JPH02102174A - Ceramic bonding method - Google Patents
Ceramic bonding methodInfo
- Publication number
- JPH02102174A JPH02102174A JP25473588A JP25473588A JPH02102174A JP H02102174 A JPH02102174 A JP H02102174A JP 25473588 A JP25473588 A JP 25473588A JP 25473588 A JP25473588 A JP 25473588A JP H02102174 A JPH02102174 A JP H02102174A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- bonding
- furnace
- ceramics
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000007789 gas Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 239000011261 inert gas Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 150000002739 metals Chemical class 0.000 claims abstract description 5
- 229910052786 argon Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052734 helium Inorganic materials 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229910052735 hafnium Inorganic materials 0.000 claims abstract 3
- 229910052726 zirconium Inorganic materials 0.000 claims abstract 3
- 238000005219 brazing Methods 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 2
- 229910052724 xenon Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミックスの接合方法に係り、特にセラミッ
クスと他と部材とを高品質、かつ、低コストで接合する
のに好適なセラミックスの接合方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for joining ceramics, and in particular, a method for joining ceramics suitable for joining ceramics and other members with high quality and at low cost. Regarding.
従来、セラミックスのメタライズ、または、セラミック
スと金属との接合方法は多数開発されているが、その中
でも米国特許第２７３９７５号明細書に記載の方法を基
本とした、いわゆる、活性金属法が広く利用されつつあ
る。この活性金属法はＣｕ。Many methods for metallizing ceramics or joining ceramics to metals have been developed in the past, but among them, the so-called active metal method, which is based on the method described in U.S. Pat. No. 273,975, is widely used. It's coming. This active metal method uses Cu.
Ａ ｇ 、 Ｎ ｉ、または、それらの合金中にＴｉ、
Ｚｒ等の活性金属を数％添加した活性金属ろうにより、
−回の加熱でセラミックス同士、または、金属とを直接
４合できる特長がある。このため、アルミす（Ａ Ｑ
ｚｏａ） 、炭化硅素（ＳｉＣ）、窒化硅素（Ｓ ｉ
３Ｎ４）窒化アルミニウム（Ａ ＱＮ）等の各種セラミ
ックスの接合用ろう材として検討されている。Ti, in Ag, Ni, or their alloys
By using active metal solder containing several percent of active metals such as Zr,
It has the advantage that ceramics can be directly bonded with each other or with metals by heating twice. For this reason, aluminum (AQ
zoa), silicon carbide (SiC), silicon nitride (Si
3N4) It is being considered as a brazing material for joining various ceramics such as aluminum nitride (AQN).
従来、活性金属法では真空中、Ａｒガス中、または、Ｎ
２ガス中のいずれか一つの雰囲気中でメタライズ、また
は、接合が行なわれていた。Conventionally, active metal methods have been used in vacuum, Ar gas, or N
Metallization or bonding was performed in an atmosphere of one of two gases.
しかし、真空中ではろう材中のＡｇ、Ｃｕ等が蒸発して
、接合部以外にも付着し、セラミックスの絶縁抵抗を劣
化するばかりでなく、真空中のため非量産的であるとい
う欠点がある。However, in a vacuum, Ag, Cu, etc. in the brazing material evaporate and adhere to areas other than the joint, which not only deteriorates the insulation resistance of the ceramic, but also has the disadvantage that it is difficult to mass produce because it is in a vacuum. .
また、Ａｒガス中では接合炉内を減圧せずに常圧中でメ
タライズ、または、接合が可能であるが、ろう材のぬれ
性が極めて良いため、接合部にガスが残り、ブローホー
ルが発生するという欠点がある。更に、Ａｒ等の不活性
ガスは高価であり、実用面でコスト高となる。一方、Ｎ
２ガスは安価であるが−ろう材のぬれ性が極めて悪い欠
点がある。In addition, metallization or bonding is possible in Ar gas at normal pressure without reducing the pressure inside the bonding furnace, but because the brazing filler metal has extremely good wettability, gas remains in the bonded area and blow holes occur. There is a drawback that it does. Furthermore, inert gas such as Ar is expensive, and the cost is high in practical terms. On the other hand, N
2 gas is inexpensive, but has the drawback of extremely poor wettability of the brazing material.
このため、炉内を減圧せずに常圧中でも可能な接合方法
が望まれていた。For this reason, there has been a desire for a bonding method that can be used even under normal pressure without reducing the pressure inside the furnace.
上記従来技術は接合部の信頼性、接合時のコスト等の点
について考慮がされておらず、実用上問題があった。The above-mentioned conventional technology does not take into consideration the reliability of the joint, the cost at the time of joining, etc., and has a practical problem.
本発明の目的は高品質で、かつ、低コストで接合できる
セラミックスの接合部を提供することにある。An object of the present invention is to provide a high-quality ceramic joint that can be joined at low cost.
上記目的はＮ２ガスとＡｒガスとの混合ガス中でメタラ
イズ、または、接合を行うことにより達成される。The above object is achieved by metallizing or bonding in a mixed gas of N2 gas and Ar gas.
すなわち、Ａｒガス中ではろう材のぬれ性は極めて優れ
ているが接合部にブローホールが発生する欠点がある。That is, although the wettability of the brazing filler metal is extremely excellent in Ar gas, there is a drawback that blowholes occur at the joint.
一方、Ｎ２ガスはぬれ性は劣るがブローホールは発生せ
ず、かつ、安価であるという長所がある。On the other hand, although N2 gas has poor wettability, it does not generate blowholes and has the advantage of being inexpensive.
従って、本発明はＡｒガスとＮ２ガスとの各長所を利用
し、欠点をカバーするため、これらのガスを混合した混
合ガスとすることにより、高品質の接合部を常圧中で安
価に得ることができる。Therefore, the present invention makes use of the respective advantages of Ar gas and N2 gas and covers their disadvantages by mixing these gases to form a mixed gas, thereby obtaining high-quality joints at low cost under normal pressure. be able to.
なお、Ａｒガスの他にＨｅ、Ｎｅ、Ｋｒ、Ｒｎ等の不活
性ガス、または、これらの混合ガスでも本目的を達成で
きるが、その中でもＡｒガスが安価な点で最も望ましい
。In addition to Ar gas, this object can also be achieved with inert gases such as He, Ne, Kr, Rn, etc., or mixed gases thereof, but among these, Ar gas is the most desirable because it is inexpensive.
Ｎ２ガスとＡｒ等の不活性ガスの混合比は、ＮＺガス中
にＡｒ等の不活性ガスが１０〜７０Ｖｏ１２％含まれる
ものが望ましい。The mixing ratio of the N2 gas and the inert gas such as Ar is preferably such that the NZ gas contains 10 to 70Vo12% of the inert gas such as Ar.
Ｎ２ガス中のＡｒガスがＩ Ｖｏ ０％以下で゛は、Ａ
ｒのぬれ性改善の効果がなく、また、７０ＶｏＱ％以上
ではぬれ性が良すぎて接合部にブローホールが発生する
。If Ar gas in N2 gas is I Vo 0% or less, ゛ means A
There is no effect of improving the wettability of r, and if it exceeds 70 VoQ%, the wettability is too good and blowholes occur at the joint.
また、混合ガス中の０２ガス、ＣＯ２ガス等の不紙ガス
の量は、１０Ｖｏ１２％以下が望ましい。Further, the amount of non-paper gas such as 02 gas and CO2 gas in the mixed gas is desirably 10Vo12% or less.
一方、混合ガス中でメタライズ、または、接合に特に効
果の大きいろう材は−Ａ ｇ Ｉ Ｃｕ Ｔ Ｎ ｉの
単体、または、一種類以上の合金（混合も含む）にＴｉ
、Ｚｒの中から選ばれる一種類以上の元素を１〜３０ｗ
ｔ％含むものがぬれ性、及び、接合強度の点で望ましい
。On the other hand, a brazing filler metal that is particularly effective for metallization or bonding in a mixed gas is -A g I Cu T N i alone, or one or more alloys (including mixtures) with Ti.
, 1 to 30w of one or more elements selected from Zr.
t% is preferable in terms of wettability and bonding strength.
また、本発明の対象セラミックスは酸化物系、非酸化物
系のあらゆるセラミックスに効果がある。Moreover, the target ceramics of the present invention are effective for all kinds of oxide-based and non-oxide-based ceramics.
〈実施例Ｉ〉
ＡＱＮセラミックス同士の接合において、両者の接合面
に７２ｗｔ％−２８ｗｔ％Ｃｕの合金粉末中に５ｗｔ％
のＴｉ粉末を添加したペースト状のろう材を約１００μ
ｍの厚さに配置した。<Example I> In joining AQN ceramics, 5 wt% in 72 wt%-28 wt% Cu alloy powder was added to the joint surface of both.
Approximately 100μ of paste brazing filler metal added with Ti powder
It was arranged at a thickness of m.
この場合のＴｉ粉末、及び、銀ろう粉末数は２０μｍ以
下である。これをＮｚガス中に３０Ｖｏ ２％のＡｒガ
スを混合した混合ガス雰囲気中で８５０℃、三分間加熱
後自然冷却した。なお、混合ガス雰囲気の圧力は常圧で
ある。In this case, the number of Ti powder and silver solder powder is 20 μm or less. This was heated at 850° C. for 3 minutes in a mixed gas atmosphere of Nz gas and 30Vo 2% Ar gas, and then allowed to cool naturally. Note that the pressure of the mixed gas atmosphere is normal pressure.
この接合部のブローホール、及び、接合強度を調べた結
果、ブローホールは見られず、また、接合強度もＡＱＮ
基板と同等であった。As a result of examining the blowholes and bonding strength of this joint, no blowholes were found, and the bonding strength was also AQN.
It was equivalent to the board.
〈実施例■〉
Ａ Ｑ ｚ○３セラミックスと銅箔との接合において、
両者の゛接合面に６７ｗｔ％Ａｇ−３０ｗｔ％Ｃｕ−３
ｗｔ％の合金箔からなる厚さ５０μｍのろう材を配置し
、これをＮ２ガス中に１０ＶｏＱ％のＡｒを混合した混
合ガス雰囲気中で８６０℃、五分間加熱後自然冷却した
。<Example ■> A Q z○3 In joining ceramics and copper foil,
67wt%Ag-30wt%Cu-3 on the joint surface of both
A 50 μm thick brazing filler metal made of wt% alloy foil was placed, heated at 860° C. for 5 minutes in a mixed gas atmosphere containing 10 VoQ% Ar in N2 gas, and then allowed to cool naturally.
この接合部のブローホール、及び、接合強度を調べた結
果、ブローホールは見られず、また、接合強度もＡＱｘ
○３基板と同様であった。As a result of examining the blowholes and joint strength of this joint, no blowholes were found, and the joint strength was also AQx
○It was the same as the 3rd board.
本発明によれば、接合炉内を全く減圧することなく、常
圧中でも信頼性の高いセラミックスのメクライズ、及び
、接合部を得ることができる。According to the present invention, highly reliable ceramic meclization and bonded parts can be obtained even under normal pressure without reducing the pressure in the bonding furnace at all.
Claims (1)
以上を含むろう材によつてセラミックス表面をメタライ
ズ、または、他の部材と接合する炉中の雰囲気ガスは、
窒素ガス中に不活性ガスＡｒ、Ｈｅ、Ｎｅ、Ｋｒ、Ｘｅ
、Ｒｎの中から選ばれる一種以上の混合ガスであること
を特徴とするセラミックスの接合方法。 ２、前記混合ガスの前記窒素ガス中に含まれる不活性ガ
スの量は１０〜７０Ｖｏｌ％であることを特徴とする特
許請求の範囲第１項記載のセラミックスの接合方法。 ３、特許請求の範囲第２項記載の不活性ガスはＡｒガス
であることを特徴とするセラミックスの接合方法。 ４、特許請求の範囲第１項記載の活性金属を含むろう材
は、Ａｇ、Ｃｕ、Ｎｉの単体、または、一種以上の合金
（混合も含む）にＴｉまたはＺｒ、Ｈｆ、の中から選ば
れる一種類以上の元素を１〜３０ｗｔ％含むことを特徴
とするセラミックスの接合方法。[Claims] 1. The atmospheric gas in the furnace in which the ceramic surface is metalized or bonded to other members with a brazing filler metal containing one or more active metals selected from Ti, Zr, and Hf is:
Inert gas Ar, He, Ne, Kr, Xe in nitrogen gas
, Rn. 2. The method of joining ceramics according to claim 1, wherein the amount of inert gas contained in the nitrogen gas of the mixed gas is 10 to 70 Vol%. 3. A method for joining ceramics, characterized in that the inert gas according to claim 2 is Ar gas. 4. The brazing material containing the active metal described in claim 1 is selected from Ag, Cu, Ni alone, or one or more alloys (including mixtures), Ti, Zr, and Hf. A method for joining ceramics, characterized by containing 1 to 30 wt% of one or more types of elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25473588A JPH02102174A (en) | 1988-10-12 | 1988-10-12 | Ceramic bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25473588A JPH02102174A (en) | 1988-10-12 | 1988-10-12 | Ceramic bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102174A true JPH02102174A (en) | 1990-04-13 |
Family
ID=17269129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25473588A Pending JPH02102174A (en) | 1988-10-12 | 1988-10-12 | Ceramic bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102174A (en) |
-
1988
- 1988-10-12 JP JP25473588A patent/JPH02102174A/en active Pending
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