JPH02112839A - Header working use liner for lead wire and header working method for lead wire - Google Patents

Abstract

PURPOSE:To improve the wear resistance of a liner material by forming a wear resistance thin film of a specific component to specific thickness on the surface which comes into contact with a head of the liner material. CONSTITUTION:A wear resistance thin film of 0.5-5mum thickness consisting of one kind of TiN, AlN, BN, WC, Si3N4, SiC and TiCN is formed on the surface which comes into contact with at least a head of a liner material by a PVD or CVD method. As a result, wear of the liner material decreases remarkably, and a large quantity of headers can be worked with high accuracy. At the time of executing header working of a lead wire by using this liner 1, a lead wire 6 is held by a holding block 5, and by a pressure block having a hole, a first stage header 3 is brought to forming working. Subsequently, the liner 1 on which a wear resistance thin film 7 is formed is inserted into the front of a first stage header 3, and pressing a pressure block 4 having no hole against the tip of the lead wire 6, a second stage header 2 is brought to forming working. By repeating continuously such header working, working of a large quantity of headers is executed.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention relates to a liner that has significantly improved abrasion resistance of a liner material used for processing headers of lead wires for electronic components, and a method for processing headers of lead wires using the liner. It's about how to do it.

[Prior art and its section B] Lead wires used in electronic components, especially diodes, etc.
Long wire rods are cut to a certain size, the ends of which are processed into headers in the shape of nail heads, and two wires are combined, and Si chips, etc. are sandwiched between the left and right sides of the flat portions of each wire and adhered by soldering. It is used in the process of molding the entire adhesive part with resin or the like.

This lead wire is generally a copper wire whose surface is plated with Ag or Ni so that it is suitable for heat treatment and soldering during use. The plating thickness is 1 to 10.1111 in Ag.
For Ni, it is about 0.5 to 5-, and the wire diameter is 0.5
Those with a diameter of ~1.5 mm are often used. Further, the header processing described above is performed at high speed, and the head at the tip has one or two stages depending on the application. In the two-stage header processing, a liner is used, and various tool steels are used as the material for the liner.

When machining a two-stage header of a lead wire with a conventional tool steel liner, the friction of the head forming part causes significant wear on the liner surface, and in particular, the header machining of Ni-plated wire is about 1/1 that of machining of Ag-plated wire. The liner life was 10 to 1/100 times shorter, resulting in poor productivity and a major cause of cost increase.

In order to improve the abrasion, there is a method of using a carbide liner material, but in this case, the liner is prone to cracking or other damage, and further improvements have been desired.

[Problem to be solved by the invention]

As a result of studies on the above-mentioned problems, the present invention has been developed to provide a liner with excellent wear resistance for use in header processing of lead wires for electronic components, etc., and a liner for lead wires that can be used to process lead wires with high productivity using the liner. This is a processing method developed.

(Means and effects for solving problem i1) The present invention provides at least the surface of the liner material that contacts the head with TiN, A j! N, B N by PVD or CVD method.
Claim 1 provides a liner for processing a lead wire header, characterized in that a wear-resistant thin film with a thickness of 0.5 to 5 μm made of at least one of WC, SiSN4, SiC, and T1CN is formed; The wire is fed in from one side, the gripping prong grips the lead wire, the pressing block with holes presses the lead wire to perform the first header processing, and then a wear-resistant thin film is applied to the front of the first stage header. Claim 2 provides a method for processing a lead wire header, which comprises inserting a liner formed with a hole and pressing a pressure block without holes on the tip of the lead wire to perform a second stage header processing. .

That is, the present invention applies PVD or CVD to at least the surface of a liner material such as SKH that comes into contact with the molding head.
How to grin, TiN,, A/! Nt, BN, W
At least 11 of C, S 1xNa, SiC, T1CN
1, a wear-resistant thin film with a thickness of 0.5 to 5 μm is formed to significantly reduce the wear of the liner material.

However, in addition to the above-mentioned SKH, SKD is also used as a liner material.
, SKS, SNMC, and other iron-based alloy tool steels are applicable. Further, a thin film is formed on the above-mentioned liner material by a method such as PVD or CVD, and it is more economical to provide it on the surface that contacts the head, but it may be provided on the entire surface depending on the case. Furthermore, TiN, A/! N,WC,S i,N,
, SiC, T1CN, etc., may be any one of them or a mixture of two or more thereof. And its thickness is 0.
A range of 5 μm is appropriate; if it is less than 0.5 μm, the effect of improving wear resistance is small, and if it is more than 5 μm, the effect is saturated and it is uneconomical.

When header processing of lead wires is performed using the liner on which the wear-resistant film of the present invention is formed, only the surface of the helagoo is hardened by the above-mentioned wear-resistant film, so there will be no damage such as cracks during use, and there will be no wear. Significantly reduced, highly accurate,
It becomes possible to process a large amount of headers. It is particularly effective in machining two-stage heads, which have severe machining conditions.

〔Example〕

An embodiment of the present invention will be described below.

5KH-9 was used as the liner material, and the part where the hender contacts ((blade surface) of the liner in Figures 1 and 2)
A liner having a wear-resistant thin film was prepared by forming a 3 μm thin film of TiN using the PVD method.

Using the above-mentioned liner of the present invention, head processing of a lead wire was performed according to the processing method of the present invention shown in FIG. 1UA and FIG.

First, the lead wire (6) is fed in from one side, the lead wire is gripped by the gripping block (5), and the first stage header (3) is formed by a pressing block (not shown) having holes. A wear-resistant thin film (
7) is inserted, and a pressing block (4) without holes is pressed against the tip of the lead wire to form a second stage header (2). A large amount of header processing is performed by continuously repeating such header processing. When using the liner on which the abrasion-resistant thin film of the present invention is formed,
Approximately 1.5 million 11I+1φ copper wires with two-stage headers could be processed with high precision.

For comparison, when a conventional tool steel 5KH-8 was used as a liner and processed in the same manner as above, the life of the liner was approximately 300,000 pieces. In addition, when similar processing was performed using a liner made of carbide material, some products withstood the processing of about 2 million lines, but they often cracked and could not be put to practical use.

[Effects] As explained above, according to the present invention, the wear resistance of the liner material for header processing of lead wires used for electronic parts etc. is greatly improved, and the header processing method using this liner material is improved. According to the company, the lead wire header processing is accurate and
It can be processed in large quantities and has significant industrial effects.

[Brief explanation of drawings]

FIG. 1 is a side view illustrating a header processing method according to an embodiment of the present invention. 1...Liner 1st stage header holding block, F! film. 2... 2nd stage header 3... 4... Pressing bronc, 5... Grip

Claims (2)

[Claims] (1) TiN, AlN, BN,
A liner for processing a lead wire header, characterized in that a wear-resistant thin film with a thickness of 0.5 to 5 μm is formed from at least one of WC, Si_3N_4, SiC, and TiCN. (2) Feed the lead wire from one side, grip the lead wire with a gripping block, press the lead wire with a pressing block with a hole of a certain depth to perform the first-stage header processing, and then perform the first-stage header processing. A method for processing a header of a lead wire, which is characterized by inserting a liner on which a wear-resistant thin film is formed in front of the header, and pressing a pressure block without holes against the tip of the lead wire to perform a second stage of header processing.