JPH02112201A - Thick film hybrid integrated circuit - Google Patents
Thick film hybrid integrated circuitInfo
- Publication number
- JPH02112201A JPH02112201A JP63263908A JP26390888A JPH02112201A JP H02112201 A JPH02112201 A JP H02112201A JP 63263908 A JP63263908 A JP 63263908A JP 26390888 A JP26390888 A JP 26390888A JP H02112201 A JPH02112201 A JP H02112201A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- resistor
- integrated circuit
- hybrid integrated
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 21
- 230000001681 protective effect Effects 0.000 claims 3
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 5
- 239000012212 insulator Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 208000034656 Contusions Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は厚膜混成集積回路に係り、厚膜抵抗体の抵抗値
の安定化に好適な厚膜混成集積回路ｉｊ’ｊｉ品質化、
高質化性化に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a thick film hybrid integrated circuit, and relates to a thick film hybrid integrated circuit suitable for stabilizing the resistance value of a thick film resistor.
Regarding quality improvement.
従来の厚膜混成集積回路の厚膜抵抗体の形成力法は実開
昭６２−３４．４０２ シシにｌｔｄ載のような厚膜抵
抗体」二にカラス絶縁体を印刷して形成しただけのもの
が一般的であった。The conventional method for forming a thick film resistor in a thick film hybrid integrated circuit is to simply print a glass insulator on a thick film resistor such as that published in Utility Model Application Publication No. 62-34.402. things were common.
上記従来技術は厚膜抵抗体−ヒにカラス絶縁体を印刷し
たたけて製品とするものか多く、この場合製品の取り扱
いに際して製品組！ノ、か触扛合い厚膜抵抗体」二のカ
ラス絶縁体に引きかき傷や打ち傷か発生し、抵抗値が変
化してしまい、回路機能が損なわれる問題かあった。特
に厚膜混成集積回路にてファンクション］・リミングを
１Ｊなっている製品については、抵抗値のオ）ずかな変
化により特性値大幅に変化してしまい製品か全（機能し
なくなり、大きな問題かあ一〕た２、
本発明の目的は−Ｆ記問題に対し安値なしかも容易な方
法にて低抗体−１−のカラス絶縁体の傷防止を図り、抵
抗値の変動を無くすことにある。In most of the above conventional technologies, the product is made by printing a glass insulator on a thick film resistor.In this case, when handling the product, it is difficult to assemble the product. There was a problem with scratches and bruises on the second glass insulator, which caused the resistance value to change and the circuit function to be impaired. Especially for thick film hybrid integrated circuit products with 1J function and rimming, a small change in resistance value can significantly change the characteristic value, causing the product to malfunction and cause a major problem. 1) and 2) The object of the present invention is to prevent damage to the glass insulator of low antibody -1- by a cheap and easy method for the problem described in -F, and to eliminate fluctuations in resistance value.
上記目的は、１１（抗体１−ユのかラス絶縁体部を衝撃
吸収させる材料にて保護することにより達成される。The above object is achieved by protecting the lath insulator portion of the antibody 11 with a shock-absorbing material.
抵抗体１−のカラス絶縁体部に傷をつけたときの抵抗値
変動は、１入坑体とカラス絶縁体か相＋Ｚ ）、： ７
容融和を形成しているため、ガラス絶縁体の一部に傷が
つくと抵抗体部にまで影響を！ｊえてしまうことにより
生ずる。しかもカラス絶縁体は抵抗体より低温にて焼成
するため軟質のカラスを用いており、傷つき易い性質を
もっている。そこでカラス絶縁体と溶融相を形成しない
衝撃吸収力のある樹脂膜で保護することが効果的であり
、レジンを印刷により形成することが量産を図る」二で
最適である。When the crow insulator part of resistor 1- is scratched, the resistance value change is as follows:
Since the glass insulator is made of a flexible material, if a part of the glass insulator gets scratched, it will affect the resistor! It is caused by the fact that the person loses consciousness. Moreover, since the glass insulator is fired at a lower temperature than the resistor, it uses soft glass and is easily damaged. Therefore, it is effective to protect the glass insulator with a resin film that has a shock-absorbing ability that does not form a molten phase, and forming it by printing resin is optimal for mass production.
以下、本発明の一実施例を第１図、第２図と第３図によ
り説明する。An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3.
第１図は断面図を示す。全体の構成はセラミック基板上
に印刷により厚膜導体を形成したのち、これに接する厚
膜抵抗体、さらにはこの上部にガラス絶縁体を印刷によ
り形成する。つぎに厚膜抵抗体上部のガラス絶縁体」二
にレシン印刷体を形成させる。FIG. 1 shows a cross-sectional view. The overall structure consists of forming a thick film conductor by printing on a ceramic substrate, a thick film resistor in contact with the conductor, and then forming a glass insulator on top of the thick film conductor by printing. Next, a resin print is formed on the glass insulator on the thick film resistor.
第２図は第１図の平面図の一例を示す。本図はファンク
ショントリミングしていない抵抗体のレシン印刷に関す
るもので、厚膜抵抗体全体を樹脂膜で保護したものであ
る。FIG. 2 shows an example of the plan view of FIG. This figure relates to resin printing of a resistor without function trimming, and the entire thick film resistor is protected with a resin film.
第３図は第１図の平面図の他の例を示す。本図はファン
クション１へリミングする抵抗体のレジン印刷に関する
もので、この場合は部品を搭載後に厚膜抵抗体を１−リ
ミングを行なう必要があるためレジン印刷体にトリミン
グ開口部を設け、それ以外の厚膜抵抗体を樹脂膜で保護
したものである。FIG. 3 shows another example of the plan view of FIG. 1. This figure relates to resin printing of a resistor to be trimmed to function 1. In this case, it is necessary to perform 1-rimming of the thick film resistor after mounting the components, so a trimming opening is provided in the resin print, and other The thick film resistor is protected with a resin film.
以」二、実施例に示したように厚膜抵抗体上部のカラス
絶縁体に衝撃吸収力のあるレシン印刷体を形成すること
により、厚膜抵抗体上部のガラス絶縁体の傷発生を防止
することができ、抵抗値変動を無くすために効果かある
。2. As shown in the example, by forming a resin-printed material with impact absorption ability on the glass insulator above the thick film resistor, scratches on the glass insulator above the thick film resistor can be prevented. This is effective in eliminating resistance value fluctuations.
本発明によれば、厚膜抵抗の傷による抵抗値変動が１（
Ｊｉ止てきるのて厚１模混成集積回路の高信頼化に効果
がある。According to the present invention, the resistance value fluctuation due to scratches on the thick film resistor is reduced by 1 (
It is effective in increasing the reliability of a 1-thick hybrid integrated circuit because Ji can be stopped.
第１図は本発明の一実施例の厚膜混成集積回路の縦断面
図、第２図は第１図の平面図の一例、第３図は第１図の
平面図の他の例を示す。
第 １ 同
第２図
第３ 側FIG. 1 is a vertical cross-sectional view of a thick film hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is an example of the plan view of FIG. 1, and FIG. 3 is another example of the plan view of FIG. 1. . 1. Figure 2, 3rd side
Claims (1)
積回路において抵抗体のガラス保護膜上の抵抗体部また
はガラス保護膜全体にレンジ印刷膜を設けたことを特徴
とする厚膜混成集積回路。1. A thick film hybrid integrated circuit in which a glass protective film is formed on a printed resistor, characterized in that a microwave printed film is provided on the resistor portion on the glass protective film of the resistor or on the entire glass protective film. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63263908A JPH02112201A (en) | 1988-10-21 | 1988-10-21 | Thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63263908A JPH02112201A (en) | 1988-10-21 | 1988-10-21 | Thick film hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02112201A true JPH02112201A (en) | 1990-04-24 |
Family
ID=17395936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63263908A Pending JPH02112201A (en) | 1988-10-21 | 1988-10-21 | Thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02112201A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2418538A (en) * | 2004-09-22 | 2006-03-29 | Vetco Gray Controls Ltd | Thick-film printed circuit |
| EP1654763A1 (en) * | 2003-07-30 | 2006-05-10 | Innochips Technology Co., Ltd. | Complex laminated chip element |
| JP2017058339A (en) * | 2015-09-18 | 2017-03-23 | Smc株式会社 | Pressure sensor |
-
1988
- 1988-10-21 JP JP63263908A patent/JPH02112201A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1654763A1 (en) * | 2003-07-30 | 2006-05-10 | Innochips Technology Co., Ltd. | Complex laminated chip element |
| EP1654763A4 (en) * | 2003-07-30 | 2008-01-16 | Innochips Technology Co Ltd | Complex laminated chip element |
| GB2418538A (en) * | 2004-09-22 | 2006-03-29 | Vetco Gray Controls Ltd | Thick-film printed circuit |
| JP2017058339A (en) * | 2015-09-18 | 2017-03-23 | Smc株式会社 | Pressure sensor |
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