JPH02102669U - - Google Patents
Info
- Publication number
- JPH02102669U JPH02102669U JP1042889U JP1042889U JPH02102669U JP H02102669 U JPH02102669 U JP H02102669U JP 1042889 U JP1042889 U JP 1042889U JP 1042889 U JP1042889 U JP 1042889U JP H02102669 U JPH02102669 U JP H02102669U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- round pin
- pin terminal
- press
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000013011 mating Effects 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第1図乃至第4図は本考案の一実施例を示し、
第1図は回路基板の平面図、第2図は丸ピン端子
の正面図、第3図は回路基板のスルーホールに丸
ピン端子をハンダ付けした状態を示す一部切欠縦
断正面図、第4図は第3図A−A線断面図である
。第5図は従来型を示し、同図Aは回路基板の一
部切欠縦断面図、同図Bは丸ピン端子の正面図、
同図C,Dは夫々該丸ピン端子のハンダ付け状態
を示す一部切欠縦断正面図である。
10……回路基板、13……スルーホール、1
4……丸ピン端子、15……嵌合部、15c……
稜線、17……ハンダ。
1 to 4 show an embodiment of the present invention,
Figure 1 is a plan view of the circuit board, Figure 2 is a front view of the round pin terminal, Figure 3 is a partially cutaway vertical front view showing the round pin terminal soldered to the through hole of the circuit board, and Figure 4 is a front view of the circuit board. The figure is a sectional view taken along the line A-A in FIG. 3. Fig. 5 shows a conventional type, in which Fig. A is a partially cutaway vertical sectional view of the circuit board, Fig. B is a front view of the round pin terminal,
Figures C and D are partially cutaway longitudinal sectional front views showing the soldered state of the round pin terminal, respectively. 10... Circuit board, 13... Through hole, 1
4...Round pin terminal, 15...Mating part, 15c...
Ridgeline, 17...Solder.
Claims (1)
、該スルーホールに嵌挿される丸ピン端子の頭部
の先端部をテーパ状に形成すると共に、前記スル
ーホール嵌合部位を角形に形成して該スルーホー
ルに圧入し、更に、該圧入部位をハンダ結合せし
めたことを特徴とする丸ピン端子の回路基板への
圧入装置。 A circular through hole is drilled in the circuit board, while the tip of the head of the round pin terminal to be fitted into the through hole is formed into a tapered shape, and the through hole fitting portion is formed into a square shape. A device for press-fitting a round pin terminal onto a circuit board, characterized in that the round pin terminal is press-fitted into the through-hole, and the press-fitted portion is further bonded with solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1042889U JPH02102669U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1042889U JPH02102669U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02102669U true JPH02102669U (en) | 1990-08-15 |
Family
ID=31218083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1042889U Pending JPH02102669U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02102669U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059481A (en) * | 2005-08-22 | 2007-03-08 | Densei Lambda Kk | Terminal pin and power supply device using the same |
JP2013134249A (en) * | 2011-12-22 | 2013-07-08 | Samsung Electro-Mechanics Co Ltd | Probe card and method for manufacturing the same |
-
1989
- 1989-01-31 JP JP1042889U patent/JPH02102669U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059481A (en) * | 2005-08-22 | 2007-03-08 | Densei Lambda Kk | Terminal pin and power supply device using the same |
JP2013134249A (en) * | 2011-12-22 | 2013-07-08 | Samsung Electro-Mechanics Co Ltd | Probe card and method for manufacturing the same |