JPH02104696U - - Google Patents
Info
- Publication number
- JPH02104696U JPH02104696U JP1230889U JP1230889U JPH02104696U JP H02104696 U JPH02104696 U JP H02104696U JP 1230889 U JP1230889 U JP 1230889U JP 1230889 U JP1230889 U JP 1230889U JP H02104696 U JPH02104696 U JP H02104696U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- ics
- electronic components
- component holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1230889U JPH02104696U (de) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1230889U JPH02104696U (de) | 1989-02-03 | 1989-02-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02104696U true JPH02104696U (de) | 1990-08-20 |
Family
ID=31221637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1230889U Pending JPH02104696U (de) | 1989-02-03 | 1989-02-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02104696U (de) |
-
1989
- 1989-02-03 JP JP1230889U patent/JPH02104696U/ja active Pending
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