JPH02110343U - - Google Patents
Info
- Publication number
- JPH02110343U JPH02110343U JP1989019705U JP1970589U JPH02110343U JP H02110343 U JPH02110343 U JP H02110343U JP 1989019705 U JP1989019705 U JP 1989019705U JP 1970589 U JP1970589 U JP 1970589U JP H02110343 U JPH02110343 U JP H02110343U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- insulating layer
- copper foil
- rolled copper
- aluminum plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019705U JPH02110343U (enExample) | 1989-02-22 | 1989-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019705U JPH02110343U (enExample) | 1989-02-22 | 1989-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110343U true JPH02110343U (enExample) | 1990-09-04 |
Family
ID=31235452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989019705U Pending JPH02110343U (enExample) | 1989-02-22 | 1989-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110343U (enExample) |
-
1989
- 1989-02-22 JP JP1989019705U patent/JPH02110343U/ja active Pending