JPH0373991A - Thin-film el display panel - Google Patents
Thin-film el display panelInfo
- Publication number
- JPH0373991A JPH0373991A JP1210320A JP21032089A JPH0373991A JP H0373991 A JPH0373991 A JP H0373991A JP 1210320 A JP1210320 A JP 1210320A JP 21032089 A JP21032089 A JP 21032089A JP H0373991 A JPH0373991 A JP H0373991A
- Authority
- JP
- Japan
- Prior art keywords
- film
- terminal
- thin
- cover glass
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 239000006059 cover glass Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000002985 plastic film Substances 0.000 abstract description 4
- 229920006255 plastic film Polymers 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000012530 fluid Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、薄膜ELディスプレイパネルに関し、特に各
種情報のデイスプレィを行うマトリックス望薄11iE
Lディスプレイパネルに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film EL display panel, and particularly to a matrix thin 11iE display panel for displaying various information.
This invention relates to an L display panel.
マトリックス型薄膜ELディスプレイパネルは、ガラス
パッケージ構造のものが一般的である。その構造例を第
4図(a)、(b)及び第5図(a)、(b)を参照し
ながら説明する。Matrix type thin film EL display panels generally have a glass package structure. An example of its structure will be explained with reference to FIGS. 4(a) and 5(b) and FIGS. 5(a) and 5(b).
なお、第4図(a)はX方向の断面図、第4図(b)は
X方向と直交するY方向の断面図を示す。Note that FIG. 4(a) is a sectional view in the X direction, and FIG. 4(b) is a sectional view in the Y direction orthogonal to the X direction.
第4図(a)、(b)において、1は透光性を有するガ
ラス基板、2はガラス基板1上に形成されたマトリック
ス型の薄膜EL素子である。上記薄膜EL素子2におい
て、3はガラス基板1の上にITOを蒸着法やスパッタ
法でX方向に沿って所定のピッチで形成した多数のスト
ライプ状の透明電極、4は透明電極3上を覆うY2O3
等の透明な第1の誘電体層、5は第1の誘電体層4上に
積層形成したZnS : Mn等の発光層、6は発光層
5上を覆うY2O,等の透明な第2の誘電体層、7は第
2の誘電体層6上にY方向に沿って所定ピッチで多数の
ストライプ状に形成したA1蒸着膜による背面電極であ
る。8はガラス基板1上にエポキシ樹脂等の接着剤9を
介して固定されて薄膜EL素子2を気密封止する逆皿状
のガバーガラスで、ガラス基板1と共に薄膜EL素子2
を封止する外囲器10を構成する。11は薄膜EL素子
2の耐湿性を向上させるため、外囲器10の内部空間に
充填されたシリコンオイル等の絶縁性保護流体で、ガバ
ーガラス8の一部に形成された注入孔12から注入され
、注入後注入孔12は蓋板13で密閉される。In FIGS. 4(a) and 4(b), reference numeral 1 indicates a light-transmitting glass substrate, and reference numeral 2 indicates a matrix type thin film EL element formed on the glass substrate 1. In FIG. In the thin film EL element 2, 3 is a large number of striped transparent electrodes formed on the glass substrate 1 by vapor deposition or sputtering at a predetermined pitch along the X direction, and 4 covers the transparent electrode 3. Y2O3
5 is a light emitting layer such as ZnS:Mn laminated on the first dielectric layer 4, 6 is a transparent second dielectric layer such as Y2O covering the light emitting layer 5. The dielectric layer 7 is a back electrode made of an A1 vapor-deposited film formed on the second dielectric layer 6 in the form of a large number of stripes at a predetermined pitch along the Y direction. Reference numeral 8 denotes an inverted dish-shaped cover glass that is fixed onto the glass substrate 1 via an adhesive 9 such as epoxy resin to hermetically seal the thin film EL element 2.
Constructs an envelope 10 that seals the. Reference numeral 11 denotes an insulating protective fluid such as silicone oil filled in the internal space of the envelope 10 in order to improve the moisture resistance of the thin film EL element 2. The fluid is injected through an injection hole 12 formed in a part of the cover glass 8. After injection, the injection hole 12 is sealed with a cover plate 13.
ところで、透明電極3と背面電極7の各一端部は、ガラ
ス基板1の周辺部に延設されて、各々の延設端部はガラ
ス基板1の周辺部上に形成された端子部14.15に重
畳接続される。そしてX方向に沿って配設された透明電
極3側の端子部14は、透明電極3の延設端部上に重畳
して形成され、一方、Y方向に沿って配設された背面電
極7の側の端子部15上には背面電極7の延設端部が重
畳して形成される。16は薄膜EL素子2の電極外部引
出し用のフレキシブルリードで、プラスチックフィルム
17に銅箔等の外部リード18を多数被着形成したもの
であり、外囲器10から露出する多数の端子部1.4.
15上に対応する外部リード18の端部がはんだにて電
気的及び機械的に接続される。By the way, one end of each of the transparent electrode 3 and the back electrode 7 is extended to the peripheral part of the glass substrate 1, and each extended end is connected to a terminal part 14, 15 formed on the peripheral part of the glass substrate 1. is connected in a superimposed manner. The terminal portion 14 on the side of the transparent electrode 3 disposed along the X direction is formed to overlap the extending end portion of the transparent electrode 3, while the back electrode 7 disposed along the Y direction An extended end portion of the back electrode 7 is formed to overlap with the terminal portion 15 on the side. Reference numeral 16 denotes a flexible lead for externally extending the electrodes of the thin film EL element 2, which is made by adhering a large number of external leads 18 such as copper foil to a plastic film 17, and has a large number of terminal parts 1.16 exposed from the envelope 10. 4.
The corresponding ends of external leads 18 on 15 are electrically and mechanically connected with solder.
上述した従来の1iEL素子2の周縁部では、カバーガ
ラス8をガラス基板1に固着する接着剤9の収縮力やカ
バーガラス8のそり等により、第6図に示すように、背
面電極7がh部で切断され、薄膜EL素子2への通電が
不能となり、信頼性も大幅に低下するという問題点があ
った。At the periphery of the conventional 1iEL element 2 described above, the back electrode 7 is bent due to the contraction force of the adhesive 9 that fixes the cover glass 8 to the glass substrate 1, the warpage of the cover glass 8, etc., as shown in FIG. There was a problem in that the thin film EL element 2 was cut off at the end, making it impossible to conduct electricity to the thin film EL element 2, and the reliability was also significantly reduced.
本発明の目的は、背面電極が切断し、薄膜EL素子への
通電が不能となることのない、信頼性の高い薄膜ELデ
ィスプレイパネルを提供することにある。An object of the present invention is to provide a highly reliable thin film EL display panel in which the back electrode is not cut and electricity cannot be supplied to the thin film EL element.
本発明は、ガラス基板とカバーガラスとを接着してなる
外囲器内に薄膜EL素子を封入した薄膜ELディスプレ
イパネルにおいて、薄膜EL素子の外部端子取り出し用
導電端子がカバーガラスに埋め込まれていることを特徴
とする。The present invention provides a thin-film EL display panel in which a thin-film EL element is enclosed in an envelope formed by bonding a glass substrate and a cover glass, in which a conductive terminal for taking out an external terminal of the thin-film EL element is embedded in the cover glass. It is characterized by
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図(a)、(b)はそれぞれ本発明の第1の実施例
のX方向及びY方向の断面図、第2図(a)、(b)は
それぞれ第1図(a)及び(b)の外部端子取り出し部
の部分拡大断面図である。第1図(a>、(b)及び第
2図(a)。FIGS. 1(a) and (b) are cross-sectional views in the X and Y directions of the first embodiment of the present invention, respectively, and FIGS. 2(a) and (b) are respectively FIGS. FIG. 3B is a partially enlarged cross-sectional view of the external terminal extraction portion of FIG. Fig. 1 (a>, (b)) and Fig. 2 (a).
(b)に於いて、21は透光性を有するガラス基板、2
2はガラス基板21上に形成されたマトリックス型の薄
膜EL素子である。この薄膜EL素子22に於ける23
は、ITOを蒸着法やスバ・7り法でX方向に沿って所
定のピッチで形成したストライプ上の透明電極、24は
透明電極23上の覆うY2O3等の透明な第1誘電体層
、25は第1絶縁層24上に形成したZnS : Mn
等の発光層、26は発光層25上を覆うY2O5等の透
明な第2の誘電体層、27は第2誘電体層26上にY方
向に沿って形成したストライプ状のA1蒸着膜による背
面電極である。28はカバーガラスであり、接着剤29
でもってガラス基板21に固定され、薄膜EL素子22
の外囲器30を構成する。In (b), 21 is a transparent glass substrate;
2 is a matrix type thin film EL element formed on a glass substrate 21. 23 in this thin film EL element 22
24 is a transparent electrode on a stripe made of ITO formed at a predetermined pitch along the X direction by a vapor deposition method or a sputtering method; 24 is a transparent first dielectric layer such as Y2O3 that covers the transparent electrode 23; ZnS:Mn formed on the first insulating layer 24
26 is a transparent second dielectric layer such as Y2O5 that covers the light emitting layer 25, and 27 is a back surface made of a striped A1 vapor deposited film formed on the second dielectric layer 26 along the Y direction. It is an electrode. 28 is a cover glass, and adhesive 29
Therefore, the thin film EL element 22 is fixed to the glass substrate 21.
An envelope 30 is configured.
40はカバーガラス28に所定のピッチで埋め込まれた
ストライプ状の導電端子であるや導電端子40と透明電
極23と背面電極27は同一ピッチである。透明電極2
3と背面電極27の各一端部はカバーガラス28のガラ
ス基板21への接合部位の手前まで延設され、この延設
端部とカバーガラス28に埋め込まれた導電端子40は
重畳接続される。40 is a striped conductive terminal embedded in the cover glass 28 at a predetermined pitch; the conductive terminal 40, the transparent electrode 23, and the back electrode 27 have the same pitch. Transparent electrode 2
3 and one end of the back electrode 27 are extended to the front of the bonding portion of the cover glass 28 to the glass substrate 21, and these extended ends and the conductive terminal 40 embedded in the cover glass 28 are connected in an overlapping manner.
31は外囲器30の内部空間に充填されたシリコンオイ
ル等の絶縁性保護流体でカバーガラスに形成された注入
孔32から注入され、注入後に注入孔32は蓋板33で
密閉される。34.35は導電端子40を引き出すため
に重畳接続された端子部である。36は薄膜EL素子2
2の電極外部引出し用のフレキシブルリードでプラスチ
ックフィルム37に銅箔等の外部リード38をストライ
プ状に多数被着形成したものであり、ガラス基板21の
周辺部上に形成された端子部34.35上に対応する外
部リード38の端部がはんだにて電気的及び機械的に接
続される。31 is an insulating protective fluid such as silicone oil filled in the inner space of the envelope 30 and is injected from an injection hole 32 formed in the cover glass, and after injection, the injection hole 32 is sealed with a cover plate 33. Reference numerals 34 and 35 indicate terminal portions that are overlapped and connected to draw out the conductive terminal 40. 36 is thin film EL element 2
This is a flexible lead for externally drawing out the electrodes of No. 2, in which a large number of external leads 38 such as copper foil are adhered to a plastic film 37 in a striped manner, and terminal portions 34 and 35 are formed on the periphery of the glass substrate 21. The ends of the external leads 38 corresponding to the top are electrically and mechanically connected with solder.
このように本実施例では、薄膜EL素子の外囲器外への
端子引き出しをカバーガラスに埋め込まれた導電端子を
介して行なっているので端子引き出し用の電極延設部分
の切断による通電不良を有効に防止できる。In this embodiment, the terminals of the thin-film EL element are drawn out of the envelope through the conductive terminals embedded in the cover glass, so there is no risk of failure in energization due to cutting of the extended part of the electrode for terminal extraction. Can be effectively prevented.
第3図(a)、(b)はそれぞれ本発明の第2の実施例
のX方向とY方向の外部端子取り出し部の部分拡大断面
図である。第2の実施例は第3図(a)、(b)に示す
ように、カバーガラスを導電端子40を含む外枠部分2
8aと蓋部分28bにわけ、まず外枠部分28aがガラ
ス基板21に接着剤29で固着された後に銀ペースト等
の導電物質41が導電端子40と透明電極23.背面電
極27との接着部位に補強される。この後、蓋部分28
bが外枠部分28aに接着剤42でもって固着されカバ
ーガラスが形成される。FIGS. 3(a) and 3(b) are partially enlarged cross-sectional views of the external terminal extraction portion in the X direction and the Y direction, respectively, of the second embodiment of the present invention. In the second embodiment, as shown in FIGS. 3(a) and 3(b), a cover glass is attached to an outer frame portion 2 including a conductive terminal 40.
8a and a lid portion 28b, first, the outer frame portion 28a is fixed to the glass substrate 21 with an adhesive 29, and then a conductive material 41 such as silver paste is applied to the conductive terminal 40 and the transparent electrode 23. The adhesive portion with the back electrode 27 is reinforced. After this, the lid part 28
b is fixed to the outer frame portion 28a with an adhesive 42 to form a cover glass.
これにより、導電端子40と透明電極23.背面電極2
7との接着はより強固なものとなるという利点がある。As a result, the conductive terminal 40 and the transparent electrode 23. Back electrode 2
There is an advantage that the adhesion with 7 becomes stronger.
以上説明したように本発明は、薄膜ELディスプレイパ
ネルの薄1IEL素子の外囲器外への端子引き出しをカ
バーガラスに埋め込まれた導電端子を介して行うことに
より、従来の方法ではよく発生していたカバーガラスの
ガラス基板への接着部分下での薄膜EL素子の端子引き
出し用の電極延設部分の切断による通電不良をなくすこ
とができる効果がある。As explained above, the present invention allows the terminals of the thin IEL elements of the thin-film EL display panel to be drawn out of the envelope through the conductive terminals embedded in the cover glass, which is a problem that often occurs in conventional methods. This has the effect of eliminating failures in conduction due to cutting of the electrode extension portion for drawing out the terminals of the thin film EL element under the adhesive portion of the cover glass to the glass substrate.
第1図(a)、(b)はそれぞれ本発明の第1の実施例
のX方向及びY方向の断面図、第2図(a)、(b)は
それぞれ第1図(a)及び(b)の外部端子取り出し部
の部分拡大断面図、第3図(a)、(b)はそれぞれ本
発明の第2の実施例のX方向及びY方向の外部端子取り
出し部の部分拡大断面図、第4図(a)、(b)はそれ
ぞれ従来の薄膜ELディスプレイパネルの一例のX方向
及びY方向の断面図、第5図(a)。
(b)はそれぞれ第4図(a)及び(b)の外部端子取
り出し部の部分拡大断面図、第6図は背面電極の延設部
分の切断状態を説明する要部拡大断面図である。
1.21・・・ガラス基板、2,22・・・薄[EL素
子、3,23・・・透明電極、4,24・・・第1の誘
電体層、5,25・・・発光層、6.26・・・第2の
誘電体層、7,27・・・背面電極、8,28・・・カ
バーガラス、9.29.42・・・接着剤、10.30
・・・外囲器、11.31・・・絶縁性保護流体、12
゜32・・・注入孔、13.33・・・蓋板、14.1
5゜34.35・・・端子部、16.36・・・フレキ
シブルリード、17.37・・・プラスチックフィルム
、18.38・・・外部リード、40・・・導電端子、
41・・・導電物質、28a・・・カバーガラス(外枠
部)、28b・・・カバーガラス(蓋部)。FIGS. 1(a) and (b) are cross-sectional views in the X and Y directions of the first embodiment of the present invention, respectively, and FIGS. 2(a) and (b) are respectively FIGS. FIGS. 3(a) and 3(b) are partially enlarged sectional views of the external terminal extracting portion in the X direction and Y direction of the second embodiment of the present invention, respectively; FIGS. 4(a) and 4(b) are cross-sectional views in the X direction and Y direction of an example of a conventional thin film EL display panel, respectively, and FIG. 5(a) is a cross-sectional view of an example of a conventional thin film EL display panel. (b) is a partially enlarged cross-sectional view of the external terminal take-out portion of FIGS. 4(a) and (b), respectively, and FIG. 6 is an enlarged cross-sectional view of a main part illustrating a state in which the extended portion of the back electrode is cut. 1.21...Glass substrate, 2,22...Thin EL element, 3,23...Transparent electrode, 4,24...First dielectric layer, 5,25...Light emitting layer , 6.26... Second dielectric layer, 7, 27... Back electrode, 8, 28... Cover glass, 9.29.42... Adhesive, 10.30
... Envelope, 11.31 ... Insulating protective fluid, 12
゜32... Injection hole, 13.33... Lid plate, 14.1
5゜34.35... Terminal part, 16.36... Flexible lead, 17.37... Plastic film, 18.38... External lead, 40... Conductive terminal,
41... Conductive material, 28a... Cover glass (outer frame part), 28b... Cover glass (lid part).
Claims (1)
薄膜EL素子を封入した薄膜ELディスプレイパネルに
おいて、薄膜EL素子の外部端子取り出し用導電端子が
前記カバーガラスに埋め込まれていることを特徴とする
薄膜ELディスプレイパネル。A thin film EL display panel in which a thin film EL element is enclosed in an envelope formed by bonding a glass substrate and a cover glass, characterized in that a conductive terminal for taking out an external terminal of the thin film EL element is embedded in the cover glass. Thin film EL display panel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1210320A JPH0373991A (en) | 1989-08-14 | 1989-08-14 | Thin-film el display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1210320A JPH0373991A (en) | 1989-08-14 | 1989-08-14 | Thin-film el display panel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0373991A true JPH0373991A (en) | 1991-03-28 |
Family
ID=16587476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1210320A Pending JPH0373991A (en) | 1989-08-14 | 1989-08-14 | Thin-film el display panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0373991A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100451632B1 (en) * | 2002-05-20 | 2004-10-15 | 이호준 | An ocarina |
WO2005038771A1 (en) * | 2003-10-22 | 2005-04-28 | Sacdong Co., Ltd. | Ocarina |
-
1989
- 1989-08-14 JP JP1210320A patent/JPH0373991A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100451632B1 (en) * | 2002-05-20 | 2004-10-15 | 이호준 | An ocarina |
WO2005038771A1 (en) * | 2003-10-22 | 2005-04-28 | Sacdong Co., Ltd. | Ocarina |
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