JPH02104696U - - Google Patents
Info
- Publication number
- JPH02104696U JPH02104696U JP1230889U JP1230889U JPH02104696U JP H02104696 U JPH02104696 U JP H02104696U JP 1230889 U JP1230889 U JP 1230889U JP 1230889 U JP1230889 U JP 1230889U JP H02104696 U JPH02104696 U JP H02104696U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- ics
- electronic components
- component holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による電子部品ホ
ルダーを用いたサーマルバスとＩＣ等電子部品の
固定状態を示す斜視図、第２図は第１図の断面図
、第３図は他の実施例による電子部品ホルダーを
用いたサーマルバスとＩＣ等電子部品の固定状態
を示す斜視図、第４図は従来の電子ホルダーを用
いたサーマルバスとＩＣ等電子部品の固定状態を
示す斜視図、第５図は第４図の断面図である。図
において、１はサーマルバス、２はＩＣ等電子部
品、４は印刷配線板、７は電子部品ホルダーであ
る。なお、図中、同一符号は同一、または相当部
分を示す。
FIG. 1 is a perspective view showing a state in which a thermal bus and electronic components such as ICs are fixed using an electronic component holder according to one embodiment of the invention, FIG. 2 is a cross-sectional view of FIG. 1, and FIG. 3 is another embodiment of the invention. FIG. 4 is a perspective view showing a state in which a thermal bus and electronic components such as ICs are fixed using an electronic component holder according to an example; FIG. FIG. 5 is a sectional view of FIG. 4. In the figure, 1 is a thermal bus, 2 is an electronic component such as an IC, 4 is a printed wiring board, and 7 is an electronic component holder. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ために放熱板を備えた印刷配線板とＩＣ等電子部
品をばね力で印刷配線板と固定し密着度を向上さ
せることにより放熱効果を高める電子部品ホルダ
ーを有したことを特徴とする印刷配線板。 A printed wiring board equipped with a heat sink to radiate heat generated during the operation of ICs and other electronic components by conduction, and an electronic circuit that improves the heat dissipation effect by fixing ICs and other electronic components to the printed wiring board with spring force and improving the degree of adhesion. A printed wiring board characterized by having a component holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1230889U JPH02104696U (en) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1230889U JPH02104696U (en) | 1989-02-03 | 1989-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104696U true JPH02104696U (en) | 1990-08-20 |
Family
ID=31221637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1230889U Pending JPH02104696U (en) | 1989-02-03 | 1989-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104696U (en) |
-
1989
- 1989-02-03 JP JP1230889U patent/JPH02104696U/ja active Pending
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