JPH02101544U - - Google Patents
Info
- Publication number
- JPH02101544U JPH02101544U JP903989U JP903989U JPH02101544U JP H02101544 U JPH02101544 U JP H02101544U JP 903989 U JP903989 U JP 903989U JP 903989 U JP903989 U JP 903989U JP H02101544 U JPH02101544 U JP H02101544U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cap
- sealed semiconductor
- view
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000009432 framing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903989U JPH02101544U (xx) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903989U JPH02101544U (xx) | 1989-01-27 | 1989-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101544U true JPH02101544U (xx) | 1990-08-13 |
Family
ID=31215442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP903989U Pending JPH02101544U (xx) | 1989-01-27 | 1989-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101544U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201941A (ja) * | 1989-01-31 | 1990-08-10 | Oki Electric Ind Co Ltd | 半導体パッケージ |
-
1989
- 1989-01-27 JP JP903989U patent/JPH02101544U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201941A (ja) * | 1989-01-31 | 1990-08-10 | Oki Electric Ind Co Ltd | 半導体パッケージ |