JPH02116122U - - Google Patents
Info
- Publication number
- JPH02116122U JPH02116122U JP2325189U JP2325189U JPH02116122U JP H02116122 U JPH02116122 U JP H02116122U JP 2325189 U JP2325189 U JP 2325189U JP 2325189 U JP2325189 U JP 2325189U JP H02116122 U JPH02116122 U JP H02116122U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- input part
- saw element
- saw
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は、本考案に係るＳＡＷレゾネータを用
いた回路装置の一実施例を示す斜視図、第２図は
、第１図に示される例の回路構成図、第３図は第
１図に示される例の変形例である。
２……回路基板、３……ＩＣ、４……ＳＡＷ素
子（ベアチツプ）、５ａ，５ｂ……１ＰＦコンデ
ンサ、６……基体、７ａ，７ｂ……パターン（裏
面）、８ａ，８ｂ……パターン（表面）。
FIG. 1 is a perspective view showing an embodiment of a circuit device using a SAW resonator according to the present invention, FIG. 2 is a circuit configuration diagram of the example shown in FIG. 1, and FIG. 3 is the same as that shown in FIG. Figure 3 is a variation of the example shown. 2... Circuit board, 3... IC, 4... SAW element (bare chip), 5a, 5b... 1PF capacitor, 6... Base, 7a, 7b... Pattern (back side), 8a, 8b... Pattern ( surface).
Claims (1)
チツプ形状のＳＡＷ素子およびＩＣとを備え、前
記ＳＡＷ素子はＩＣの入力部に接続されると共に
、その入力部と接地間にコンデンサが付加される
ことを特徴とするＳＡＷレゾネータを用いた回路
装置。 It comprises a circuit board, a bare chip-shaped SAW element and an IC placed on the circuit board, the SAW element is connected to an input part of the IC, and a capacitor is added between the input part and ground. A circuit device using a SAW resonator characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2325189U JPH02116122U (en) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2325189U JPH02116122U (en) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116122U true JPH02116122U (en) | 1990-09-18 |
Family
ID=31242083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2325189U Pending JPH02116122U (en) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116122U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147317A (en) * | 1981-03-09 | 1982-09-11 | Toshiba Corp | Surface acoustic wave resonator structure |
-
1989
- 1989-02-28 JP JP2325189U patent/JPH02116122U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147317A (en) * | 1981-03-09 | 1982-09-11 | Toshiba Corp | Surface acoustic wave resonator structure |