JPH0211348U - - Google Patents

Info

Publication number
JPH0211348U
JPH0211348U JP8891988U JP8891988U JPH0211348U JP H0211348 U JPH0211348 U JP H0211348U JP 8891988 U JP8891988 U JP 8891988U JP 8891988 U JP8891988 U JP 8891988U JP H0211348 U JPH0211348 U JP H0211348U
Authority
JP
Japan
Prior art keywords
metal layer
package
housing
metallized
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8891988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8891988U priority Critical patent/JPH0211348U/ja
Publication of JPH0211348U publication Critical patent/JPH0211348U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)
JP8891988U 1988-07-04 1988-07-04 Pending JPH0211348U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8891988U JPH0211348U (enrdf_load_stackoverflow) 1988-07-04 1988-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8891988U JPH0211348U (enrdf_load_stackoverflow) 1988-07-04 1988-07-04

Publications (1)

Publication Number Publication Date
JPH0211348U true JPH0211348U (enrdf_load_stackoverflow) 1990-01-24

Family

ID=31313477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8891988U Pending JPH0211348U (enrdf_load_stackoverflow) 1988-07-04 1988-07-04

Country Status (1)

Country Link
JP (1) JPH0211348U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014457A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014457A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ

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