JPH02116746U - - Google Patents
Info
- Publication number
- JPH02116746U JPH02116746U JP2654089U JP2654089U JPH02116746U JP H02116746 U JPH02116746 U JP H02116746U JP 2654089 U JP2654089 U JP 2654089U JP 2654089 U JP2654089 U JP 2654089U JP H02116746 U JPH02116746 U JP H02116746U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- workpiece
- hybrid integrated
- clamping
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図は本考案を説明する図、第３
図乃至第５図は従来例を説明する図である。
図中、１０はリード線固定具、１２はリード線
、１４はハイブリツド集積回路、３０はワーク（
被加工物）、７０はフオトセンサ、７２はワーク
水平保持手段を示す。
Figures 1 and 2 are diagrams explaining the present invention, Figure 3
5 to 5 are diagrams for explaining a conventional example. In the figure, 10 is a lead wire fixture, 12 is a lead wire, 14 is a hybrid integrated circuit, and 30 is a workpiece (
70 is a photo sensor, and 72 is a work horizontal holding means.
Claims (1)
リード線に半田付された複数のハイブリツド集積
回路を、上記リード線固定具から切断分離する装
置に関し、 切断分離前の複数のハイブリツド集積回路を挾
持し、該複数のハイブリツド集積回路とリード線
固定具と複数のリード線とを一体の被加工物即ち
ワークとして水平方向に搬送する搬送手段と、 該搬送手段により搬送されてきた上記ワークの
リード線の位置を基準として上記ワークの水平位
置情報を得る検知手段と、 該水平位置情報に基づいて上記リード線固定具
の内側即ちハイブリツド集積回路側と外側とを挾
持して該リード線固定具を保持し、上記リード線
固定具の内側を基準として上記ワークの水平位置
を特定する挾持手段と を有するハイブリツド集積回路のリード線切断
装置。 (2) 上記リード線固定具の外側を押圧する上記
挾持手段の挾持部は弾性体により支持されている
実用新案登録請求の範囲第１項記載の装置。[Claims for Utility Model Registration] (1) Relating to a device for cutting and separating a plurality of hybrid integrated circuits soldered to a plurality of lead wires fixed to a band-shaped lead wire fixture from said lead wire fixture; a conveying means for holding a plurality of hybrid integrated circuits before separation and horizontally conveying the plurality of hybrid integrated circuits, the lead wire fixing device, and the plurality of lead wires as an integrated workpiece; and the conveying means. a detection means for obtaining horizontal position information of the workpiece based on the position of the lead wire of the workpiece transported by the workpiece; A lead wire cutting device for a hybrid integrated circuit, comprising: clamping means for clamping and holding the lead wire fixture, and specifying the horizontal position of the work with reference to the inside of the lead wire fixture. (2) The device according to claim 1, wherein the clamping portion of the clamping means that presses the outside of the lead wire fixing device is supported by an elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2654089U JPH02116746U (en) | 1989-03-08 | 1989-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2654089U JPH02116746U (en) | 1989-03-08 | 1989-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116746U true JPH02116746U (en) | 1990-09-19 |
Family
ID=31248261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2654089U Pending JPH02116746U (en) | 1989-03-08 | 1989-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116746U (en) |
-
1989
- 1989-03-08 JP JP2654089U patent/JPH02116746U/ja active Pending
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