JPH02110999A - Conductive net for electromagnetic shielding - Google Patents
Conductive net for electromagnetic shieldingInfo
- Publication number
- JPH02110999A JPH02110999A JP26341688A JP26341688A JPH02110999A JP H02110999 A JPH02110999 A JP H02110999A JP 26341688 A JP26341688 A JP 26341688A JP 26341688 A JP26341688 A JP 26341688A JP H02110999 A JPH02110999 A JP H02110999A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- net
- plating
- weave
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 11
- 239000004917 carbon fiber Substances 0.000 claims abstract description 11
- 239000003973 paint Substances 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 17
- 239000010410 layer Substances 0.000 abstract description 13
- 239000000126 substance Substances 0.000 abstract description 9
- 229910052759 nickel Inorganic materials 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 239000000835 fiber Substances 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 229910017052 cobalt Inorganic materials 0.000 abstract description 3
- 239000010941 cobalt Substances 0.000 abstract description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000002356 single layer Substances 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract 3
- 239000002355 dual-layer Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 description 1
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電磁波の遮蔽(反射)に使用する導電性の網
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive net used for shielding (reflecting) electromagnetic waves.
パーソナルコンピュータなどのデジタル装置搭載機器の
筐体は、プラスチック成形品で製作されている場合が多
い。The housings of devices equipped with digital devices, such as personal computers, are often made of plastic molded products.
このプラスチック製筐体は、自由電子をもたない非導電
性であるため、輻射電磁波に透明である。デジタル装置
搭載機器は内蔵の装置から輻射する電磁波を外部に漏洩
して、周辺機器に妨害したり、また、外部の他の機器の
妨害電磁波を機器内部に侵入することを許し、干渉を受
けることがある。This plastic housing is non-conductive and has no free electrons, so it is transparent to radiated electromagnetic waves. Devices equipped with digital devices may leak electromagnetic waves radiated from internal devices to the outside and interfere with peripheral devices, or allow interference electromagnetic waves from other external devices to enter the device, causing interference. There is.
このような不要な電磁波の漏洩、侵入を防止する目的で
、プラスチック製筐体の内面に導電性塗料、金属溶射、
化学メッキ(別称、無電解メッキ)真空蒸着などによる
導電性コーティングが行われている。In order to prevent the leakage and intrusion of such unnecessary electromagnetic waves, the inner surface of the plastic housing is coated with conductive paint, metal spraying,
Conductive coatings are performed by chemical plating (also known as electroless plating), vacuum deposition, etc.
しかし、デジタル装置搭載機器に採用したIC他の部品
から発生する熱を機器外部に放散する必要があり、その
ために放熱用開口部を筐体に設けている。However, it is necessary to dissipate heat generated from ICs and other components used in devices equipped with digital devices to the outside of the device, and for this purpose, openings for heat dissipation are provided in the housing.
さきの導電化コーティングのうち、化学メツキを除く、
導電性塗料による塗装、亜鉛などによる金属溶射とアル
ミニウムなどによる真空蒸着などは全て吹付けによる加
工法のため、この放熱開口部より吹付は材がオーバース
プレーして、導電化コーティングしない裏面(外面)を
汚す。Of the conductive coatings mentioned above, excluding chemical plating,
Painting with conductive paint, metal thermal spraying with zinc, etc., and vacuum deposition with aluminum, etc. are all processed by spraying, so spraying from this heat dissipation opening will overspray the material and cause the back surface (outer surface) not to be coated with conductive coating. defile the
この裏面の汚れ防止の為に、この放熱開口部を養生のマ
スキングを行うが、このマスキングによって、この開口
部とその周辺を導電化コーティングが出来なくなり、不
要電磁波の漏洩や侵入の窓口になってしまう。In order to prevent dirt on the back side, this heat dissipation opening is masked for protection, but this masking prevents the opening and its surroundings from being coated with conductive coating, and becomes a window for leakage and intrusion of unnecessary electromagnetic waves. Put it away.
またメッキは、コストが高いために容易に採用できない
欠点がある。Furthermore, plating has the disadvantage that it cannot be easily adopted due to its high cost.
この不要な電磁波の漏洩や侵入の窓になる放熱開口部を
遮断するための、これまでの対策は、金属製網や穴明き
金属板(パンチングメタル)によって、周辺に加工され
た導電製コーティングに電導接触ができる状態で、開口
部を蔽っている。The conventional measures to block the heat dissipation openings, which serve as windows for leakage and intrusion of unnecessary electromagnetic waves, have been to use metal nets or perforated metal plates (punched metal) to coat the periphery with a conductive coating. covering the opening in such a way that conductive contact can be made to the opening.
しかし、これ等の金属製の電磁波遮蔽効果のある網や穴
明き薄板は、次の欠点がある。However, these metal nets and perforated thin plates that have an electromagnetic wave shielding effect have the following drawbacks.
(1)材質が硬いため、プラスチック製筐体の開口部周
辺の形状に合わせる加工が困難なため周辺までに加工さ
れている導電化コーテイング面にこれらの金属製遮蔽材
を全周囲に導電接触が出来ず、電気的空白ができる。(1) Because the material is hard, it is difficult to process it to match the shape around the opening of the plastic casing. Therefore, it is necessary to apply these metal shielding materials to the conductive coating surface that has been processed up to the periphery so that conductive contact is made around the entire periphery. It cannot be done, and an electrical blank is created.
■ この金属製遮蔽材は、貼り付けられる筐体のプラス
チック成形品と熱膨張率と伸縮のスピードを異にするた
め、(1)の貼り合わせ部分の剥離が起こりやすい。■ This metal shielding material has a different coefficient of thermal expansion and expansion/contraction speed than the plastic molded product of the casing to which it is attached, so the bonded part (1) is likely to peel off.
(31コストが高い。(31 Cost is high.
本発明者はかかる実情に鑑み、鋭意研究の結果、不燃性
の特徴のある炭素繊維あるいはガラス長繊維による綾織
り、絡み織りや平織の網をその表面に、導電性コーティ
ングを施して、使用した場合、前記のような従来の問題
点を解消できることを見出し本発明を完成した。In view of the above circumstances, the inventors of the present invention have conducted extensive research and have developed a method for using twill, twine, or plain weave nets made of carbon fibers or long glass fibers that are nonflammable and coated with a conductive coating on their surfaces. In this case, the present invention has been completed by discovering that the above-mentioned conventional problems can be solved.
すなわち本発明は、化学メッキまたは電気メッキを施し
てなる炭素繊維でできた電磁波遮蔽用導電性網及び銀鏡
反応あるいは銅鏡反応によるメッキを施すか、または導
電性塗料を塗布した後、さらに化学メッキまたは電気メ
ッキを施してなるガラス長繊維でできた電磁波遮蔽用導
電性網を提供するものである。That is, the present invention provides a conductive net for electromagnetic shielding made of carbon fibers which is subjected to chemical plating or electroplating, plating by silver mirror reaction or copper mirror reaction, or coating with conductive paint, and then further chemical plating or electroplating. This invention provides an electromagnetic wave shielding conductive net made of electroplated long glass fibers.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に用いる網としては、炭素繊維またはガラス長繊
維でできたもので、これを綾織り、絡み織りや平織りし
た網が用いられる。The net used in the present invention is made of carbon fibers or long glass fibers, and is made of twill weave, twine weave, or plain weave.
かかる網に導電性を付与(導電化加工)するには、通常
の公知の化学メッキあるいは電気メッキによりその表面
に銅、ニッケル、コバルト、金等の単一金属あるいは合
金による単層あるいは複層のメッキ層を形成することに
より行われる。To impart conductivity to such a net (conductivity processing), a single layer or multiple layers of a single metal or alloy such as copper, nickel, cobalt, or gold is coated on the surface by conventional chemical plating or electroplating. This is done by forming a plating layer.
例えば、炭素繊維による綾織り、絡み織りや平織りの網
に電気メッキまたは、化学メッキ(別称、無電解メッキ
)で銅メッキ層を形成し、その上に同じ電気メッキまた
は化学メッキによるか、他の一方のメッキ法で、先の銅
メッキ層の酸化を防止する目的の、ニッケル、コバルト
や金などによるメッキ層を形成する。For example, a copper plating layer is formed by electroplating or chemical plating (also known as electroless plating) on a twill weave, twine weave, or plain weave net made of carbon fiber, and then a copper plating layer is formed by electroplating or chemical plating or other One plating method involves forming a plating layer of nickel, cobalt, gold, or the like to prevent the previous copper plating layer from oxidizing.
または、銅メッキ層の形成を省いて、ニッケルなどの単
一金属によるか、または合金による単層のメッキ層を形
成して仕上げても良い。Alternatively, the formation of the copper plating layer may be omitted and a single plating layer made of a single metal such as nickel or an alloy may be formed for finishing.
なお、炭素繊維のままで、上記のメッキによる導電性コ
ーティングを行なった後に、綾織り、絡み織りや平織り
による網を製作することでも、この導電性網ができる。Note that this conductive net can also be made by applying the conductive coating using the above-mentioned plating to the carbon fibers as they are, and then manufacturing a net using twill weave, twine weave, or plain weave.
ただし、先きに炭素繊維による網を織った後に、網を導
電化加工した方が遮蔽効果は高い。However, the shielding effect will be higher if the carbon fiber net is woven first and then the net is processed to be conductive.
ただし、繊維としてガラス長繊維を用いる場合は、炭素
繊維と異なって導体でないので電気メッキ時に要する電
流を流しえない、また化学メッキ時には、金属イオンの
置換ができないので前記導電化加工の前に次の前処理を
することが必要である。However, when long glass fibers are used as fibers, unlike carbon fibers, they are not conductors, so the current required for electroplating cannot be passed through them, and metal ions cannot be replaced during chemical plating, so the following steps must be performed before the conductive process: It is necessary to pre-process.
すなわち、ガラス長繊維による綾織り、絡み織りや平織
りの網を、通常公知の銀鏡または、銅鏡の反応により、
まずガラス繊維の表面に、良付着の導電層を形成するか
、またはこの網をチタンカップリング剤または、シラン
カップリング剤を塗付した後に、エポキシ系などの通常
公知の導電性塗料を塗着して、良付着な導電層を形成す
る。In other words, a twill weave, twine weave, or plain weave net made of long glass fibers is made by a reaction with a commonly known silver mirror or copper mirror.
First, a well-adhered conductive layer is formed on the surface of the glass fiber, or a titanium coupling agent or a silane coupling agent is applied to this net, and then a commonly known conductive paint such as epoxy is applied. This forms a conductive layer with good adhesion.
しかる後、前記の導電化加工により、その上にさらにメ
ッキ層を形成する。Thereafter, a plating layer is further formed thereon by the conductive process described above.
このようにして形成される本発明の導電性網は前記のよ
うな従来の欠点を解消するばかりでなく、次のような特
徴を有するものである。The conductive network of the present invention formed in this manner not only eliminates the conventional drawbacks as described above, but also has the following features.
(a)不燃性である。(a) It is nonflammable.
(b)フレキシブルであるので、R面などに全周囲接合
状態で貼れる。(b) Since it is flexible, it can be attached to an R surface etc. with the entire circumference bonded.
(c)裁断が鋏などで容易に出来る。(c) It can be easily cut with scissors.
(d)熱による伸縮が小さいので、貼りあわせ部分の剥
離がない。(d) There is little expansion and contraction due to heat, so there is no peeling of the bonded parts.
(e)金属製遮蔽材に比べて軽い。(e) Lighter than metal shielding materials.
(f)金属製遮蔽材に比べて安い。(f) Cheaper than metal shielding materials.
以下実施例により本発明を具体的に説明する。The present invention will be specifically explained below using Examples.
実施例1
炭素繊維を綾織りしてできた20cm角の網をまずアル
カリ浸漬脱脂、電解脱脂及びトリクロルエチレンの蒸気
による溶剤脱脂の後、下記の浴組成、条件にて銅メッキ
し、水洗の後さらに下記の浴組成、条件にてニッケルメ
ッキを施し、しかる後湯洗し本発明の電磁波遮蔽用導電
性網を得た。Example 1 A 20 cm square mesh made by twilling carbon fibers was first degreased by alkaline immersion, electrolytically degreased, and solvent degreased with trichlorethylene vapor, then copper plated with the following bath composition and conditions, and after washing with water. Further, nickel plating was applied using the bath composition and conditions shown below, and then the conductive net for shielding electromagnetic waves of the present invention was obtained by washing with hot water.
硫酸銅メッキ
浴組成 硫 M 鋼 460g
硫 酸 100g
塩素イオン 120g
水 2¥1
条 件 液 温 25℃電
流密度 1〜4 A / d m”
硫酸ニッケルメッキ
浴組成 硫酸ニラクル 300g塩化アンモ
ニウム 30g水 ウ 酸
30g水 2蔓
条 件 液 温 25℃電
流密度 0.6〜L A / d m”実施例2
ガラス長繊維を綾織りしてできた20c■角の網をまず
アルコール、硝酸水溶液及び塩化第一錫水溶液に浸漬し
て脱脂の後下記の第一液100に第二液25(bywt
)を加えた液中にて銅鏡処理を施した。Copper sulfate plating bath composition Sulfuric acid M Steel 460g Sulfuric acid 100g Chlorine ion 120g Water 2 yen 1 Conditions Liquid temperature 25℃ Current density 1 to 4 A/d m" Nickel sulfate plating bath composition Niracle sulfate 300g Ammonium chloride 30g Water Uric acid
30g water 2 strands Conditions Liquid Temperature 25°C Current density 0.6~L A/dm"Example 2 A 20cm square mesh made by twill weaving long glass fibers was first mixed with alcohol, nitric acid aqueous solution, and dichloride. After degreasing by immersing in a tin aqueous solution, a second liquid 25 (bywt.
) was added to the copper mirror treatment.
炭酸ソーダ 20g
水 2徘
(第2液) ロッシェル塩 60gホルムフルデt
ド 200cc
水 2Yz
水洗の後、実施例1と同様にして鋼メッキ及びニッケル
メッキを施し本発明の電磁波遮蔽用導電性網を得た。Soda carbonate 20g Water 2ml (2nd liquid) Rochelle salt 60g Formfuldet
After washing with 200 cc of water and 2 Yz of water, steel plating and nickel plating were applied in the same manner as in Example 1 to obtain a conductive net for shielding electromagnetic waves of the present invention.
実施例3
2液型エポキシ系の銅粉末含有導電性塗料を実施例2と
同様のガラス長繊維製網にロールコータ−で塗着し、こ
れを硬化させた後に実施例1と同様にして銅メッキ及び
ニッケルメッキを施し、本発明の電磁波遮蔽用導電性網
を得た。Example 3 A two-component epoxy-based conductive paint containing copper powder was applied to the same long glass fiber net as in Example 2 using a roll coater, and after curing, copper powder was coated in the same manner as in Example 1. Plating and nickel plating were performed to obtain the electromagnetic shielding conductive net of the present invention.
2液型エポキシ系銅粉末含有導電性塗料の配合基 剤
どスフzノールA型エポキシ樹脂 125重量部
銅粉(粒径5〜15μm)200重量部超微細シリカ粉
30重量部
ト ル エ ン 50重量部硬化剤
ボ リ ア ミ ド 100重量部ト ル エ
ン 55重量部このようにして得られた実施
例1〜3の導電性網を鋏で裁断し、周囲にEMIシール
ド用導電導電性ニッケル系塗膜ントーケミトロン社製商
品名5bintron E−3063)を形成したC
RTデイスプレーの放熱開口部にニッケル粉混入型導電
性両面粘着テープで貼り付けたフレキシブルであるため
R面に全周囲接合状態で貼ることができ、また、漏洩電
磁波を測定しなところ、導電性網を貼らない場合に比べ
て受信が5〜6μV少なかった。Compounding base for two-component epoxy-based conductive paint containing copper powder Dosufznol A type epoxy resin 125 parts by weight Copper powder (particle size 5-15 μm) 200 parts by weight Ultrafine silica powder 30 parts by weight Toluene 50 Hardener by weight
Boreamide 100 parts by weight Toluene 55 parts by weight The conductive nets of Examples 1 to 3 thus obtained were cut with scissors, and a conductive nickel-based coating film for EMI shielding was applied around them. C that formed the product name 5bintron E-3063 manufactured by Tochemitron Co., Ltd.
Since it is flexible and is attached to the heat dissipation opening of the RT display using conductive double-sided adhesive tape containing nickel powder, it can be attached to the R surface with the entire circumference bonded. The reception was 5 to 6 μV lower than when no screen was attached.
本発明の導電性網は、 (&)不燃性である。 The conductive network of the present invention is (&) Non-flammable.
(b)フレキシブルであるので、R面などに全周囲接合
状態で貼れる。(b) Since it is flexible, it can be attached to an R surface etc. with the entire circumference bonded.
(e)裁断が鋏などで容易に出来る。(e) It can be easily cut with scissors.
(d)熱による伸縮が小さいので、 分の剥離がない。(d) Since the expansion and contraction due to heat is small, There is no peeling.
(e)金属製遮蔽材に比べて軽い。(e) Lighter than metal shielding materials.
(f)金属製遮蔽材に比べて安い。(f) Cheaper than metal shielding materials.
の特徴を有するため、CRTデイスプレーの放熱開口部
等の電磁波遮蔽に好適である。Therefore, it is suitable for shielding electromagnetic waves in heat dissipation openings of CRT displays, etc.
特許出願人 神東塗料株式会社 貼りあわせ部Patent applicant Shinto Paint Co., Ltd. Pasting part
Claims (2)
でできた電磁波遮蔽用導電性網。1. A conductive mesh for shielding electromagnetic waves made of chemically plated or electroplated carbon fiber.
または導電性塗料を塗布した後、さらに化学メッキまた
は電気メッキを施してなるガラス長繊維でできた電磁波
遮蔽用導電性網。2. Apply plating by silver mirror reaction or copper mirror reaction,
Or conductive mesh for shielding electromagnetic waves made of long glass fibers coated with conductive paint and then chemically or electroplated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26341688A JPH02110999A (en) | 1988-10-19 | 1988-10-19 | Conductive net for electromagnetic shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26341688A JPH02110999A (en) | 1988-10-19 | 1988-10-19 | Conductive net for electromagnetic shielding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02110999A true JPH02110999A (en) | 1990-04-24 |
Family
ID=17389189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26341688A Pending JPH02110999A (en) | 1988-10-19 | 1988-10-19 | Conductive net for electromagnetic shielding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02110999A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584788U (en) * | 1992-04-20 | 1993-11-16 | 株式会社大林組 | Electromagnetic wave shield glass |
JP2008542558A (en) * | 2005-05-26 | 2008-11-27 | ゲルチュ,ジェフリー,エイチ. | Electronic helmet |
CN112331378A (en) * | 2020-11-19 | 2021-02-05 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
-
1988
- 1988-10-19 JP JP26341688A patent/JPH02110999A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584788U (en) * | 1992-04-20 | 1993-11-16 | 株式会社大林組 | Electromagnetic wave shield glass |
JP2008542558A (en) * | 2005-05-26 | 2008-11-27 | ゲルチュ,ジェフリー,エイチ. | Electronic helmet |
US8001623B2 (en) | 2005-05-26 | 2011-08-23 | Gertsch Jeffrey H | Electronic helmet |
CN112331378A (en) * | 2020-11-19 | 2021-02-05 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
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