JPH01118488U - - Google Patents

Info

Publication number
JPH01118488U
JPH01118488U JP1292288U JP1292288U JPH01118488U JP H01118488 U JPH01118488 U JP H01118488U JP 1292288 U JP1292288 U JP 1292288U JP 1292288 U JP1292288 U JP 1292288U JP H01118488 U JPH01118488 U JP H01118488U
Authority
JP
Japan
Prior art keywords
circuit board
frame
device casing
laminated structure
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1292288U
Other languages
Japanese (ja)
Other versions
JPH075659Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988012922U priority Critical patent/JPH075659Y2/en
Publication of JPH01118488U publication Critical patent/JPH01118488U/ja
Application granted granted Critical
Publication of JPH075659Y2 publication Critical patent/JPH075659Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案に係る回路基板の積層構造を
概念的に示した斜視図、第2図および第3図は、
本考案に係る回路基板の積層構造の一実施例を示
したもので、第2図は、その分解断面図、第3図
は、組付け後の断面図、第4図は、従来の回路基
板の積層構造を採用した電子機器の概念的な断面
図である。 11…機器筐体、17…枠体、20,21…回
路基板。
FIG. 1 is a perspective view conceptually showing the laminated structure of a circuit board according to the present invention, and FIGS. 2 and 3 are
One embodiment of the laminated structure of the circuit board according to the present invention is shown, FIG. 2 is an exploded sectional view thereof, FIG. 3 is a sectional view after assembly, and FIG. 4 is a conventional circuit board. 1 is a conceptual cross-sectional view of an electronic device that employs a laminated structure. DESCRIPTION OF SYMBOLS 11... Equipment housing, 17... Frame body, 20, 21... Circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 枠体の両面にそれぞれ回路基板を保持させると
ともに、前記枠体を機器筐体に固定させ、前記回
路基板を前記機器筐体の内部に収容するようにし
たことを特徴とする回路基板の積層構造。
A laminated structure of a circuit board, characterized in that a circuit board is held on each side of a frame, the frame is fixed to a device casing, and the circuit board is housed inside the device casing. .
JP1988012922U 1988-02-02 1988-02-02 Circuit board laminated structure Expired - Lifetime JPH075659Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988012922U JPH075659Y2 (en) 1988-02-02 1988-02-02 Circuit board laminated structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988012922U JPH075659Y2 (en) 1988-02-02 1988-02-02 Circuit board laminated structure

Publications (2)

Publication Number Publication Date
JPH01118488U true JPH01118488U (en) 1989-08-10
JPH075659Y2 JPH075659Y2 (en) 1995-02-08

Family

ID=31222791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988012922U Expired - Lifetime JPH075659Y2 (en) 1988-02-02 1988-02-02 Circuit board laminated structure

Country Status (1)

Country Link
JP (1) JPH075659Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010081125A (en) * 2008-09-25 2010-04-08 Toshiba Corp Cellular phone terminal
JP2014192194A (en) * 2013-03-26 2014-10-06 Sato Holdings Corp Board unit mechanism
JP2018078239A (en) * 2016-11-11 2018-05-17 北川工業株式会社 spacer
JP2020205347A (en) * 2019-06-17 2020-12-24 パナソニックIpマネジメント株式会社 Housing, and electrical equipment and electric power conversion system including the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103170U (en) * 1982-01-06 1983-07-13 株式会社日立製作所 equipment housing
JPS60186092A (en) * 1984-03-06 1985-09-21 松下電器産業株式会社 Control device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103170U (en) * 1982-01-06 1983-07-13 株式会社日立製作所 equipment housing
JPS60186092A (en) * 1984-03-06 1985-09-21 松下電器産業株式会社 Control device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010081125A (en) * 2008-09-25 2010-04-08 Toshiba Corp Cellular phone terminal
JP2014192194A (en) * 2013-03-26 2014-10-06 Sato Holdings Corp Board unit mechanism
JP2018078239A (en) * 2016-11-11 2018-05-17 北川工業株式会社 spacer
JP2020205347A (en) * 2019-06-17 2020-12-24 パナソニックIpマネジメント株式会社 Housing, and electrical equipment and electric power conversion system including the same

Also Published As

Publication number Publication date
JPH075659Y2 (en) 1995-02-08

Similar Documents

Publication Publication Date Title
JPS6232596U (en)
JPH01118488U (en)
JPH01168920U (en)
JPH0292977U (en)
JPH0178489U (en)
JPS61178242U (en)
JPS61182546U (en)
JPH0178491U (en)
JPH0426590U (en)
JPH0258338U (en)
JPS62178671U (en)
JPH0381985U (en)
JPS6237977U (en)
JPS62172192U (en)
JPS62193777U (en)
JPH0227798U (en)
JPH0196618U (en)
JPH0454468U (en)
JPS639188U (en)
JPH045649U (en)
JPS6282789U (en)
JPS6339278U (en)
JPS6236587U (en)
JPH0282082U (en)
JPS6270481U (en)