JPH02101544U - - Google Patents

Info

Publication number

JPH02101544U

JPH02101544U JP903989U JP903989U JPH02101544U JP H02101544 U JPH02101544 U JP H02101544U JP 903989 U JP903989 U JP 903989U JP 903989 U JP903989 U JP 903989U JP H02101544 U JPH02101544 U JP H02101544U

Authority

JP

Japan

Prior art keywords

resin

cap

sealed semiconductor

view

semiconductor pellet

Prior art date

1989-01-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 6
• 239000008188 pellet Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 239000011347 resin Substances 0.000 description 4
• 229920005989 resin Polymers 0.000 description 4
• 238000009432 framing Methods 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)