JPH02102466U - - Google Patents
Info
- Publication number
- JPH02102466U JPH02102466U JP971489U JP971489U JPH02102466U JP H02102466 U JPH02102466 U JP H02102466U JP 971489 U JP971489 U JP 971489U JP 971489 U JP971489 U JP 971489U JP H02102466 U JPH02102466 U JP H02102466U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- treatment apparatus
- seal flange
- surface treatment
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
第１図は本考案の実施例装置の構成図、第２図
ないし第５図は本考案装置に用いられる基板加熱
手段の他の実施例の構成図、第６図は従来装置の
構成図、第７図は従来装置に用いられている基板
加熱手段の詳細構成図である。
１……反応チヤンバ、２……ガス供給リング、
３……基板加熱手段、４……加熱線、５……メイ
ンバルブ、６……排気ポンプ、８，９，１０……
バルブ、１１……反応ガス、１２……加熱板、１
３……Ｏリング、１４……水冷部、１７……加熱
線支持体、１８……筒部、１９……閉塞面、２０
……真空シールフランジ、２１……発熱体、２２
……冷却水流路、２３……シール部材、２４……
反射板、３３……固定ピン、１１３……基板、１
１４……基板加熱手段、１２５，１３０……反射
板、１６１……冷却室、１６２……薄膜、２００
……溶接部、２４９……金属、２５０……セラミ
ツクス、２５１……金属、３２４……溶接部。
FIG. 1 is a block diagram of an embodiment of the device of the present invention, FIGS. 2 to 5 are block diagrams of other embodiments of the substrate heating means used in the device of the present invention, and FIG. 6 is a block diagram of a conventional device. FIG. 7 is a detailed configuration diagram of a substrate heating means used in a conventional device. 1... Reaction chamber, 2... Gas supply ring,
3... Substrate heating means, 4... Heating wire, 5... Main valve, 6... Exhaust pump, 8, 9, 10...
Valve, 11... Reaction gas, 12... Heating plate, 1
3...O ring, 14...Water cooling part, 17...Heating wire support, 18...Cylinder part, 19...Closing surface, 20
... Vacuum seal flange, 21 ... Heating element, 22
... Cooling water channel, 23 ... Seal member, 24 ...
Reflector, 33...Fixing pin, 113...Substrate, 1
14... Substrate heating means, 125, 130... Reflection plate, 161... Cooling chamber, 162... Thin film, 200
...Welded part, 249...Metal, 250...Ceramics, 251...Metal, 324...Welded part.
Claims (1)
熱手段上に処理対象物である基板を載置し該基板
を加熱しつつその表面に所定の処理を行う高温表
面処理装置において、前記基板加熱手段は、一方
の端部が筒部と一体の閉塞面を有する筒構造体の
内部に発熱体が配置され他方の端部の周縁には真
空シールフランジを有する構造体を、前記真空容
器の壁に明けられた穴に閉塞端を内部に向けて挿
入し、真空シールフランジ部分を真空容器の壁に
密着させた構造であることを特徴とする高温表面
処理装置。 (2) 真空シールフランジ部に冷却水流路を設け
たことを特徴とする請求項(1)記載の高温表面処
理装置。[Claims for Utility Model Registration] (1) A substrate, which is an object to be processed, is placed on a substrate heating means in a vacuum container into which a predetermined gas is introduced, and a predetermined treatment is performed on the surface of the substrate while heating the substrate. In the high-temperature surface treatment apparatus, the substrate heating means has a heating element disposed inside a cylindrical structure having a closed surface integral with the cylindrical portion at one end, and a vacuum seal flange at the periphery of the other end. A high-temperature surface treatment apparatus characterized in that the structure is inserted into a hole made in the wall of the vacuum container with the closed end facing inward, and the vacuum seal flange portion is brought into close contact with the wall of the vacuum container. . (2) The high-temperature surface treatment apparatus according to claim (1), characterized in that a cooling water flow path is provided in the vacuum seal flange portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP971489U JPH02102466U (en) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP971489U JPH02102466U (en) | 1989-01-30 | 1989-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102466U true JPH02102466U (en) | 1990-08-15 |
Family
ID=31216701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP971489U Pending JPH02102466U (en) | 1989-01-30 | 1989-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102466U (en) |
-
1989
- 1989-01-30 JP JP971489U patent/JPH02102466U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE7604294L (en) | COMBUSTION ENGINE | |
| JPH033436U (en) | ||
| JPH02102466U (en) | ||
| JPH0534844Y2 (en) | ||
| JPH0363573U (en) | ||
| JPH0534843Y2 (en) | ||
| JPS61173132U (en) | ||
| JPH01135734U (en) | ||
| JPS63177956U (en) | ||
| JPH0479421U (en) | ||
| JPS6367241U (en) | ||
| JPH0534845Y2 (en) | ||
| JPH01108928U (en) | ||
| JPS63124736U (en) | ||
| JPS59160562U (en) | Vapor phase growth equipment | |
| JPH0425230U (en) | ||
| JPS61106024U (en) | ||
| JPH0231124U (en) | ||
| JPS61115945U (en) | ||
| JPH0229521U (en) | ||
| JPH033733U (en) | ||
| JPH0270200U (en) | ||
| JPS61142441U (en) | ||
| JPH0294251U (en) | ||
| JPH02131341U (en) |