JPS6187466U

JPS6187466U -

Info

Publication number: JPS6187466U
Application number: JP1984171542U
Authority: JP
Priority date: 1984-11-12
Filing date: 1984-11-12
Publication date: 1986-06-07

Description

[Brief explanation of the drawing]

第１図ａ，ｂは本考案によるリード端子の一実
施例に係り、第１図ａは丸ピンリードの斜視図、
第１図ｂは丸ピンリードをプリント基板にはんだ
付けした状態を示す断面図、第２図ａ，ｂ及び第
３図はその他の実施例に係り、第２図ａはＩＣソ
ケツトの斜視図、第２図ｂはＩＣソケツトをプリ
ント基板にはんだ付けした状態を示す断面図、第
３図はチエツク用端子の斜視図、第４図〜第７図
は従来のリード端子に係り、第４図にＩＣソケツ
トの斜視図、第５図は丸ピンリードの斜視図、第
６図は丸ピンリードをプリント基板にはんだ付け
した状態を示す断面図、第７図は、スルーホール
内にブローホールが生じるのを防止するための対
策を施したプリント基板と丸ピンリードとの関係
を示す断面図である。２……丸ピンリード、２ａ，１１ａ……大径部
、２ｂ，１１ｂ……小径部、２ｃ，１１ｃ……テ
ーパ部、２ｄ，１１ｄ……溝、４……プリント
基板、７……はんだ、１０……ＩＣソケツト、１
１……チエツク端子。 Figures 1a and b relate to an embodiment of the lead terminal according to the present invention, and Figure 1a is a perspective view of a round pin lead;
FIG. 1b is a sectional view showing a state in which the round pin lead is soldered to a printed circuit board, FIGS. 2a, b, and 3 relate to other embodiments, and FIG. 2a is a perspective view of an IC socket, Figure 2b is a sectional view showing the IC socket soldered to the printed circuit board, Figure 3 is a perspective view of the check terminal, Figures 4 to 7 relate to conventional lead terminals, and Figure 4 shows the IC socket. Figure 5 is a perspective view of the socket, Figure 5 is a perspective view of the round pin lead, Figure 6 is a sectional view showing the round pin lead soldered to the printed circuit board, and Figure 7 is a method to prevent blowholes from forming in the through hole. FIG. 3 is a cross-sectional view showing the relationship between a printed circuit board and round pin leads that have been taken measures to prevent this. 2...Round pin lead, 2a, 11a...Large diameter part, 2b, 11b...Small diameter part, 2c, 11c...Tapered part, 2d, 11d...Groove, 4...Printed circuit board, 7...Solder, 10 ...IC socket, 1
1...Check terminal.

Claims

[Scope of utility model registration request]

A lead terminal that is inserted into a hole drilled in a printed circuit board and soldered, the lead terminal having a small diameter portion inserted into the hole and a large diameter portion having an outer diameter larger than the inner diameter of the hole. and a connecting surface connecting the outer circumferential surface of the small diameter portion and the outer circumferential surface of the large diameter portion. A lead terminal characterized by being formed into.