JPH02107869A - メタルガスケットの製造方法 - Google Patents
メタルガスケットの製造方法Info
- Publication number
- JPH02107869A JPH02107869A JP26049988A JP26049988A JPH02107869A JP H02107869 A JPH02107869 A JP H02107869A JP 26049988 A JP26049988 A JP 26049988A JP 26049988 A JP26049988 A JP 26049988A JP H02107869 A JPH02107869 A JP H02107869A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal gasket
- metal plate
- expanded graphite
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 51
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 21
- 239000010439 graphite Substances 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 229920000459 Nitrile rubber Polymers 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 229920001973 fluoroelastomer Polymers 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- -1 epoxy-phenol Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Gasket Seals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26049988A JPH02107869A (ja) | 1988-10-18 | 1988-10-18 | メタルガスケットの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26049988A JPH02107869A (ja) | 1988-10-18 | 1988-10-18 | メタルガスケットの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02107869A true JPH02107869A (ja) | 1990-04-19 |
| JPH0563670B2 JPH0563670B2 (enrdf_load_stackoverflow) | 1993-09-13 |
Family
ID=17348818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26049988A Granted JPH02107869A (ja) | 1988-10-18 | 1988-10-18 | メタルガスケットの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02107869A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993008420A1 (en) * | 1991-10-21 | 1993-04-29 | Mccord Payen Incorporated | Embossed composite gasket |
| JPH0616769U (ja) * | 1991-03-25 | 1994-03-04 | 石川ガスケット株式会社 | グラファイト層を備えた金属積層形ガスケット |
| JPH0635735U (ja) * | 1991-04-05 | 1994-05-13 | 石川ガスケット株式会社 | ガスケット |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105653A (en) * | 1977-02-25 | 1978-09-13 | Nippon Pillar Packing | Method of producing composite gasket |
-
1988
- 1988-10-18 JP JP26049988A patent/JPH02107869A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105653A (en) * | 1977-02-25 | 1978-09-13 | Nippon Pillar Packing | Method of producing composite gasket |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0616769U (ja) * | 1991-03-25 | 1994-03-04 | 石川ガスケット株式会社 | グラファイト層を備えた金属積層形ガスケット |
| JPH0635735U (ja) * | 1991-04-05 | 1994-05-13 | 石川ガスケット株式会社 | ガスケット |
| WO1993008420A1 (en) * | 1991-10-21 | 1993-04-29 | Mccord Payen Incorporated | Embossed composite gasket |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563670B2 (enrdf_load_stackoverflow) | 1993-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
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| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080913 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |