JPH02101597U - - Google Patents

Info

Publication number
JPH02101597U
JPH02101597U JP770589U JP770589U JPH02101597U JP H02101597 U JPH02101597 U JP H02101597U JP 770589 U JP770589 U JP 770589U JP 770589 U JP770589 U JP 770589U JP H02101597 U JPH02101597 U JP H02101597U
Authority
JP
Japan
Prior art keywords
electronic board
opening
foil
housing
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP770589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP770589U priority Critical patent/JPH02101597U/ja
Publication of JPH02101597U publication Critical patent/JPH02101597U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による浸漬冷却構造の全体構成
を示す断面図、第2図は同浸漬冷却に使用する箔
の取付構造を示す分解斜視図、第3図は従来の浸
漬冷却構造の全体構成を示す断面図である。 図において、10は容器、11は冷却液、12
はハウジング、13は開口、14は回路素子、1
5は電子基板、16は箔、19はフレームである
Figure 1 is a sectional view showing the overall configuration of the immersion cooling structure according to the present invention, Figure 2 is an exploded perspective view showing the mounting structure of the foil used for immersion cooling, and Figure 3 is the overall configuration of the conventional immersion cooling structure. FIG. In the figure, 10 is a container, 11 is a cooling liquid, 12
1 is a housing, 13 is an opening, 14 is a circuit element, 1
5 is an electronic board, 16 is a foil, and 19 is a frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子基板15を内部に収容したケース状ハウジ
ング12の一面を開口13し、この開口13に電
子基板15の回路素子14を対面させ、上気開口
13に箔16を取り付け、該箔16と回路素子1
4とを当接させるとともに、上記ハウジング12
を冷却液11中に浸漬したことを特徴とする電子
基板の浸漬冷却構造。
One side of the case-like housing 12 containing the electronic board 15 is formed with an opening 13, the circuit element 14 of the electronic board 15 faces the opening 13, a foil 16 is attached to the upper air opening 13, and the foil 16 and the circuit element are 1
4 and the housing 12
An immersion cooling structure for an electronic board, characterized in that the electronic board is immersed in a cooling liquid 11.
JP770589U 1989-01-27 1989-01-27 Pending JPH02101597U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP770589U JPH02101597U (en) 1989-01-27 1989-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP770589U JPH02101597U (en) 1989-01-27 1989-01-27

Publications (1)

Publication Number Publication Date
JPH02101597U true JPH02101597U (en) 1990-08-13

Family

ID=31212943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP770589U Pending JPH02101597U (en) 1989-01-27 1989-01-27

Country Status (1)

Country Link
JP (1) JPH02101597U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013187251A (en) * 2012-03-06 2013-09-19 Sohki:Kk Cooling system and method of electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013187251A (en) * 2012-03-06 2013-09-19 Sohki:Kk Cooling system and method of electronic apparatus

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