JPH019170Y2 - - Google Patents
Info
- Publication number
- JPH019170Y2 JPH019170Y2 JP4516684U JP4516684U JPH019170Y2 JP H019170 Y2 JPH019170 Y2 JP H019170Y2 JP 4516684 U JP4516684 U JP 4516684U JP 4516684 U JP4516684 U JP 4516684U JP H019170 Y2 JPH019170 Y2 JP H019170Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor substrate
- semiconductor
- vertical
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 111
- 239000004065 semiconductor Substances 0.000 claims description 70
- 210000000078 claw Anatomy 0.000 claims description 22
- 238000000926 separation method Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4516684U JPS60158741U (ja) | 1984-03-30 | 1984-03-30 | 半導体基板のチヤツキング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4516684U JPS60158741U (ja) | 1984-03-30 | 1984-03-30 | 半導体基板のチヤツキング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60158741U JPS60158741U (ja) | 1985-10-22 |
JPH019170Y2 true JPH019170Y2 (en, 2012) | 1989-03-13 |
Family
ID=30558421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4516684U Granted JPS60158741U (ja) | 1984-03-30 | 1984-03-30 | 半導体基板のチヤツキング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60158741U (en, 2012) |
-
1984
- 1984-03-30 JP JP4516684U patent/JPS60158741U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60158741U (ja) | 1985-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR940001150B1 (ko) | 반도체웨이퍼 이송장치 | |
TWI636858B (zh) | Substrate transfer robot and substrate processing system | |
KR950001982A (ko) | 반도체 처리시스템 및 기판의 교환방법 및 처리방법 | |
KR100285081B1 (ko) | 웨이퍼보트 회전장치 | |
TWI656003B (zh) | Substrate transfer system and method | |
JPH07263521A (ja) | ウェーハ移載の装置と方法並びに半導体装置の製造方法 | |
JPH019170Y2 (en, 2012) | ||
US4728246A (en) | Wafer boat transfer tool | |
EP0244772B1 (en) | Wafer cassette transfer mechanismand method | |
JPS6317521A (ja) | ウエ−ハボ−トの搬送方法 | |
JP3157738B2 (ja) | ウエハ移載装置および移載方法 | |
JP4254980B2 (ja) | ウエハ移載装置 | |
JPH0211489B2 (en, 2012) | ||
KR102417320B1 (ko) | 부상된 대상물을 이송시키는 이송 장치 | |
CN221776972U (zh) | 一种上料机构及光罩处理装置 | |
JP2003530282A (ja) | 処理タンクをローディング及びアンローディングするための方法 | |
JPH0595042A (ja) | 天井走行車システムの収納容器 | |
JPH0383730A (ja) | 板状体の搬入搬出方法および搬入搬出装置 | |
JPH06252120A (ja) | ウェーハの湿式洗浄装置および洗浄方法 | |
JP2541887Y2 (ja) | ウエハの表面処理装置 | |
JP3628865B2 (ja) | 基板処理装置 | |
CN118847520A (zh) | 芯片托盘自动检测设备及检测工艺 | |
JP3336225B2 (ja) | 基板の処理システム及び処理方法 | |
JP2550553Y2 (ja) | 表面処理装置のウエハ移替装置 | |
CN114267619A (zh) | 倾斜装置及晶圆片同侧倾斜方法 |