JPH02111113A - Surface mount type piezoelectric vibrator - Google Patents
Surface mount type piezoelectric vibratorInfo
- Publication number
- JPH02111113A JPH02111113A JP26343488A JP26343488A JPH02111113A JP H02111113 A JPH02111113 A JP H02111113A JP 26343488 A JP26343488 A JP 26343488A JP 26343488 A JP26343488 A JP 26343488A JP H02111113 A JPH02111113 A JP H02111113A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric vibrator
- joined part
- solder
- metallic ball
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器の小型、′ｇＪ型化の趨勢から要請
される、電子回路の高密度化に供するもので、そのプリ
ント基板等の上にマウントする表面実装に好適な薄型の
圧電振動子ユニットに関するもので、特にプリントｕ板
等の上にマウントする際に生しる歪みの緩和のための構
造に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention is used to increase the density of electronic circuits, which is required due to the trend of miniaturization and gJ type electronic equipment. The present invention relates to a thin piezoelectric vibrator unit that is suitable for surface mounting and particularly relates to a structure for alleviating distortion that occurs when mounting on a printed U board or the like.
本発明は、圧電振動子を基板上にマウントする際の歪み
の緩和のために）妾合部に突起を設ける構造を提供する
ことにある。An object of the present invention is to provide a structure in which a protrusion is provided on a mating portion (in order to alleviate distortion when mounting a piezoelectric vibrator on a substrate).
従来、薄型圧電振動子は第２図に示す断面図のようにケ
ースｌの底面１′に接合部２が長手方向の両側に設けら
れており、導電を兼ねて固着する接合部２は平坦であっ
た。Conventionally, a thin piezoelectric vibrator is provided with joints 2 on both sides in the longitudinal direction on the bottom surface 1' of a case l, as shown in the cross-sectional view of FIG. there were.
この従来の薄型圧？ｉｌｔ振動子は第５図に示すように
、基板３の表面の電極パターン４にハンダ５を介して接
合されていた。This traditional thin pressure? The ILT vibrator was bonded to an electrode pattern 4 on the surface of a substrate 3 via solder 5, as shown in FIG.
しかし、この方法ではハンダ■が多くなると接合部２の
横へはみ出してしまい、ハンダ５が固まる際の収縮によ
り、ケース１とそれに収容された圧電振動片に応力がか
かり特性に著しい悪影響を及ぼすことがあった。また、
ハンダの量を制御することも困難であるという問題点が
あった。However, with this method, if the solder 5 increases, it will protrude to the side of the joint 2, and as the solder 5 hardens, it will shrink, which will put stress on the case 1 and the piezoelectric vibrating piece housed in it, which will have a significant negative effect on the characteristics. was there. Also,
There was also a problem in that it was difficult to control the amount of solder.
前記問題点を解決するために、本発明では圧電振動子の
ケースの底面の接合部に銅などの金属の球を埋め込むこ
とにより解決するものである。In order to solve the above-mentioned problem, the present invention solves the problem by embedding a metal ball such as copper in the joint part of the bottom surface of the case of the piezoelectric vibrator.
上記金属球を中心とする固化応力により、圧電振動子の
長手方向に生しる応力歪みを軽減し、基キ反上にマウン
ト、するものである。Due to the solidification stress centered on the metal sphere, stress strain occurring in the longitudinal direction of the piezoelectric vibrator is reduced, and the piezoelectric vibrator is mounted on the substrate.
以下に、本発明の実施例を第１図、第３図、第４図の各
断面図により説明する。Embodiments of the present invention will be described below with reference to sectional views shown in FIGS. 1, 3, and 4.
第１図は本発明の薄型圧電振動子の側面方向からの断面
を示すもので、水晶振動子片７を収容したセラミック等
の絶縁材料でできたケース１の底面１′に接合部２が両
側に設けられている、この接合部２に銅などの金属球３
を埋め込み、突起を設けている。FIG. 1 shows a cross section of the thin piezoelectric vibrator of the present invention from the side direction, in which joints 2 are connected to the bottom surface 1' of a case 1 made of an insulating material such as ceramic, which houses a crystal vibrator piece 7. A metal ball 3 made of copper or the like is attached to this joint 2.
is embedded and has protrusions.
この薄型圧電振動子を回路基板４の面に表面実装した状
態の断面図を第３図に、そしてその接合部２の要部の拡
大図を第４図に示す。FIG. 3 shows a cross-sectional view of this thin piezoelectric vibrator surface-mounted on the surface of the circuit board 4, and FIG. 4 shows an enlarged view of the main part of the joint 2.
第４図で示すように、基板３の平面の電極パターン４と
、接合部２との間は金属球６により一定の間隔が保たれ
、かつハンダ５が固化する収縮時に生じる応力は、金属
球６の中心に集中し、電気的接続と機械的固着を兼ねて
固定される。As shown in FIG. 4, a constant distance is maintained between the electrode pattern 4 on the plane of the substrate 3 and the joint part 2 by the metal balls 6, and the stress generated when the solder 5 hardens and shrinks is absorbed by the metal balls. It is concentrated at the center of 6 and fixed for both electrical connection and mechanical fixation.
本発明は以上のようにケースの底面の接合部に金属球に
よる突起を設けて、法仮固定時に法槻の電極パターンと
接合部の間に一定間隔を設けたことにより、ハンダが鼓
形状になりハンダ量の制御が容易になり、かつ基板に対
するハンダ接触面積が小さくなるために熱収縮による応
力はケース全体に加わるものを緩和することができると
いう効果を有する。As described above, the present invention provides a protrusion made of a metal ball at the joint on the bottom of the case, and by providing a certain distance between the electrode pattern of the bolt and the joint during temporary fixing, the solder forms a drum shape. This makes it easier to control the amount of solder, and since the contact area of the solder to the board becomes smaller, the stress caused by thermal contraction applied to the entire case can be alleviated.
第１図は本発明の薄型圧電振動子の側面方向からの断面
図、第２図は従来からの薄型圧電振動子の側面方向から
の断面図、第３図は本発明の薄型圧電振動子の基板取付
時の側面方向からの断面図、第４図は第３図の接合部の
拡大断面図、第５図は従来からの薄型振動子の基板取付
時の側面方向からの断面図である。
■・・・ケース
１′・・底面
２・・・接合部
３ ・ ・ ・ 基千反・
４・・・電極パターン
５・・・ハンダ
６・・・金属球
７・・・振動子片
８・・・導電接着剤
９・・・シール）第
１０・・・ガラス
オ（街Ｋｇ月の、璋、嘔凭圧１ζ１ｘ針ΦカゴーＯ住キ
任す巳乙第 １ 図
以上
出願人 セイコー電子部品株式会社
代理人 弁理士 林 敬 之 助従采つ゛うの簿
型工窒１Ｋｔ乎の断面図第 ２ 図FIG. 1 is a sectional view from the side of a thin piezoelectric vibrator of the present invention, FIG. 2 is a cross-sectional view of a conventional thin piezoelectric vibrator from the side, and FIG. 3 is a sectional view of the thin piezoelectric vibrator of the present invention. FIG. 4 is an enlarged sectional view of the joint portion of FIG. 3, and FIG. 5 is a sectional view from the side when a conventional thin vibrator is attached to a substrate. ■...Case 1'...Bottom surface 2...Joint part 3 ・ ・ ・ Base 1000 4... Electrode pattern 5... Solder 6... Metal ball 7... Vibrator piece 8... ...Conductive adhesive 9...Seal) No. 10...Glass O (Machi Kg month, Sho, Pressure 1ζ1x Needle Person Patent Attorney Takayuki Hayashi Cross-sectional view of a 1Kt book-type engineered nitrogen with assistant staff Figure 2
Claims (1)
装形圧電振動子において、前記接合部分に金属球を埋め
込んだことを特徴とする表面実装形圧電振動子。1. A surface-mounted piezoelectric vibrator having a bottom surface of a case made of ceramic or the like as a joint part, characterized in that a metal ball is embedded in the joint part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26343488A JPH02111113A (en) | 1988-10-19 | 1988-10-19 | Surface mount type piezoelectric vibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26343488A JPH02111113A (en) | 1988-10-19 | 1988-10-19 | Surface mount type piezoelectric vibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02111113A true JPH02111113A (en) | 1990-04-24 |
Family
ID=17389453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26343488A Pending JPH02111113A (en) | 1988-10-19 | 1988-10-19 | Surface mount type piezoelectric vibrator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02111113A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0939485A1 (en) * | 1998-02-27 | 1999-09-01 | TDK Corporation | Chip device and method for producing the same |
-
1988
- 1988-10-19 JP JP26343488A patent/JPH02111113A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0939485A1 (en) * | 1998-02-27 | 1999-09-01 | TDK Corporation | Chip device and method for producing the same |
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