JPH02138495U - - Google Patents
Info
- Publication number
- JPH02138495U JPH02138495U JP15474388U JP15474388U JPH02138495U JP H02138495 U JPH02138495 U JP H02138495U JP 15474388 U JP15474388 U JP 15474388U JP 15474388 U JP15474388 U JP 15474388U JP H02138495 U JPH02138495 U JP H02138495U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- housing
- houses
- casing
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
は第１図中の矢印−線に沿う横断面図、第２
図ｂは同−線に沿う縦断面図である。
１……筺体本体、１ａ……筺体本体の上面の開
口部、１ｂ……筺体本体の下面の開口部、２……
カバー、３……隔壁、３ａ……空洞部、３ｂ……
空洞部の上部開口、３ｃ……空洞部の下部開口、
４……電子機器。
Figure 1 is a perspective view of one embodiment of the present invention, Figure 2 a
is a cross-sectional view along the arrow-line in Fig. 1;
Figure b is a longitudinal sectional view taken along the same line. 1... Housing body, 1a... Opening on the top surface of the housing body, 1b... Opening on the bottom surface of the housing body, 2...
Cover, 3... Partition wall, 3a... Cavity, 3b...
Upper opening of the cavity, 3c...lower opening of the cavity,
4...Electronic equipment.
Claims (1)
いて、 前記電子機器を収容する筺体内に、前記電子機
器に近接させて中空筒状の隔壁体を配し、該隔壁
体の両開口端を前記筺体の外面へ臨ませてエアの
流通路を形成したことを特徴とした電子機器収容
筺体の放熱装置。[Claims for Utility Model Registration] In an electronic device accommodating body that houses an electronic device therein, a hollow cylindrical partition body is disposed in the casing that houses the electronic device in close proximity to the electronic device, and the partition wall 1. A heat dissipation device for an electronic device housing housing, characterized in that both open ends of the body face the outer surface of the housing to form an air flow path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15474388U JPH02138495U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15474388U JPH02138495U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138495U true JPH02138495U (en) | 1990-11-19 |
Family
ID=31699499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15474388U Pending JPH02138495U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138495U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219166A (en) * | 2012-04-09 | 2013-10-24 | Denso Corp | Electronic apparatus |
| JP2018037607A (en) * | 2016-09-02 | 2018-03-08 | 池上通信機株式会社 | Heat hole heat dissipation mechanism |
-
1988
- 1988-11-30 JP JP15474388U patent/JPH02138495U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219166A (en) * | 2012-04-09 | 2013-10-24 | Denso Corp | Electronic apparatus |
| JP2018037607A (en) * | 2016-09-02 | 2018-03-08 | 池上通信機株式会社 | Heat hole heat dissipation mechanism |