JPH02114441U - - Google Patents

Info

Publication number
JPH02114441U
JPH02114441U JP2353189U JP2353189U JPH02114441U JP H02114441 U JPH02114441 U JP H02114441U JP 2353189 U JP2353189 U JP 2353189U JP 2353189 U JP2353189 U JP 2353189U JP H02114441 U JPH02114441 U JP H02114441U
Authority
JP
Japan
Prior art keywords
board
vacuum suction
workpiece
placing
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2353189U
Other languages
English (en)
Other versions
JP2507213Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989023531U priority Critical patent/JP2507213Y2/ja
Publication of JPH02114441U publication Critical patent/JPH02114441U/ja
Application granted granted Critical
Publication of JP2507213Y2 publication Critical patent/JP2507213Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Belt Conveyors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Jigs For Machine Tools (AREA)

Description

【図面の簡単な説明】
第１図は本考案の真空吸着盤の応用例を示す縦
断面図である。 符号の説明、１……真空吸着盤、１ａ……設置
面（吸着面）、１ｂ……溝、２……ワーク（ウエ
ハー）、３……吸気管、４……測定装置本体、４
ａ……基準面、５……バネ、６……固定具、７…
…導電線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 加工乃至物性測定用ワークを真空吸着力により
    盤面に安置する為の盤であつて、該盤が体積固有
    抵抗値１０〜１０５Ω・cmの半導電性セラミツク
    スより成ることを特徴とする真空吸着盤。
JP1989023531U 1989-02-28 1989-02-28 半導体ウエハ−の加工、測定用真空吸着盤 Expired - Lifetime JP2507213Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989023531U JP2507213Y2 (ja) 1989-02-28 1989-02-28 半導体ウエハ−の加工、測定用真空吸着盤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989023531U JP2507213Y2 (ja) 1989-02-28 1989-02-28 半導体ウエハ−の加工、測定用真空吸着盤

Publications (2)

Publication Number Publication Date
JPH02114441U true JPH02114441U (ja) 1990-09-13
JP2507213Y2 JP2507213Y2 (ja) 1996-08-14

Family

ID=31242600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989023531U Expired - Lifetime JP2507213Y2 (ja) 1989-02-28 1989-02-28 半導体ウエハ−の加工、測定用真空吸着盤

Country Status (1)

Country Link
JP (1) JP2507213Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275513A (ja) * 1992-03-27 1993-10-22 Kyocera Corp 半導体ウェハ保持装置
JP2002015977A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 基板ホルダー
JP2009055017A (ja) * 2007-07-30 2009-03-12 Kyocera Corp 保持用治具およびそれを用いた吸着装置
WO2009141113A1 (de) * 2008-05-21 2009-11-26 WINKLER+DüNNEBIER AG Transportriemen mit vermindertem schüsseleffekt

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61197498U (ja) * 1985-05-29 1986-12-09
JPS6372139A (ja) * 1986-09-12 1988-04-01 Toshiba Seiki Kk 半導体チツプの載置台

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61197498U (ja) * 1985-05-29 1986-12-09
JPS6372139A (ja) * 1986-09-12 1988-04-01 Toshiba Seiki Kk 半導体チツプの載置台

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275513A (ja) * 1992-03-27 1993-10-22 Kyocera Corp 半導体ウェハ保持装置
JP2002015977A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 基板ホルダー
JP2009055017A (ja) * 2007-07-30 2009-03-12 Kyocera Corp 保持用治具およびそれを用いた吸着装置
WO2009141113A1 (de) * 2008-05-21 2009-11-26 WINKLER+DüNNEBIER AG Transportriemen mit vermindertem schüsseleffekt

Also Published As

Publication number Publication date
JP2507213Y2 (ja) 1996-08-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term