JP2000223263A - Electroluminescence(el) - Google Patents

Electroluminescence(el)

Info

Publication number
JP2000223263A
JP2000223263A JP11025607A JP2560799A JP2000223263A JP 2000223263 A JP2000223263 A JP 2000223263A JP 11025607 A JP11025607 A JP 11025607A JP 2560799 A JP2560799 A JP 2560799A JP 2000223263 A JP2000223263 A JP 2000223263A
Authority
JP
Japan
Prior art keywords
resin
substrates
substrate
pair
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11025607A
Other languages
Japanese (ja)
Inventor
Shinobu Nakamura
忍 中村
Yasuhiko Takayama
泰彦 高山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
Original Assignee
Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawaguchiko Seimitsu Co Ltd, Kawaguchiko Seimitsu KK filed Critical Kawaguchiko Seimitsu Co Ltd
Priority to JP11025607A priority Critical patent/JP2000223263A/en
Publication of JP2000223263A publication Critical patent/JP2000223263A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent the life of a luminescent part from being shortened due to the permeation of moisture from a bonding part of an upper glass substrate to a lower glass substrate, and prevent the damage of a pattern caught between the glass substrates from occurring. SOLUTION: A luminescent part 8 composed by laminating a transparent electrode 3, a luminescent layer 5, a dielectric layer 6 and a back electrode 4 is integrally formed on the inside surface of either one resin substrate (1 in Fig.) out of a pair of flat plate-like resin substrates 1, 2 oppositely arranged, resin sealing members 11 is caught between the resin substrate 1 having the formed luminescent part 8 and the opposite resin substrate 2, and the upper and lower resin substrates 1, 2 are welded to the resin sealing members 11 by means of an ultrasonic wave and sealed at welded parts 12. A through-hole 2a is formed in the lower resin substrate 2, and a conductive terminal 2C is installed in it. The lower resin substrate is molded into a box-like shape and welded to the upper resin substrate by means of an ultrasonic wave. Additionally, stepped parts are formed on the upper and lower resin substrates, which are welded to the resin sealing members at the stepped parts by means of an ultrasonic wave. Still additionally, the resin substrates and the resin sealing members are formed of a polycarbonate resin. A moisture permeation preventing effect is improved and EL can be realized at a low cost.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、エレクトロルミネ
ッセンスに関する。
[0001] The present invention relates to electroluminescence.

【0002】[0002]

【従来の技術】近年、エレクトロルミネッセンス(以
下、ELと省略する)は、携帯時計や携帯電話等の電子
表示機器にELがそのバックライト照明用として利用さ
れている。このバックライトとして利用されるELにお
いて、その耐湿性を向上させて寿命を伸ばすためにEL
をガラスで封止する構造のものが一部に現れている。
2. Description of the Related Art In recent years, electroluminescence (hereinafter abbreviated as EL) has been used in electronic display devices such as portable watches and cellular phones for backlight illumination. In the EL used as the backlight, the EL is used to improve the moisture resistance and extend the life.
Some have a structure in which is sealed with glass.

【0003】このガラスで封止する構造の一つとして、
図4に示すものがある。図4は従来のELの構造を示す
断面図である。図4において、EL9は、上ガラス基板
1の下面側に透明電極3、発光層5、誘電体層6、背面
電極4と順次積層形成した発光部8を一体的に設け、こ
の発光部8を上ガラス基板1と下ガラス基板2でもって
絶縁性接着剤7で接着封止した構造を取っている。ま
た、電圧印加用の導通パターンを外部に設けるために上
ガラス基板1に外延部1aを設けて、その外延部1aの
下面に透明電極3の一部分から取り出した導電パターン
3a及び背面電極4の一部分から取り出した図示しない
導電パターンを延設して形成し、この延設したそれぞれ
の導電パターンを介して電圧が印加される構造となって
いる。また、上ガラス基板1と下ガラス基板2の接合に
は熱硬化性の絶縁性樹脂接着剤等が用いられるが、特
に、導電パターン部の所における接合にはパターンの損
傷を防ぐために接着剤層を厚くするなどの配慮が求めら
れている。
As one of the structures sealed with glass,
There is one shown in FIG. FIG. 4 is a sectional view showing the structure of a conventional EL. In FIG. 4, the EL 9 is provided integrally with a light emitting portion 8 formed by sequentially laminating a transparent electrode 3, a light emitting layer 5, a dielectric layer 6, and a back electrode 4 on the lower surface side of the upper glass substrate 1. The upper glass substrate 1 and the lower glass substrate 2 are bonded and sealed with an insulating adhesive 7. Further, an extension 1a is provided on the upper glass substrate 1 in order to provide a conductive pattern for voltage application outside, and a conductive pattern 3a and a part of the back electrode 4 taken out from a part of the transparent electrode 3 on the lower surface of the extension 1a. Are formed by extending conductive patterns (not shown) taken out of the device and applying a voltage through the respective extended conductive patterns. In addition, a thermosetting insulating resin adhesive or the like is used for joining the upper glass substrate 1 and the lower glass substrate 2, and in particular, for joining at the conductive pattern portion, an adhesive layer is used to prevent the pattern from being damaged. Consideration such as thickening is required.

【0004】ここで、透明電極3は上ガラス基板1の下
面上に酸化インジウムに酸化錫をドーピングして得られ
たインジウム・ティン・オキサイド(ITO)粉末を蒸
着方法等で形成される。また、発光層5は、例えば、硫
化亜鉛と銅やマンガン等の活性剤と塩素等の付活剤と
を、例えば、シアノレジン化合物等の高誘電樹脂バイン
ダーに分散して印刷方法等で形成される。また、誘電体
層6は、例えば、チタン酸バリウム等の高誘電物質を、
例えば、シアノレジン化合物等の高誘電樹脂バインダー
に分散して印刷方法等で形成される。また、背面電極4
は銀粉や黒鉛粉をペースト化して印刷方法等で形成され
る。
Here, the transparent electrode 3 is formed by depositing indium tin oxide (ITO) powder obtained by doping indium oxide with tin oxide on the lower surface of the upper glass substrate 1 by a vapor deposition method or the like. In addition, the light emitting layer 5 is formed by, for example, dispersing an activator such as zinc sulfide, copper or manganese, and an activator such as chlorine in a high dielectric resin binder such as a cyanoresin compound by a printing method or the like. . The dielectric layer 6 is made of, for example, a high dielectric substance such as barium titanate.
For example, it is formed by dispersing in a high dielectric resin binder such as a cyanoresin compound or the like by a printing method or the like. Also, the back electrode 4
Is formed by printing silver powder or graphite powder into a paste or the like.

【0005】また、上記発光部8を防湿フィルム等で覆
ってガラス基板に一体化した構造のものも開示されてい
る。
There is also disclosed a structure in which the light emitting section 8 is covered with a moisture-proof film or the like and integrated with a glass substrate.

【0006】また、更に防湿性アップを狙って上記構造
の上下ガラス基板1、2と発光部8との間に空間域にシ
リコンオイル等の防湿油を封入する構造のものも開示さ
れている。
Further, a structure in which a moisture-proof oil such as silicon oil is sealed in a space between the upper and lower glass substrates 1 and 2 and the light-emitting portion 8 for the purpose of further improving the moisture-proof property is disclosed.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、前述し
た従来技術においては次のような問題点を有している。
即ち、上下ガラス基板を封止する手段として樹脂接着剤
を用いて熱硬化封止方法をとっている。そのため熱によ
る封止内部のELに悪影響を及ぼす。同時にどうしても
樹脂接着剤の接着部の所より湿気が浸透し、発光部の発
光寿命を短くすると言う致命的な問題があった。
However, the above-mentioned prior art has the following problems.
That is, as a means for sealing the upper and lower glass substrates, a thermosetting sealing method using a resin adhesive is employed. Therefore, heat adversely affects the EL inside the seal. At the same time, there is a fatal problem that moisture inevitably penetrates from the adhesive portion of the resin adhesive and shortens the light emission life of the light emitting portion.

【0008】また、シリコンオイル等を封入する構造の
ものは寿命を少しアップするものの完全とは言えるもの
ではなく、逆にコストが非常にアップすると言う問題が
あった。
Further, a structure in which silicon oil or the like is sealed has a problem that the life is slightly increased, but it cannot be said to be complete, and the cost is extremely increased.

【0009】また、従来の封止構造は、導通端子をガラ
ス基板の外縁まで延設して封止する構造のため、延設パ
ターンが上下ガラス基板に挟まれいるので接着剤の熱硬
化によって生ずる応力歪みやガラス基板の反り等により
パターンの破損が生じ易い。これを防止するために少し
でも接着剤層を厚く設けて封止するので湿気の進入が増
えることになる。パターンの切断はELの信頼性を著し
く低下させると言う問題があった。
In the conventional sealing structure, the conductive terminals extend to the outer edge of the glass substrate and are sealed. Therefore, since the extended pattern is sandwiched between the upper and lower glass substrates, it is caused by the thermosetting of the adhesive. The pattern is easily damaged due to stress distortion, warpage of the glass substrate, and the like. In order to prevent this, even a little adhesive layer is provided and sealed, so that the penetration of moisture increases. There is a problem that cutting the pattern significantly reduces the reliability of the EL.

【0010】本発明は上記課題に鑑みなされたものであ
り、その目的は、湿気の浸透が完全に防止でき耐湿性に
優れ、発光寿命が飛躍的に向上し、更に、パターンの破
損がなく信頼性に優れたELを安価に提供するものであ
る。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to completely prevent the penetration of moisture, have excellent moisture resistance, drastically improve the luminous life, and furthermore, the pattern is free from breakage and reliable. It is intended to provide an EL having excellent properties at low cost.

【0011】[0011]

【課題を解決するための手段】上記目的を達成するため
に、本発明におけるELは、透明電極と背面電極の2つ
の電極間に発光層と誘電体層を挟設し、両電極に電圧を
印加することによって発光層が発光する発光部を、対向
して配置された一対の基板の何れか一方の基板の内面に
一体的に形成し、前記形成した発光部を前記一対の基板
と封止部材とで封入したエレクトロルミネッセンスにお
いて、前記一対の基板は平板状の樹脂基板より成り、封
止部材は樹脂封止部材より成り、前記一対の樹脂基板と
樹脂封止部材とを超音波溶着して封止したことを特徴と
するものである。
In order to achieve the above object, an EL according to the present invention comprises a light emitting layer and a dielectric layer interposed between two electrodes, a transparent electrode and a back electrode, and a voltage is applied to both electrodes. A light-emitting portion in which the light-emitting layer emits light by applying the light-emitting layer is integrally formed on the inner surface of any one of the pair of substrates disposed opposite to each other, and the formed light-emitting portion is sealed with the pair of substrates. In the electroluminescence encapsulated with the member, the pair of substrates is formed of a flat resin substrate, the sealing member is formed of a resin sealing member, and the pair of resin substrates and the resin sealing member are ultrasonically welded. It is characterized by being sealed.

【0012】また、透明電極と背面電極の2つの電極間
に発光層と誘電体層を挟設し、両電極に電圧を印加する
ことによって発光層が発光する発光部を、対向して配置
された一対の基板の何れか一方の基板の内面に一体的に
形成し、前記形成した発光部を前記一対の基板を接着封
止したエレクトロルミネッセンスにおいて、前記一対の
基板は平板状の樹脂基板とボックス状の樹脂基板とより
成り、2つの樹脂基板を超音波溶着して封止したことを
特徴とするものである。
In addition, a light emitting layer and a dielectric layer are sandwiched between two electrodes, a transparent electrode and a back electrode, and a light emitting portion in which the light emitting layer emits light when a voltage is applied to both electrodes is arranged to face each other. In electroluminescence in which the formed light emitting portion is integrally formed on the inner surface of any one of the pair of substrates and the formed light emitting portion is bonded and sealed to the pair of substrates, the pair of substrates is a flat resin substrate and a box. And two resin substrates are sealed by ultrasonic welding.

【0013】また、前記一対の平板状の上下樹脂基板の
対向する外周部に凹状の段差部を形成し、該段差部で樹
脂封止部材を超音波溶着して封止したことを特徴とする
ものである。
[0013] Further, a concave step portion is formed in the outer peripheral portions of the pair of flat upper and lower resin substrates facing each other, and a resin sealing member is ultrasonically welded and sealed at the step portion. Things.

【0014】また、前記樹脂基板及び樹脂封止部材は共
にポリカーボ樹脂であることを特徴とするものである。
Further, the resin substrate and the resin sealing member are both made of polycarbonate resin.

【0015】また、前記発光部を一体的に形成した基板
にスルーホールを設け、該スルーホールにスルーホール
パターンを形成してスルーホールパターンと接続する導
通端子を設けたことを特徴とするものである。
Further, a through-hole is provided in the substrate on which the light emitting portion is integrally formed, and a through-hole pattern is formed in the through-hole, and a conduction terminal for connecting to the through-hole pattern is provided. is there.

【0016】[0016]

【発明の実施の形態】以下図面に基づいて本発明におけ
るELについて説明する。図1は、本発明の第1の実施
の形態に係わるELの構造を示す断面図である。図にお
いて、従来技術と同一部材は同一符号で示す。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an EL according to the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing the structure of the EL according to the first embodiment of the present invention. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

【0017】図1において、EL10は、平板状の上樹
脂基板1の下面側中央部に、透明電極3、発光層5、誘
電体層6、背面電極4を積層して形成した発光部8が上
樹脂基板1と一体的に設けられている。そして、上樹脂
基板1の外周部で上樹脂基板1と平板状の下樹脂基板2
とが樹脂封止部材11を一周に渡って挟み、両樹脂基板
1、2と樹脂封止部材11とを超音波溶着して溶着部1
2で封止するものである。溶着部12で湿気の進入を防
止することができる。
In FIG. 1, an EL 10 has a light emitting section 8 formed by laminating a transparent electrode 3, a light emitting layer 5, a dielectric layer 6, and a back electrode 4 in the center of the lower surface of a flat upper resin substrate 1. It is provided integrally with the upper resin substrate 1. Then, the upper resin substrate 1 and the flat lower resin substrate 2 are formed around the outer resin substrate 1.
Sandwiches the resin sealing member 11 over the entire circumference, and ultrasonically welds the two resin substrates 1 and 2 and the resin sealing member 11 to the welding portion 1.
2 is used for sealing. The welding portion 12 can prevent moisture from entering.

【0018】前記上樹脂基板1に形成された発光部8よ
り少し離れた位置の下樹脂基板2に小さな2つのスルー
ホール2a(2bは図中省略)が形成され、透明電極3
と導通するスルーホールパターン2A(2Bは図中省
略)が形成されている。また、透明電極3及び背面電極
6からはその一部より延設したパターン3a及び6aが
形成されてそれぞれのスルーホール2a(2b)迄延
び、スルーホールパターン2A(2B)に接続されて突
出した導通端子2C(2Dは図中省略)が形成されてい
る。導通端子2C(2D)を電圧印加用の端子にするこ
とができる。
Two small through holes 2a (2b are omitted in the figure) are formed in the lower resin substrate 2 at a position slightly away from the light emitting portion 8 formed in the upper resin substrate 1, and the transparent electrodes 3 are formed.
A through hole pattern 2A (2B is omitted in the figure) is formed. Further, patterns 3a and 6a extending from a part of the transparent electrode 3 and the back electrode 6 are formed, extend to the respective through holes 2a (2b), and are connected to and protrude from the through hole patterns 2A (2B). A conduction terminal 2C (2D is omitted in the figure) is formed. The conduction terminal 2C (2D) can be a terminal for applying voltage.

【0019】上記した様に、従来のガラス基板の代えて
樹脂基板にし、この樹脂基板と樹脂封止部材とを超音波
溶着で封止した構造にしたもので、封止方法が非常に簡
単で安いコストで製造できる。
As described above, the conventional glass substrate is replaced with a resin substrate, and the resin substrate and the resin sealing member are sealed by ultrasonic welding, so that the sealing method is very simple. Can be manufactured at low cost.

【0020】図2は本発明の第2の実施の形態に係わる
ELの構造を示す要部断面図である。前述した下樹脂基
板をボックス状の樹脂基板にし、封止部材を廃止したも
のであり、図2に示すように、平板状の上樹脂基板1と
ボックス状の下樹脂基板2とを超音波溶着して溶着部1
2で封止したものである。上記した様に、封止部材が不
要となり、溶着箇所が一箇所になる。また、ボックス状
の下樹脂基板2は容易に成形することができる。
FIG. 2 is a cross-sectional view of a main part showing the structure of an EL according to a second embodiment of the present invention. The above-described lower resin substrate is a box-shaped resin substrate, and the sealing member is omitted. As shown in FIG. 2, the flat upper resin substrate 1 and the box-shaped lower resin substrate 2 are ultrasonically welded. And welded part 1
2 sealed. As described above, the sealing member is not required, and the welding location is one. Further, the box-shaped lower resin substrate 2 can be easily formed.

【0021】図3は本発明の第3の実施の形態に係わる
ELの構造を示す要部断面図である。前述した第1の実
施の形態で説明した一対の平板状の上下樹脂基板1、2
の対向する外周部にそれぞれ凹状の段差部13を形成
し、該段差部13で樹脂封止部材11を超音波溶着して
溶着部12で封止したものである。段差部を設けること
によって、もし仮に湿気が進入しても段差部があると一
旦そこで止まり、ストレートに内部に進入することを防
止し、防湿の効果が生ずるものである。
FIG. 3 is a sectional view showing a main part of an EL structure according to a third embodiment of the present invention. The pair of flat upper and lower resin substrates 1 and 2 described in the first embodiment described above.
The stepped portions 13 having a concave shape are respectively formed on the outer peripheral portions facing each other, and the resin sealing member 11 is ultrasonically welded at the stepped portions 13 and sealed with the welded portions 12. By providing the stepped portion, even if moisture enters, if there is a stepped portion, once the stepped portion stops there, it is prevented from entering straight inside, and the effect of moisture prevention is produced.

【0022】また、上述した樹脂基板及び樹脂封止部材
は共にポリカーボ樹脂(例えば、ガラス入りのポリカー
ボ材)を使用することにより湿気浸透防止効果を更に向
上させることができる。
Further, the use of a polycarbonate resin (for example, a polycarbonate material containing glass) for both the resin substrate and the resin sealing member can further improve the moisture permeation prevention effect.

【0023】[0023]

【発明の効果】前述したように、ELの対向する一対の
ガラス基板に代えて平板状の樹脂基板にし、超音波溶着
で封止した構造することにより、コストを安くすること
ができる。
As described above, the cost can be reduced by using a flat resin substrate in place of the pair of glass substrates facing the EL and sealing it by ultrasonic welding.

【0024】また、下樹脂基板をボックス状の樹脂基板
を使用することにより、封止部材が廃止できコストが安
くなり、併せて溶着部を一箇所にすることにより湿気の
浸透箇所を少なくし防湿効果が向上する。
In addition, by using a box-shaped resin substrate for the lower resin substrate, the sealing member can be eliminated and the cost can be reduced. In addition, by using only one welded portion, the location where moisture is permeated can be reduced, and moisture can be prevented. The effect is improved.

【0025】また、封止部に段差部を設けることにより
湿気の進入することを防止し、防湿の効果が向上する。
Further, by providing a step portion in the sealing portion, the invasion of moisture is prevented, and the effect of preventing moisture is improved.

【0026】また、樹脂基板及び樹脂封止部材を共にポ
リカーボ樹脂に代え湿気浸透防止効果を更に向上させる
ことができる。
Further, both the resin substrate and the resin sealing member can be replaced with polycarbonate resin to further improve the effect of preventing moisture penetration.

【0027】また、スルーホール部から導通端子を取り
出し、EL外域を密封する構成により、パターンの破損
がなく信頼性の優れたELを提供することができる。
In addition, since the conductive terminal is taken out from the through-hole portion and the outer region of the EL is sealed, it is possible to provide an EL having excellent reliability without breakage of the pattern.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態に係わるELの構造
を示す断面図である。
FIG. 1 is a cross-sectional view illustrating a structure of an EL according to a first embodiment of the present invention.

【図2】本発明の第2の実施の形態に係わるELの構造
を示す要部断面図である。
FIG. 2 is a cross-sectional view of a main part showing a structure of an EL according to a second embodiment of the present invention.

【図3】本発明の第3の実施の形態に係わるELの構造
を示す要部断面図である。
FIG. 3 is a cross-sectional view of a main part showing a structure of an EL according to a third embodiment of the present invention.

【図4】従来のELの構造を示す断面図である。FIG. 4 is a cross-sectional view showing a structure of a conventional EL.

【符号の説明】[Explanation of symbols]

1 上樹脂基板 2 下樹脂基板 2a スルーホール 2A スルーホールパターン 2C 導通端子 3 透明電極 4 背面電極 5 発光層 6 誘電体層 8 発光部 10 EL 11 樹脂封止部材 12 溶着部 13 段差部 REFERENCE SIGNS LIST 1 upper resin substrate 2 lower resin substrate 2a through hole 2A through hole pattern 2C conductive terminal 3 transparent electrode 4 back electrode 5 light emitting layer 6 dielectric layer 8 light emitting unit 10 EL 11 resin sealing member 12 welding portion 13 step portion

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 透明電極と背面電極の2つの電極間に発
光層と誘電体層を挟設し、両電極に電圧を印加すること
によって発光層が発光する発光部を、対向して配置され
た一対の基板の何れか一方の基板の内面に一体的に形成
し、前記形成した発光部を前記一対の基板と封止部材と
で封入したエレクトロルミネッセンスにおいて、前記一
対の基板は平板状の樹脂基板より成り、封止部材は樹脂
封止部材より成り、前記一対の樹脂基板と樹脂封止部材
とを超音波溶着して封止したことを特徴とするエレクト
ロルミネッセンス。
1. A light-emitting layer and a dielectric layer are sandwiched between two electrodes, a transparent electrode and a back electrode, and light-emitting portions in which the light-emitting layer emits light by applying a voltage to both electrodes are arranged to face each other. In electroluminescence in which the formed light emitting portion is integrally formed on the inner surface of any one of the pair of substrates and the formed light emitting portion is sealed with the pair of substrates and a sealing member, the pair of substrates are formed of a flat resin. Electroluminescence, wherein the sealing member is made of a resin sealing member, and the pair of resin substrates and the resin sealing member are sealed by ultrasonic welding.
【請求項2】 透明電極と背面電極の2つの電極間に発
光層と誘電体層を挟設し、両電極に電圧を印加すること
によって発光層が発光する発光部を、対向して配置され
た一対の基板の何れか一方の基板の内面に一体的に形成
し、前記形成した発光部を前記一対の基板を接着封止し
たエレクトロルミネッセンスにおいて、前記一対の基板
は平板状の樹脂基板とボックス状の樹脂基板とより成
り、2つの樹脂基板を超音波溶着して封止したことを特
徴とするエレクトロルミネッセンス。
2. A light-emitting layer and a dielectric layer are interposed between two electrodes, a transparent electrode and a back electrode, and light-emitting portions, which emit light when the voltage is applied to both electrodes, are arranged opposite to each other. In electroluminescence in which the formed light emitting portion is integrally formed on the inner surface of any one of the pair of substrates and the formed light emitting portion is bonded and sealed to the pair of substrates, the pair of substrates is a flat resin substrate and a box. An electroluminescence device comprising: a resin substrate having a shape of a circle; and sealing the two resin substrates by ultrasonic welding.
【請求項3】 前記一対の平板状の上下樹脂基板の対向
する外周部に凹状の段差部を形成し、該段差部で樹脂封
止部材を超音波溶着して封止したことを特徴とする請求
項1記載のエレクトロルミネッセンス。
3. A pair of flat upper and lower resin substrates, wherein a concave step portion is formed in the outer peripheral portions facing each other, and a resin sealing member is sealed by ultrasonic welding at the step portion. The electroluminescence according to claim 1.
【請求項4】 前記樹脂基板及び樹脂封止部材は共にポ
リカーボ樹脂であることを特徴とする請求項1〜3のい
ずれか記載のエレクトロルミネッセンス。
4. The electroluminescence according to claim 1, wherein both the resin substrate and the resin sealing member are polycarbonate resins.
【請求項5】 前記発光部を一体的に形成した基板にス
ルーホールを設け、該スルーホールにスルーホールパタ
ーンを形成してスルーホールパターンと接続する導通端
子を設けたことを特徴とする請求項1〜4のいずれか記
載のエレクトロルミネッセンス。
5. The semiconductor device according to claim 1, wherein a through-hole is provided in the substrate on which the light emitting portion is integrally formed, and a through-hole pattern is formed in the through-hole, and a conduction terminal connected to the through-hole pattern is provided. 5. The electroluminescence according to any one of 1 to 4.
JP11025607A 1999-02-03 1999-02-03 Electroluminescence(el) Pending JP2000223263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11025607A JP2000223263A (en) 1999-02-03 1999-02-03 Electroluminescence(el)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11025607A JP2000223263A (en) 1999-02-03 1999-02-03 Electroluminescence(el)

Publications (1)

Publication Number Publication Date
JP2000223263A true JP2000223263A (en) 2000-08-11

Family

ID=12170595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11025607A Pending JP2000223263A (en) 1999-02-03 1999-02-03 Electroluminescence(el)

Country Status (1)

Country Link
JP (1) JP2000223263A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030044670A (en) * 2001-11-30 2003-06-09 오리온전기 주식회사 Encapsulation cap of organic electroluminescent device and method for manufacture thereof
KR100637545B1 (en) * 2001-11-30 2006-11-10 오리온오엘이디 주식회사 Encapsulation cap of organic electroluminescent device and method for manufacturing thereof
CN103152891B (en) * 2013-02-16 2015-10-28 上海科润光电技术有限公司 A kind of inorganic powder electroluminescence flexible matrix display
US10756298B2 (en) 2017-11-03 2020-08-25 OLEDWorks LLC Solder hermetic sealing for OLEDs

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030044670A (en) * 2001-11-30 2003-06-09 오리온전기 주식회사 Encapsulation cap of organic electroluminescent device and method for manufacture thereof
KR100637545B1 (en) * 2001-11-30 2006-11-10 오리온오엘이디 주식회사 Encapsulation cap of organic electroluminescent device and method for manufacturing thereof
CN103152891B (en) * 2013-02-16 2015-10-28 上海科润光电技术有限公司 A kind of inorganic powder electroluminescence flexible matrix display
US10756298B2 (en) 2017-11-03 2020-08-25 OLEDWorks LLC Solder hermetic sealing for OLEDs

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