JPH02101597U - - Google Patents
Info
- Publication number
- JPH02101597U JPH02101597U JP770589U JP770589U JPH02101597U JP H02101597 U JPH02101597 U JP H02101597U JP 770589 U JP770589 U JP 770589U JP 770589 U JP770589 U JP 770589U JP H02101597 U JPH02101597 U JP H02101597U
- Authority
- JP
- Japan
- Prior art keywords
- electronic board
- opening
- foil
- housing
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims description 2
Description
第1図は本考案による浸漬冷却構造の全体構成
を示す断面図、第2図は同浸漬冷却に使用する箔
の取付構造を示す分解斜視図、第3図は従来の浸
漬冷却構造の全体構成を示す断面図である。
図において、10は容器、11は冷却液、12
はハウジング、13は開口、14は回路素子、1
5は電子基板、16は箔、19はフレームである
。
Figure 1 is a sectional view showing the overall configuration of the immersion cooling structure according to the present invention, Figure 2 is an exploded perspective view showing the mounting structure of the foil used for immersion cooling, and Figure 3 is the overall configuration of the conventional immersion cooling structure. FIG. In the figure, 10 is a container, 11 is a cooling liquid, 12
1 is a housing, 13 is an opening, 14 is a circuit element, 1
5 is an electronic board, 16 is a foil, and 19 is a frame.
Claims (1)
ング12の一面を開口13し、この開口13に電
子基板15の回路素子14を対面させ、上気開口
13に箔16を取り付け、該箔16と回路素子1
4とを当接させるとともに、上記ハウジング12
を冷却液11中に浸漬したことを特徴とする電子
基板の浸漬冷却構造。 One side of the case-like housing 12 containing the electronic board 15 is formed with an opening 13, the circuit element 14 of the electronic board 15 faces the opening 13, a foil 16 is attached to the upper air opening 13, and the foil 16 and the circuit element are 1
4 and the housing 12
An immersion cooling structure for an electronic board, characterized in that the electronic board is immersed in a cooling liquid 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP770589U JPH02101597U (en) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP770589U JPH02101597U (en) | 1989-01-27 | 1989-01-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02101597U true JPH02101597U (en) | 1990-08-13 |
Family
ID=31212943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP770589U Pending JPH02101597U (en) | 1989-01-27 | 1989-01-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02101597U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013187251A (en) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | Cooling system and method of electronic apparatus |
-
1989
- 1989-01-27 JP JP770589U patent/JPH02101597U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013187251A (en) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | Cooling system and method of electronic apparatus |
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