JPH02109294A - Thin film el panel - Google Patents
Thin film el panelInfo
- Publication number
- JPH02109294A JPH02109294A JP63261826A JP26182688A JPH02109294A JP H02109294 A JPH02109294 A JP H02109294A JP 63261826 A JP63261826 A JP 63261826A JP 26182688 A JP26182688 A JP 26182688A JP H02109294 A JPH02109294 A JP H02109294A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- thin film
- glass substrate
- back electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 25
- 239000010408 film Substances 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000006059 cover glass Substances 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000011159 matrix material Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野Ｊ
本発明は薄膜Ｅ １１．パネルに関し、特に各種情報の
ティスプｌ／−（をＥＬ（電界発光）で行う薄膜ＥＬマ
トリックス型デイスプレィパネルに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application J The present invention relates to thin film E11. This invention relates to panels, and particularly to thin film EL matrix type display panels that display various information using EL (electroluminescence).
従来、この種の薄膜ＥＬマトリクス型デイスプレィパネ
ルは、ガラスパッケージ構造のものが一般的で、その構
造例を第４図及び第５図を参照しながら説明する。なお
、第４図の左半分はＸ方向の断面図、右半分はＸ方向と
直交するＹ方向の断面図を示す。第４図において、１は
透光性を有するガラス基板、２はガラス基板１上に形成
されたマトリックス型の薄膜ＥＬ素子である。上記薄膜
ＥＴ、素子２において、３はガラス基板１１にＩＴＯ（
酸化インジウムと酸化スズの混晶体）を蒸着法やスパッ
タ法でＸ方向に沿って所定のピッチで形成した多数のス
トライブ状の透明電極、４は透明電極３上を覆うＹ２Ｏ
３等の透明な第一の誘電体層、５は第１の誘電体層４上
に積層形成したＺｎＳ：Ｍｎ等の発光層、６は発光層５
上を覆うＹ２Ｏ３等の透明な第２の誘電体層、７は第２
の誘電体層６上にＹ方向に沿って所定ビッヂで多数のス
トライブ状に形成したＡβ蒸着膜による背面電極である
。Conventionally, this type of thin film EL matrix type display panel has generally had a glass package structure, and an example of this structure will be described with reference to FIGS. 4 and 5. The left half of FIG. 4 is a sectional view in the X direction, and the right half is a sectional view in the Y direction orthogonal to the X direction. In FIG. 4, reference numeral 1 indicates a light-transmitting glass substrate, and reference numeral 2 indicates a matrix-type thin film EL element formed on the glass substrate 1. In FIG. In the thin film ET, element 2, 3 is ITO (
A large number of stripe-shaped transparent electrodes are formed of a mixture of indium oxide and tin oxide) at a predetermined pitch along the X direction by vapor deposition or sputtering, and 4 is Y2O that covers the transparent electrode 3.
3 is a transparent first dielectric layer, 5 is a light emitting layer such as ZnS:Mn laminated on the first dielectric layer 4, and 6 is a light emitting layer 5.
a transparent second dielectric layer such as Y2O3 covering the top;
The back electrode is made of an Aβ vapor deposited film formed in the form of a large number of stripes in predetermined bits along the Y direction on the dielectric layer 6 of FIG.
８はガラス基板１上にエポキシ樹脂等の接着剤９を介し
て固着されて前記薄膜ＥＬ素子２を気密封止する逆皿−
ヒのカバーガラスで、ガラス基板ｌと件に薄膜ＥＬ素子
２を封入する外囲器１０を構成する。１１は薄膜ＥＬ素
子２の耐湿性を向上させるため外囲器ＪＯの内部空間に
充填されたシリコンオイル等の絶縁性保護流体でカバー
ガラス８０部に形成された穴１２から注入され注入後上
記穴１２は蓋板１３で密閉される。Reference numeral 8 denotes an inverted plate which is fixed onto the glass substrate 1 via an adhesive 9 such as epoxy resin to hermetically seal the thin film EL element 2.
The cover glass 1 constitutes an envelope 10 that encloses the thin film EL element 2 between the glass substrate 1 and the glass substrate 1. In order to improve the moisture resistance of the thin film EL element 2, an insulating protective fluid such as silicone oil filled in the inner space of the envelope JO is injected into the hole 12 formed in the cover glass 80 after injection. 12 is sealed with a cover plate 13.
ところで、上記透明電極３と背面電極７の各−端部はガ
ラス基板１の周辺部に延設されて、各々の延設端部はガ
ラス基板１の周辺部上に形成された端子部１４．１５に
重畳接続される。そして第４図Ｘ方向に沿って配設され
た透明電極３側の端子部１４は透明電極３の延設端部上
に重畳して形成され、一方Ｙ方向に沿って配線された背
面電極７側の端子部１５上には背面電極７の延設端部が
重畳して形成される。１６は薄膜ＥＬ素子２の電極外部
引出し用のフレキシブルリードでプラスチックフィルム
１７に銅箔等の外部リード１８を多数被着形成したもの
であり外囲器１０から露出する多数の端子部１４．１５
」二に対応する外部リード１８の端部が半田にて電気的
及び機械的に接続される。By the way, each end of the transparent electrode 3 and the back electrode 7 extends around the periphery of the glass substrate 1, and each extended end is connected to a terminal section 14 formed on the periphery of the glass substrate 1. 15 in a superimposed manner. The terminal portion 14 on the side of the transparent electrode 3 arranged along the X direction in FIG. An extended end portion of the back electrode 7 is formed to overlap with the terminal portion 15 on the side. Reference numeral 16 denotes a flexible lead for leading the electrodes of the thin film EL element 2 to the outside, which is made by adhering a large number of external leads 18 such as copper foil to a plastic film 17, and has a large number of terminal parts 14 and 15 exposed from the envelope 10.
The ends of the external leads 18 corresponding to ``2'' are electrically and mechanically connected with solder.
上述した従来の薄膜ＥＬ素子２の周辺部ではカバーガラ
ス８をガラス基板に固着する接着剤９の収縮力やカバー
ガラス８のそり等により、第６図に示すように背面電極
７が切断され（ｈ部）薄膜ＥＴ、素子２への通電が不能
となり、信頼性も大幅に低下するという欠点があった。At the periphery of the conventional thin film EL element 2 described above, the back electrode 7 is cut off as shown in FIG. Part h) There was a drawback that the thin film ET and the element 2 could not be energized, and the reliability was significantly lowered.
本発明の薄膜ＥＬパネルは背面電極延設部下のガラス基
板に電極膜厚の半分に匹敵する程度の凹凸を設けること
を特徴とする構造を有している。The thin film EL panel of the present invention has a structure characterized in that the glass substrate under the extension of the back electrode is provided with an unevenness comparable to half the thickness of the electrode film.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図の左半分はＸ方向の断面図、右半分はＸ方向の断
面図を示す。第２図は要部拡大断面図である。第１図、
第２図に於いて２１は透光性を有するガラス基板、２２
はガラス基板２１上に形成されたマトリックス型の薄膜
ＥＬ素子である。この薄膜ＥＬ素子２２における２３は
ＩＴＯを蒸着法やスパッタ法でＸ方向に沿って所定のピ
ッチで形成したストライプ状の透明電極、２４は透明電
極２３上を覆うＹ２Ｏ１等の透明な第１絶縁層、２５は
第１絶縁層２４上に形成したＺｎＳ：Ｍｎ等の発光層、
２６は発光層２５上を覆うＹ２Ｏ５等の透明な第２絶縁
層、２７は第２絶縁層２６上にＸ方向に沿って所定のピ
ッチで形成したストライブ状のＡβ蒸着膜による背面電
極である。４０は背面電極２７の延設部下のガラス基板
に設けた電極膜厚の半分に匹敵する程度の凹凸である。The left half of FIG. 1 shows a sectional view in the X direction, and the right half shows a sectional view in the X direction. FIG. 2 is an enlarged sectional view of the main part. Figure 1,
In FIG. 2, 21 is a transparent glass substrate, 22
is a matrix type thin film EL element formed on a glass substrate 21. In this thin film EL element 22, 23 is a striped transparent electrode formed of ITO at a predetermined pitch along the X direction by vapor deposition or sputtering, and 24 is a transparent first insulating layer such as Y2O1 that covers the transparent electrode 23. , 25 is a light emitting layer such as ZnS:Mn formed on the first insulating layer 24,
26 is a transparent second insulating layer such as Y2O5 that covers the light emitting layer 25, and 27 is a back electrode made of a striped Aβ vapor deposited film formed on the second insulating layer 26 at a predetermined pitch along the X direction. . Reference numeral 40 indicates an unevenness comparable to half the thickness of the electrode film provided on the glass substrate under which the back electrode 27 extends.
２８は、ガラス基板２１上にエポキシ樹脂等の接着剤２
９を介して固着されて前記薄膜ＥＬ素子２２を気密封止
する逆皿上のカバーガラスで、ガラス基板２１と共動し
て薄膜ＥＬ素子２２を封入する外囲器３０を構成する。28 is an adhesive 2 such as epoxy resin on the glass substrate 21.
A cover glass on an inverted plate that is fixed via a glass plate 9 to hermetically seal the thin film EL device 22 constitutes an envelope 30 that works together with the glass substrate 21 to enclose the thin film EL device 22 .
３１は薄膜ＥＬ素子２２の耐湿性を向上させるため外囲
器３０の内部空間に充填されたシリコンオイル等の絶縁
性保護流体でカバーガラス２８の一部に形成された穴３
２より注入され、注入後上記穴３２は蓋板３３で密閉さ
れる。Reference numeral 31 denotes a hole 3 formed in a part of the cover glass 28 with an insulating protective fluid such as silicone oil filled in the internal space of the envelope 30 in order to improve the moisture resistance of the thin film EL element 22.
After injection, the hole 32 is sealed with a cover plate 33.
透明電極２３と背面電極２７の各延設端部はガラス基板
（２１）の周辺部上に形成された端子部３４．３５に重
畳接続される。３６は薄膜ＥＬ素子２２の電極外部引出
し用のフレキシブルリードでプラスチックフィルム３７
に銅箔等の外部リード３８を多数被着形成したものであ
り、外囲器３０から露出する多数の端子部３４．３５上
に対応する外部リード３８の端部が半田にて電気的及び
機械的に接続される。The extending ends of the transparent electrode 23 and the back electrode 27 are connected in an overlapping manner to terminal portions 34 and 35 formed on the peripheral portion of the glass substrate (21). 36 is a flexible lead for leading out the electrode of the thin film EL element 22, and a plastic film 37
A large number of external leads 38 made of copper foil or the like are adhered to the surface, and the ends of the external leads 38 corresponding to the large number of terminal parts 34 and 35 exposed from the envelope 30 are soldered to provide electrical and mechanical connections. connected.
第３図は本発明の他の実施例の要部拡大断面図である。FIG. 3 is an enlarged sectional view of a main part of another embodiment of the present invention.
ガラス基板上の凹凸４１を端子部３５の下まで延伸して
いるため、端子部３５とガラス基板２１の密着性も向上
するという利点がある。Since the unevenness 41 on the glass substrate extends below the terminal portion 35, there is an advantage that the adhesion between the terminal portion 35 and the glass substrate 21 is also improved.
〔発明の効果〕
以上説明したように、本発明は薄膜ＥＬパネルの背面電
極延設部下のガラス基板に電極膜厚の半分に匹敵する程
度の凹凸を設けていることにより、一
背面電極延設部とガラス基板の密着度が向上しカバーガ
ラスを力′ラス基板に固着するための接着剤の収縮力や
カバーガラスのそり等による背面電極の切断を回避でき
る効果がある。[Effects of the Invention] As explained above, the present invention provides unevenness equivalent to half of the electrode film thickness on the glass substrate under the back electrode extension of a thin film EL panel. This has the effect of improving the degree of adhesion between the cover glass and the glass substrate, and avoiding cutting of the back electrode due to the shrinkage force of the adhesive for fixing the cover glass to the glass substrate, warping of the cover glass, etc.
第１図は本発明の一実施例に係る薄膜ＥＬパネルを示す
断面図、第２図は第１図の要部拡大断面図、第３図は本
発明の他の実施例を示す要部拡大断面図である。第４図
は薄膜ＥＬパネルの従来例を示す断面図、第５図はその
要部拡大断面図、第６図はその背面電極の延設部分の切
断状態を説明するための要部拡大断面図である。
１．２１・・・・・・透光性ガラス基板、２，２２・・
・・・・薄膜ＥＬ素子、３，２３・・・・・透明電極、
４゜２４・・・・・第１誘電体層、５，２５・・・・・
・発光層、６．２６・・・・・・第２誘電体層、７，２
７・・・・・・背面電極、８，２８・・・・・・カバー
ガラス、９，２９・・・・・・接着剤、１．０．３０・
・・・・外囲器、１１．３１・・・・・・絶縁性保護流
体、１２．３２・・・・・・絶縁性保護流体注入用穴、
１３．３３・・・・・・蓋板、１．４，１５，３４゜３
５・・・・・・端子部、１６．３６・・・・・・フレキ
シブルリード、１．７．３７・・・・・・フレキシブル
リードのプラスチックフィルム、１８．３８・・・・・
フレキシブルリードの外部リード。
代理人 弁理士 内 原 晋Fig. 1 is a sectional view showing a thin film EL panel according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the main part of Fig. 1, and Fig. 3 is an enlarged main part showing another embodiment of the invention. FIG. Fig. 4 is a sectional view showing a conventional example of a thin film EL panel, Fig. 5 is an enlarged sectional view of the main part thereof, and Fig. 6 is an enlarged sectional view of the main part to explain the cutting state of the extended portion of the back electrode. It is. 1.21...Transparent glass substrate, 2,22...
...Thin film EL element, 3,23...Transparent electrode,
4゜24...first dielectric layer, 5,25...
- Light emitting layer, 6.26... Second dielectric layer, 7,2
7...Back electrode, 8,28...Cover glass, 9,29...Adhesive, 1.0.30.
... Envelope, 11.31 ... Insulating protective fluid, 12.32 ... Insulating protective fluid injection hole,
13.33... Lid plate, 1.4, 15, 34°3
5...Terminal part, 16.36...Flexible lead, 1.7.37...Plastic film of flexible lead, 18.38...
External lead of flexible lead. Agent Patent Attorney Susumu Uchihara
Claims (1)
、第２の誘電体層及び背面電極を順次積層してなる薄膜
ＥＬ素子を形成し、上記透明電極及び背面電極を外部に
引出す端子部を透光性基板の周辺部に形成した薄膜ＥＬ
パネルにおいて、背面電極延設部下のガラス基板に電極
膜厚の半分に匹敵する程度の凹凸を設けていることを特
徴とする薄膜ＥＬパネル。A thin film EL element is formed by sequentially laminating a transparent electrode, a first dielectric layer, a light emitting layer, a second dielectric layer, and a back electrode on a transparent substrate, and the transparent electrode and back electrode are connected to the outside. Thin film EL with terminals drawn out on the periphery of a transparent substrate
A thin film EL panel characterized in that a glass substrate under a back electrode extension is provided with an unevenness equivalent to half the electrode film thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261826A JPH02109294A (en) | 1988-10-17 | 1988-10-17 | Thin film el panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261826A JPH02109294A (en) | 1988-10-17 | 1988-10-17 | Thin film el panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02109294A true JPH02109294A (en) | 1990-04-20 |
Family
ID=17367272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63261826A Pending JPH02109294A (en) | 1988-10-17 | 1988-10-17 | Thin film el panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02109294A (en) |
-
1988
- 1988-10-17 JP JP63261826A patent/JPH02109294A/en active Pending
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