JPH02125671A - Light-emitting element - Google Patents

Abstract

PURPOSE:To enable a light-emitting element to be aligned with an optical fiber easily by combining a surface emission type LED having a monolithic lens with a lens cap. CONSTITUTION:A surface emission type diode chip 1 having a monolithic lens formed on the surface by wet etching is combined with a sealing cap 4 having a lens 8 provided in a light transmitting hole 9. Distance (d) between the LED 1 and the lens 8 and a position of the plane are adjusted by an arm 5 while a light-emitting line l is monitored by a power meter through an optical fiber 6. After adjusted to an optimum coupling position, the cap is preliminarily sealed with the LED chip 1 by laser welding such that they are not deviated from the coupling position. Thereafter, they are sealed together definitely by thermocompression bonding. In this manner, a light-emitting element easy to align with the optical fiber 6 can be obtained.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a light emitting device.

[Conventional technology]

FIG. 3 is a schematic cross-sectional view of an example of a conventional coupling between a light emitting element and an optical fiber.

Conventionally, this type of coupling was performed by placing a lens 8a between an enclosing cap 7 using a flat quartz material for the light transmitting part 9a and an optical fiber 6, and adjusting the positions of these three to form a surface-emitting type. E
DI light was coupled to an optical fiber 6 and output.

In addition, the manufacturing method is 1.3 μm band zero surface emitting type LED1.
The enclosure cap 7 is simply fused to the Fe stem 3 on which the S1 heat sink 2 is mounted.

[Problem to be solved by the invention]

When the above-mentioned conventional light-emitting element is coupled to an optical fiber, the optical axes of the light-emitting element, lens, and optical fiber must be adjusted so that they are directly connected. The drawback was that it took a considerable amount of time.

Another disadvantage is that it is difficult for an optical module manufacturer to reproduce the coupling with the optical fiber adjusted in the inspection process of the LED chip manufacturer, and it is difficult to match the data of the optical fiber output.

An object of the present invention is to provide a light emitting element that can be easily matched with an optical fiber.

[Means to solve the problem]

The light-emitting element of the present invention includes a surface-emitting type light-emitting diode chip having a monolithic lens formed by wet etching on the surface thereof, and an encapsulating cap having a transparent part on a part of the surface through which light emitted from the light-emitting diode chip is transmitted to the outside. In the light emitting element combining the above, a lens is provided in the transmitting portion.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a cross-sectional view of one embodiment of the present invention, and FIG. 2 is a cross-sectional schematic diagram of an encapsulating cap and a light-emitting diode chip for explaining the manufacturing method of the light-emitting device shown in FIG.
This is a 1.3 μm band surface-emitting LEDI using nGaAsP in the active layer.

2 is a heat sink made of Si, and 3 is a stem made of cover.

These three parts are fused together using a suitable brazing material.

Next, as shown in FIG. 2, the cap 4 with the enclosing lens is connected to the E D 1 and the lens 8 by the arm 5 while monitoring the emission line e with a power meter via the optical fiber 6.
The distance d and the position of the plane are adjusted.

After aligning the optimal bonding position, laser welding is performed to prevent the bonding position from shifting, and temporary encapsulation is performed.

After that, the book is sealed using normal thermocompression bonding.

By doing this, it is possible to minimize misalignment that occurs during thermocompression bonding.

Note that -16 dB can be realized as the input loss of the optical fiber of the light emitting device thus manufactured.

Note that it is also possible to set the distance d to 1.3 mm, set the optical coupling to B-coupling, widen the tolerance, and loosen the accuracy of the coupling position adjustment.

〔Effect of the invention〕

As explained above, the present invention enables alignment of optical fiber output data between the light emitting element manufacturer and its user, the module manufacturer, by combining a surface emitting LED with a monolithic lens and a lens cap. This has the effect of significantly facilitating the coupling of the light emitting element and the optical fiber at the module manufacturer.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of an encapsulating cap and a light-emitting diode chip for explaining the method of manufacturing the light-emitting device shown in FIG. 1, and FIG. FIG. 2 is a schematic cross-sectional view of an example of coupling between a light emitting element and an optical fiber. DESCRIPTION OF SYMBOLS 1...Surface emitting type LED, 4...Cap with lens for enclosure, 8...Lens, 9...Light transmission hole. Agent Patent Attorney Oto Uchihara (Male)

Claims (1)

[Claims] In a light-emitting element that combines a surface-emitting type light-emitting diode chip having a monolithic lens formed on the surface by wet etching and an encapsulation cap having a transparent part on a part of the surface that transmits the light emitted from the light-emitting diode chip to the outside. . A light emitting device, characterized in that a lens is provided in the transmitting portion.