JPH02107579A - セラミックスの接合方法 - Google Patents
セラミックスの接合方法Info
- Publication number
- JPH02107579A JPH02107579A JP25951988A JP25951988A JPH02107579A JP H02107579 A JPH02107579 A JP H02107579A JP 25951988 A JP25951988 A JP 25951988A JP 25951988 A JP25951988 A JP 25951988A JP H02107579 A JPH02107579 A JP H02107579A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- layer
- electroless plating
- joining
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25951988A JPH02107579A (ja) | 1988-10-17 | 1988-10-17 | セラミックスの接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25951988A JPH02107579A (ja) | 1988-10-17 | 1988-10-17 | セラミックスの接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02107579A true JPH02107579A (ja) | 1990-04-19 |
JPH055789B2 JPH055789B2 (enrdf_load_html_response) | 1993-01-25 |
Family
ID=17335225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25951988A Granted JPH02107579A (ja) | 1988-10-17 | 1988-10-17 | セラミックスの接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02107579A (enrdf_load_html_response) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996020333A1 (fr) * | 1994-12-28 | 1996-07-04 | Sumitomo Electric Industries, Ltd. | Piece coulissante et son procede de fabrication |
JP2010103168A (ja) * | 2008-10-21 | 2010-05-06 | Mitsubishi Materials Corp | セラミックス基板の製造方法及びパワーモジュール用基板の製造方法 |
US9079264B2 (en) | 2007-11-06 | 2015-07-14 | Mitsubishi Materials Corporation | Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate |
KR20200074866A (ko) * | 2018-12-14 | 2020-06-25 | 코마도 쏘시에떼 아노님 | 시계학 또는 보석류를 위한 지르코니아계 세라믹 부품과 티타늄 합금 부품과의 브레이징 방법 |
-
1988
- 1988-10-17 JP JP25951988A patent/JPH02107579A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996020333A1 (fr) * | 1994-12-28 | 1996-07-04 | Sumitomo Electric Industries, Ltd. | Piece coulissante et son procede de fabrication |
US9079264B2 (en) | 2007-11-06 | 2015-07-14 | Mitsubishi Materials Corporation | Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate |
JP2010103168A (ja) * | 2008-10-21 | 2010-05-06 | Mitsubishi Materials Corp | セラミックス基板の製造方法及びパワーモジュール用基板の製造方法 |
KR20200074866A (ko) * | 2018-12-14 | 2020-06-25 | 코마도 쏘시에떼 아노님 | 시계학 또는 보석류를 위한 지르코니아계 세라믹 부품과 티타늄 합금 부품과의 브레이징 방법 |
US11498879B2 (en) | 2018-12-14 | 2022-11-15 | Comadur Sa | Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery |
Also Published As
Publication number | Publication date |
---|---|
JPH055789B2 (enrdf_load_html_response) | 1993-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |