JPH02101787A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To exclude the irregularity of coupling with an optical fiber, and obtain the excellent coupling efficiency by installing a lens in a cap, dividing the cap into two parts, and assembling them in a unified body. CONSTITUTION:A lens 3 is arranged in an upper cap 80. A stem 6 is covered with a lower cap 81, and the upper cap 80 is engaged with the lower cap 81. In this state, the lower cap 81 is finely moved in X and Y directions, while an LD is made to radiate light, and optical axis alignment is monitored by a photo detection device arranged so as to face the lens. When optical axes coincide with each other in X and Y directions, the lower cap 81 is fixed and fusion-bonded. Next, the upper cap 80 is finely moved up and down, while the state of optical axis alignment in Z direction is monitored. When the optical axes coincide with each other in Z direction, the upper cap is bonded with the lower cap by soldering, and fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a semiconductor laser device for optical communications that is used in combination with an optical fiber.

[Conventional technology]

Is Figure 2 a conventional semiconductor laser device? show! ! 'r side drawing.

In the figure, il+ is a semiconductor laser (hereinafter referred to as LD) chip, (21 is an LD chip...) The light emitting point of the stem (
(6) is a heat sink assembled to the stem F81 so as to match the central axis of (41 is a lens holder fixed to the LD with its optical axis aligned through solder material tel'i, (8) is a stem ( 6) Window glass 111 welded to
It is a cap with a

Next, the operation will be explained.

Install the light receiving device opposite the LD and solder the bag 15+
f onto the heat sink (2) through the lens holder 41
With the lens installed, let the LD emit light and attach the lens holder (4).
) in the X and Y directions, and monitor the optical axis alignment using the light receiving device. Fix the lens holder 14) where the optical axes are aligned.

The lens holder (4) is heated up in the fixed state and fixed to the heat sink (21) with solder material +61.

[Problem to be solved by the invention]

Conventional semiconductor laser devices are configured as described above, but they suffer from problems such as poor work efficiency and poor mass productivity, and the inability to align the lens in two axes, resulting in large variations in coupling efficiency with optical fibers. there were.

This invention was made in order to solve the above-mentioned problems, and it has high mass productivity, a paper that allows optical axis alignment in the z-axis direction, and a method that eliminates variations in coupling with optical fibers and provides good coupling. The purpose is to obtain a semiconductor laser device that can obtain efficiency.

Means for Solving CIIIN] A semiconductor laser device according to the present invention has a lens attached to a cap, the cap is divided into two parts, and the two parts are fitted into one piece.

[Effect]

The semiconductor laser device according to the present invention monitors the optical axis alignment in X and Y during manufacturing.

Since the position can be finely adjusted in eight directions, the variation in coupling efficiency with optical fibers is small and mass production is good.

[Example] Hereinafter, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view showing a semiconductor laser device according to an embodiment of the present invention, and is constructed as follows.

T, +D chips... are bonded to the heat sink (21), and the heat sink (2) is attached to the stem (6) so that the light emitting point of the LD chip Ill matches the central axis of the stem ill+.
It is assembled in.

A lens (31) is provided on the upper cap.

Cover the stem (6) with the lower cap + 5lli, and insert the upper cap 11 into the lower cap (i Ic H).

In this state, while making the LD emit light, remove the lower cap i.
The lens is slightly moved in the X and Y directions by 13υk, and the optical axis alignment is monitored using a light receiving device installed opposite the lens. The lower cap δυ is fixed and welded where the optical axis in the X and Y directions is located.

Next, the upper cap 1 is slightly moved up and down while monitoring the state of alignment of the optical axes in the two directions, and when the optical axes in the two directions are aligned, it is brazed and fixed to the lower cap.

〔Effect of the invention〕

As described above, according to the present invention, the lens 1f is attached to the cap.
r: Since it is installed and the above-mentioned middle yatsupu is divided,
Optical axes can be aligned in eight directions (X, Y, and Z), and the above optical axes can be aligned by slightly moving the upper and lower caps while monitoring the LD light, making it highly suitable for mass production and achieving good coupling efficiency with optical fibers. can get.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a semiconductor laser device according to an embodiment of the present invention, and FIG. 8 is a sectional view showing a conventional semiconductor laser device. In the figure, IIIHLD chip, (2) is a heat sink, (31 is a lens, 14) is a lens holder, t
5) is solder material, (61 is stem, tt+ is window glass,
Bit is the upper cap, fill is the lower cap, and (9) is the brazing metal part. In addition, in the figure, the same code|symbol shows 1clIl- or a corresponding part.

Claims (1)

[Claims] In a semiconductor laser device configured by a laser diode chip assembled to a stem via a heat sink and a cap welded to the stem, the cap is divided into two parts, a lower cap is welded to the stem, and a lens is attached to the upper cap. , a semiconductor laser device characterized in that the lower cap and the upper cap are fitted together.