy resin itself has been used. In particular, when making epoxy resin laminates flame retardant, brominated epoxy resins are used to impart flame retardancy for the reasons mentioned above, but brominated epoxy resins are not heat resistant. However, when testing the solder heat resistance of a laminate using this resin, blistering and measling occurred, limiting the heat resistance of the laminate.
（発明が解決しようとする課題）
本発明は、上記の事情に鑑みてなされたもので、半田耐
熱性、耐ミーズリング性に優れ、ふくれや層間剥離のな
い積層板用樹脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and aims to provide a resin composition for laminates that has excellent solder heat resistance and measling resistance, and is free from blistering and delamination. That is.
［発明の構成］
（課題を解決するための手段と作用）
本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、臭素を含まないエポキシ樹脂と難燃性充填剤を
併用することによって上記目的が達成されることを見い
だし、本発明を完成したものである。[Structure of the Invention] (Means and Effects for Solving the Problems) As a result of extensive research to achieve the above object, the present inventor has developed a combination of a bromine-free epoxy resin and a flame-retardant filler. The inventors have discovered that the above object can be achieved by doing so, and have completed the present invention.
すなわち、本発明は、
（Ａ）臭素を含まないエポキシ樹脂と＜Ｂ）水酸化アル
ミニウム、水酸化マグネシウムの１種又は２種以上を選
択した難燃性充填剤とを必須成分とすることを特徴とす
る積層板用樹脂組成物である。That is, the present invention is characterized in that (A) a bromine-free epoxy resin and <B) a flame-retardant filler selected from one or more of aluminum hydroxide and magnesium hydroxide are essential components. This is a resin composition for a laminate.
以下 本発明を説明する。The present invention will be explained below.
本発明に用いる（Ａ）臭素を含まないエポキシ樹脂とし
ては、臭素を含まずに積層板用として使用されているも
のであれば良く、特に制限はない。The bromine-free epoxy resin (A) used in the present invention is not particularly limited as long as it does not contain bromine and is used for laminated boards.
臭素を含有していると半田耐熱性および耐ミーズリング
性が悪くなり好ましくない。If bromine is contained, soldering heat resistance and measling resistance will deteriorate, which is not preferable.
臭素を含まないエポキシ樹脂としては、１分子中に２個
以上のエポキシ基を有するエポキシ樹脂で１例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂、ノボラックエポキシ樹脂等のグリシジルエー
テル型エポキシ樹脂、その他グリシジルエステル型エポ
キシ樹脂、グリシジルアミン型エポキシ樹脂、脂環式エ
ポキシ樹脂、複素環型エポキシ樹脂等が挙げられ、これ
らは単独もしくは２種以上混合して使用することができ
る。Epoxy resins that do not contain bromine include epoxy resins having two or more epoxy groups in one molecule, such as glycidyl ether type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, and others. Examples include glycidyl ester type epoxy resins, glycidylamine type epoxy resins, alicyclic epoxy resins, and heterocyclic epoxy resins, and these can be used alone or in a mixture of two or more types.
本発明に用いる（Ｂ）￥＃燃性充填剤としては、水酸化
アルミニウム及び水酸化マグネシウムの中から１種又は
２種以上選択されたものである。The flammable filler (B) used in the present invention is one or more selected from aluminum hydroxide and magnesium hydroxide.
水酸化アルミニウム、水酸化マグネシウムは通常使用さ
れている充填剤で特に制限はなく広く使用できる。Aluminum hydroxide and magnesium hydroxide are commonly used fillers and can be widely used without any particular restrictions.
本発明の積層板用樹脂組成物は、上述した臭素を含まな
いエポキシ樹脂と、難燃性充填剤とを必須成分とするが
、本発明の目的に反しない限度において、必要に応じて
他の添加剤等を添加配合することができる。 本発明の
積層板用樹脂組成物は、以上の各成分を混合して極めて
容易にＶＡ逍することができる。The resin composition for laminates of the present invention has the above-mentioned bromine-free epoxy resin and a flame-retardant filler as essential components, but other components may be added as necessary to the extent that does not contradict the purpose of the present invention. Additives and the like can be added and blended. The resin composition for laminates of the present invention can be subjected to VA application very easily by mixing the above-mentioned components.
本発明の積層板用樹脂組成物は、臭素を含まないエポキ
シ樹脂を配合したことによって耐熱性の低下をおさえ、
かつ水酸化アルミニウム、水酸化マグネシウムを配合し
て難燃性を向上させ、かつこれらの相乗効果によって半
田耐熱性、耐ミーズリング性に優れた積層板用樹脂組成
物か得られる。The resin composition for laminates of the present invention suppresses a decrease in heat resistance by incorporating a bromine-free epoxy resin,
In addition, aluminum hydroxide and magnesium hydroxide are blended to improve flame retardancy, and the synergistic effect of these makes it possible to obtain a resin composition for laminates having excellent soldering heat resistance and measling resistance.
（実施例） 次に本発明を実施例によって具体的に説明する。(Example) Next, the present invention will be specifically explained with reference to Examples.
実施例 ｌ
ビスフェノールＡ型エポキシ樹脂Ｒ，−３０１（三井石
油化学工業社製、商品名）１００重量部、ジシアンジア
ミド４重量部、２−エチル−４−メチルイミダゾール０
゜１重量部、平均粒径０，５μｌの水酸化アルミニウム
１００重量部及びアセトン適量を加えて均一に撹拌して
フェス（Ａ）を調製しな。Example l Bisphenol A type epoxy resin R,-301 (manufactured by Mitsui Petrochemical Industries, Ltd., trade name) 100 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole 0
゜1 part by weight, 100 parts by weight of aluminum hydroxide having an average particle size of 0.5 μl, and an appropriate amount of acetone were added and stirred uniformly to prepare face (A).
実施例 ２
実施例１において使用した平均粒径０．５μｍの水酸化
アルミニウム１００重量部のうちの５０重量部を、平均
粒径０．５μｍｎの水酸化マグネシウムに置き換えたこ
と以外は、実施例１と同様にしてフェス（Ｂ）を調製し
た。Example 2 Example 1 except that 50 parts by weight of the 100 parts by weight of aluminum hydroxide with an average particle size of 0.5 μm used in Example 1 was replaced with magnesium hydroxide with an average particle size of 0.5 μm. Fes (B) was prepared in the same manner as above.
比較例
臭素化ビスフェノールＡ型エポキシ樹脂Ｒ−２３０（三
井石油化学工業社製、商品名）１００重量部、ジシアン
ジアミド４重量部、２−エチル−４−メチルイミダゾー
ル０．１重量部及びアセトン適量を加えて均一に攪拌混
合し、フェス（Ｃ）を調製した。Comparative Example 100 parts by weight of brominated bisphenol A epoxy resin R-230 (manufactured by Mitsui Petrochemical Industries, Ltd., trade name), 4 parts by weight of dicyandiamide, 0.1 part by weight of 2-ethyl-4-methylimidazole and an appropriate amount of acetone were added. The mixture was stirred and mixed uniformly to prepare a face (C).
実施例及び比較例で得られたフェス（Ａ＞、（Ｂ）及び
（Ｃ）を、厚さ０．１８ｎ１Ｎのガラス布に塗布・含浸
乾燥して樹脂分４０重量％のプリプレグを得な。 この
プリプレグ８枚を重ね、その両１す、すに厚さ１８μ団
の銀箔を重ねて １７０°Ｃで６０分間、４０ｋｇ／
ｃｎ’の条件で加熱加圧して一体に成形し、厚さ １゜
６１１１Ｍの＠張積層板を製）貴した。The fabrics (A>, (B) and (C) obtained in the Examples and Comparative Examples were coated on a 0.18n1N thick glass cloth, impregnated and dried to obtain a prepreg with a resin content of 40% by weight. Layer 8 sheets of prepreg, layer 18μ thick silver foil on each side, heat at 170°C for 60 minutes, 40kg/
They were heated and pressed under the conditions of cn' and molded into one piece to produce a @stretched laminate with a thickness of 1°6111M).
こうして得られた銅張積層板ついて、半田耐熱性、耐ミ
ーズリング性および難燃性について試験を行ったので、
その結果を第１表に示した。 本発明の積層板用樹脂組
成物を用いた銅張積層板は半田耐熱性、耐ミーズリング
性に優れており、本発明の効果が確認された。The copper-clad laminate thus obtained was tested for solder heat resistance, measling resistance, and flame retardancy.
The results are shown in Table 1. Copper-clad laminates using the resin composition for laminates of the present invention had excellent solder heat resistance and measling resistance, confirming the effects of the present invention.
第１表
＊１ ：ＪＩＳ−Ｃ−６４８１に準じ２８０℃の半田
浴面に１０分間浮かべ、フクロの発生の有無を試験した
。Table 1*1: According to JIS-C-6481, the samples were floated on a solder bath surface at 280° C. for 10 minutes and tested for the presence or absence of flakes.
○・・・フクロなし、 ×・・・フクレ有り本２ ：
ＰＣＴ １２０°Ｃ，２気圧、４時間処理後、２６０
°Ｃの半田洛中に３０秒間浸漬後、ミーズリングの発生
の有無を試験した。○...No blisters, ×...Bullets Book 2:
PCT 120°C, 2 atm, after 4 hours treatment, 260
After being immersed in Solderaku at °C for 30 seconds, the presence or absence of measling was tested.
Ｏ・・・なし、 Ｘ・・・有り ネ３：ＵＬ法により試験した。O...No, X...Yes 3: Tested by UL method.
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
積層板用樹脂組成物は、半田耐熱性、耐ミーズリング性
および難燃性に優れており、これを用いた銅張積層板は
信頼性に優れており、産業用として好適なものである。[Effects of the Invention] As is clear from the above explanation and Table 1, the resin composition for laminates of the present invention has excellent soldering heat resistance, measling resistance, and flame retardancy. Copper-clad laminates have excellent reliability and are suitable for industrial use.
Claims (1)
アルミニウム及び水酸化マグネシウムの中から１種又は
２種以上を選択した難燃性充填剤とを必須成分とするこ
とを特徴とする積層板用樹脂組成物。1. A laminate characterized in that the essential components are (A) an epoxy resin that does not contain bromine and (B) a flame-retardant filler selected from one or more of aluminum hydroxide and magnesium hydroxide. Resin composition for boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27007288A JPH02117912A (en) | 1988-10-26 | 1988-10-26 | Resin composition for laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27007288A JPH02117912A (en) | 1988-10-26 | 1988-10-26 | Resin composition for laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02117912A true JPH02117912A (en) | 1990-05-02 |
Family
ID=17481133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27007288A Pending JPH02117912A (en) | 1988-10-26 | 1988-10-26 | Resin composition for laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02117912A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
| US5338567A (en) * | 1990-06-08 | 1994-08-16 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for metal deposition |
| GB2286363A (en) * | 1994-02-10 | 1995-08-16 | Belfield Mfg Ltd | Producing limited fire hazard epoxide glass laminates |
| CN100425766C (en) * | 2005-02-23 | 2008-10-15 | 住江织物株式会社 | Flame-retardant fabric and method for manufacturing the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918929A (en) * | 1972-06-13 | 1974-02-19 | ||
| JPS562340A (en) * | 1979-06-19 | 1981-01-12 | Matsushita Electric Ind Co Ltd | Flame-retardant thermosetting resin composition |
| JPS5628238A (en) * | 1979-07-17 | 1981-03-19 | Gen Electric | Refractory glass base epoxy resin laminate |
| JPS56126187A (en) * | 1980-03-10 | 1981-10-02 | Canon Inc | Warning system |
| JPS63168439A (en) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for laminated sheet |
-
1988
- 1988-10-26 JP JP27007288A patent/JPH02117912A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918929A (en) * | 1972-06-13 | 1974-02-19 | ||
| JPS562340A (en) * | 1979-06-19 | 1981-01-12 | Matsushita Electric Ind Co Ltd | Flame-retardant thermosetting resin composition |
| JPS5628238A (en) * | 1979-07-17 | 1981-03-19 | Gen Electric | Refractory glass base epoxy resin laminate |
| JPS56126187A (en) * | 1980-03-10 | 1981-10-02 | Canon Inc | Warning system |
| JPS63168439A (en) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for laminated sheet |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
| US5338567A (en) * | 1990-06-08 | 1994-08-16 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for metal deposition |
| GB2286363A (en) * | 1994-02-10 | 1995-08-16 | Belfield Mfg Ltd | Producing limited fire hazard epoxide glass laminates |
| GB2286363B (en) * | 1994-02-10 | 1998-01-21 | Belfield Mfg Ltd | A process for producing limited fire hazard epoxide glass laminates |
| CN100425766C (en) * | 2005-02-23 | 2008-10-15 | 住江织物株式会社 | Flame-retardant fabric and method for manufacturing the same |
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