JPH0191426A - Spin coating device - Google Patents
Spin coating deviceInfo
- Publication number
- JPH0191426A JPH0191426A JP62247903A JP24790387A JPH0191426A JP H0191426 A JPH0191426 A JP H0191426A JP 62247903 A JP62247903 A JP 62247903A JP 24790387 A JP24790387 A JP 24790387A JP H0191426 A JPH0191426 A JP H0191426A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- nozzle
- bonding agent
- adhesive
- spin coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004528 spin coating Methods 0.000 title claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000003960 organic solvent Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 11
- 230000002093 peripheral effect Effects 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 3
- 239000012530 fluid Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 241000257465 Echinoidea Species 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
本発明ｎシリコン等のウェハをセラミックスやパイレッ
クス等のプレートに貼り付けるため該ウニへの表面にワ
ックス等の接着剤を塗布するスピンコート装置に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a spin coating device for applying an adhesive such as wax to the surface of a wafer made of silicon or the like to a plate made of ceramics, pyrex or the like.
ウニへの表面にワックスをスピンコートする場合、従来
はウェハをスピンチャックに保持させ、上面から液状の
ワックスを滴下しているが、回転により表面全体に広が
ったワックスが周縁から裏面にまわり込んで付着するこ
とがあり、そのためスピンコート終了後、ウエノ１の裏
面を洗浄装置で洗浄しなければならなかった。When spin-coating wax on the surface of sea urchins, conventionally the wafer is held in a spin chuck and liquid wax is dripped from the top surface, but the wax spreads over the entire surface due to rotation and wraps around from the periphery to the back surface. Because of this, the back side of Ueno 1 had to be cleaned using a cleaning device after spin coating.
本発明は、ウェハの表面にワックス等の接着剤をスピン
コートする際、同時に裏面の周縁に洗浄液を流出させ、
ウェハ周縁の裏面にまわり込んだ接着剤を洗浄し、スピ
ンコート終了後の洗浄工程を不要とし、表面にのみ接着
剤を塗布したウエノ１を得られるようにしたスピンコー
ト装置に係るものである。In the present invention, when spin-coating an adhesive such as wax on the front surface of a wafer, at the same time a cleaning liquid flows out to the periphery of the back surface,
The present invention relates to a spin coating device that cleans the adhesive that has gotten around to the back side of the wafer periphery, eliminates the need for a cleaning step after spin coating, and makes it possible to obtain a wafer 1 coated with adhesive only on the front surface.
以下実施例と共に詳述する。This will be described in detail below along with examples.
図において、ウェハ（１）を回転可能に保持するウェハ
保持部（２）は、真空作用により該ウェハを吸着するよ
うにしであるが、適宜の把持爪（図示路）その他の手段
で保持させることもできる。上記ウェハ保持部（２）は
、取付板（３）にねじ（４）で固定されたモーター（５
ンのモーター軸に取付けられ、該モーターにより回転さ
れ、また該モーター軸の中心を通って吸引源（図示路）
に連通ずる流路（６）により該保持部（２）の上面は吸
着作用を奏する。上記取付板（３）は・適宜の緩衝作用
を有する弾性片（７）を介して昇降フレーム（８）Ｋ固
定されているが、該弾性片を省略することもできる。該
フレーム（３）に上下方に延出する案内杆（９）が取付
けられており、該案内杆（９）は本体αｑに設けた軸受
ａυに挿通し、下端で連結板図に固着されている。該本
体ＱＯに設けたシリンダ側は、そのピストンロンドα◆
の先端を上記フレーム（３）に固着してあり、該シリン
ダ（至）を動作することにより上記フレーム（３）、取
付板（３）を介し上記ウェハ保持部（２）を昇降させる
ことができる。In the figure, the wafer holder (2) that rotatably holds the wafer (1) is designed to attract the wafer by vacuum action, but it may also be held by an appropriate gripping claw (path shown) or other means. You can also do it. The wafer holder (2) has a motor (5) fixed to the mounting plate (3) with screws (4).
attached to the motor shaft of the motor, rotated by the motor, and passing through the center of the motor shaft as a suction source (path shown).
The upper surface of the holding part (2) exhibits an adsorption effect due to the flow path (6) communicating with the holding part (2). The mounting plate (3) is fixed to the elevating frame (8) K via an elastic piece (7) having a suitable buffering effect, but the elastic piece can also be omitted. A guide rod (9) extending vertically is attached to the frame (3), and the guide rod (9) is inserted into a bearing aυ provided on the main body αq, and is fixed to the connecting plate at its lower end. There is. The cylinder side provided on the main body QO has its piston rond α◆
The tip of the cylinder is fixed to the frame (3), and by operating the cylinder, the wafer holder (2) can be raised and lowered via the frame (3) and the mounting plate (3). .
上記取付板（３）の上面には、洗浄ノズル（至）を設け
である。該洗浄ノズル（ハ）の基端は摺動板［相］に固
定され、該摺動板ａ→に形成した長孔０７）にねじ（ト
）を挿通し、該ねじを締着して摺動板（４）の取付位置
を、取付板（３）上で変化させることにより、上方に立
上げたノズルαＯの先端ａ優の位置がウェハの裏面周縁
に近接するよう調整する。該ノズルの先端の下方には、
洗浄後の廃液を回収する受槽（４）が形成されている。A cleaning nozzle (to) is provided on the upper surface of the mounting plate (3). The base end of the cleaning nozzle (c) is fixed to the sliding plate [phase], and a screw (g) is inserted into the long hole 07) formed in the sliding plate a→, and the screw is tightened to prevent the sliding. By changing the mounting position of the moving plate (4) on the mounting plate (3), the position of the tip a of the upwardly raised nozzle αO is adjusted to be close to the periphery of the back surface of the wafer. Below the tip of the nozzle,
A receiving tank (4) is formed to collect waste liquid after cleaning.
なお、上記ノズル（至）の一部をたわみ管で構成し、該
ノズルの先端ａ呻の位置を変更できるよう圧してもよい
。Note that a part of the nozzle may be formed of a flexible tube, and pressure may be applied so that the position of the tip a of the nozzle can be changed.
上記ウェハ保持部（２）の上方には、スピンカバー（ハ
）を設けてあり、該カバーの底部には廃液ダクト（２）
が形成されている。また、該スピンカバーＱＩ）の上方
には、ワックスを有機溶剤に溶解させた接着ワックス等
を滴下する接着剤ノズル四を設けてあり、所望により、
ウェハの表面を前洗浄するための有機溶剤を噴出するノ
ズル（ハ）やＮ２ブローするためのノズル（ハ）が前洗
浄ノズルとして付設されている。上記接着剤ノズル（イ
）は、ウェハ（１）の中心上方に固定的に設は一定量を
滴下するように構成したり、中心から半径方向に沿って
外方に直線運動させるようにしたり、弧状に旋回させる
ようにして（第３図）、高速で塗布するよう構成するこ
とができる。この場合、ウェハの中心位置で停止したま
ま所定量滴下するように構成することもできるし、中心
・位置で所定量滴下した後移動を開始し、ウェハの周辺
にノズルが達する前に接着剤の滴下を止め、そのままウ
ェハの外方へ移動し、その後ウェハの中心に復帰するよ
うに構成することもできる。A spin cover (c) is provided above the wafer holder (2), and a waste liquid duct (2) is provided at the bottom of the cover.
is formed. Further, above the spin cover QI), there is provided an adhesive nozzle 4 for dropping adhesive wax, etc. made by dissolving wax in an organic solvent.
A nozzle (c) for spouting an organic solvent for pre-cleaning the surface of the wafer and a nozzle (c) for blowing with N2 are attached as pre-cleaning nozzles. The adhesive nozzle (a) may be configured to be fixedly installed above the center of the wafer (1) and drop a certain amount, or may be configured to move linearly outward from the center in a radial direction. It can be configured to rotate in an arc (FIG. 3) and to apply at high speed. In this case, it can be configured to drop a predetermined amount of adhesive while stopping at the center of the wafer, or it can start moving after dropping a predetermined amount at the center and position, and the adhesive can be dropped before the nozzle reaches the periphery of the wafer. It is also possible to configure the droplet to stop dropping, move to the outside of the wafer, and then return to the center of the wafer.
而して、≠インチ、！インチ、６インチ等、塗布すべき
ウェハ（１）の大きさに応じて上記取付板（３）上の摺
動板（転）の位置を調整しておき、適宜の搬送手段（図
示路）でウェハ（１）を上記スピンカバー（財）とウェ
ハ保持部（２）の間に移送する。ウェハ（１）が保持部
（２）の上方に位置したら、上記シリンダα３を動作し
て上記保持部を上昇させ、ウェハ（１）を該保持部（２
）に吸着すると共に上記スピンカバー（ハ）内にウェハ
を搬入する。そして、上記前洗浄ノズルにより・ア七ト
ン等の有機溶剤をノズル（ハ）から流出させ、ウェハを
回転しながら表面を洗浄したり、又はノズル（イ）から
Ｎ２プローをする。その後、上記接着剤ノズルりから液
体状ワックス等の接着剤を滴下シ、ウェハ（１）を回転
させてスピンコートスル。So, ≠ inches! Adjust the position of the sliding plate (roller) on the mounting plate (3) according to the size of the wafer (1) to be coated, such as inch, 6 inch, etc., and use an appropriate conveyance means (path shown). The wafer (1) is transferred between the spin cover and the wafer holder (2). When the wafer (1) is located above the holding part (2), the cylinder α3 is operated to raise the holding part, and the wafer (1) is placed above the holding part (2).
) and carry the wafer into the spin cover (c). Then, by using the pre-cleaning nozzle, an organic solvent such as acetic acid is flowed out from the nozzle (c), and the surface is cleaned while rotating the wafer, or N2 blowing is performed from the nozzle (a). Thereafter, an adhesive such as liquid wax is dripped from the adhesive nozzle, and the wafer (1) is rotated and spin-coated.
なお、ウェハ保持部は、接着剤を滴下後回転を始めるよ
うにしたり、回転しなから接着剤を滴下するようにする
。この接着剤のコートと同時に上記洗浄ノズルαθから
適宜のリンス液を流出させ、ウェハの裏面周縁にまわり
込んだ接着剤を洗浄する。The wafer holder may start rotating after dropping the adhesive, or may drop the adhesive before rotating. At the same time as this adhesive coating, a suitable rinse liquid is flowed out from the cleaning nozzle αθ to clean the adhesive that has gotten around the periphery of the back surface of the wafer.
上記のようにして、ウェハの表面に接着剤をコートした
ら、上記シリンダ□□□を動作し工上記つェへ保持部（
２）を降下し、スピンカバー０１）の下方に待機してい
る搬送手段（図示路）に該ウェハを載置し、次工程へ送
り出す。その後未塗布のウェハを搬送手段によって移送
し、上記操作を繰り返す。なお、上記接着剤のコートに
先立って有機溶剤で前洗浄したものは、ワックスの塗り
が良くなることが確められた。After coating the surface of the wafer with adhesive as described above, move the cylinder □□□ to the holding part (
2) is lowered, and the wafer is placed on a transfer means (path shown) waiting under the spin cover 01), and sent to the next process. Thereafter, the uncoated wafer is transferred by the transfer means, and the above operation is repeated. Furthermore, it was confirmed that wax coating was improved by pre-cleaning with an organic solvent prior to coating with the adhesive.
、本発明は上記のように構成されているので、裏面に接
着剤が付着しないように表面に接着剤を塗布することが
でき、接着剤以外の各種のスピンコートに適用すること
もできる。Since the present invention is configured as described above, an adhesive can be applied to the front surface without adhering to the back surface, and it can also be applied to various types of spin coating other than adhesives.
図面は本発明の実施例を示し、第１図は一部を断面した
側面図、第２図は主としてウニ八保持部の平面図、第３
図は接着剤ノズルの動作説明図である。
１・゛・ウェハ、 ２・・・ウエノ）保持部、１５・
・・洗浄ノズル、２３・・・接着剤ノズル特許出願人
株式会社塩谷製作所
第１図The drawings show an embodiment of the present invention, and FIG. 1 is a partially sectional side view, FIG. 2 is a plan view mainly of the sea urchin holding part, and FIG.
The figure is an explanatory diagram of the operation of the adhesive nozzle. 1.゛・Wafer, 2...Ueno) holding part, 15.
...Cleaning nozzle, 23...Adhesive nozzle patent applicant
Shioya Seisakusho Co., Ltd. Diagram 1
Claims (1)
の上方に接着剤を滴下する接着剤ノズルを有し、該ウェ
ハ保持部の側方に、ウェハの裏面にまわり込む接着剤を
洗浄する洗浄ノズルを設けたスピンコート装置。 ２、上記洗浄ノズルは、ウェハの大きさに応じて取付位
置を調整可能に設けられている特許請求の範囲第１項記
載のスピンコート装置。 ３、上記接着剤ノズルには、接着剤を滴下する前にウェ
ハ表面を洗浄するよう前洗浄ノズルが付設されている特
許請求の範囲第ノ項記載のスピンコート装置。 ４、上記接着剤ノズルは、ウェハの中心から半径方向に
移動する特許請求の範囲第１項記載のスピンコート装置
。 ５、上記接着剤ノズルは、ウェハの中心から外方に弧状
に旋回する特許請求の範囲第１項記載のスピンコート装
置。[Claims] 1. A rotatable wafer holder is formed, an adhesive nozzle is provided above the wafer holder, and an adhesive nozzle is provided above the wafer holder. A spin coating device equipped with a cleaning nozzle that cleans the adhesive that goes around it. 2. The spin coating apparatus according to claim 1, wherein the cleaning nozzle is provided so that its mounting position can be adjusted according to the size of the wafer. 3. The spin coating apparatus according to claim 1, wherein the adhesive nozzle is provided with a pre-cleaning nozzle for cleaning the wafer surface before dropping the adhesive. 4. The spin coating apparatus according to claim 1, wherein the adhesive nozzle moves in a radial direction from the center of the wafer. 5. The spin coating apparatus according to claim 1, wherein the adhesive nozzle pivots outward in an arc from the center of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62247903A JPH0191426A (en) | 1987-10-02 | 1987-10-02 | Spin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62247903A JPH0191426A (en) | 1987-10-02 | 1987-10-02 | Spin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0191426A true JPH0191426A (en) | 1989-04-11 |
Family
ID=17170274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62247903A Pending JPH0191426A (en) | 1987-10-02 | 1987-10-02 | Spin coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0191426A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130532A (en) * | 1983-01-10 | 1983-08-04 | Fujitsu Ltd | Spin coating method |
| JPS5972140A (en) * | 1982-10-18 | 1984-04-24 | Toshiba Corp | Adhesive applicator |
| JPS60175569A (en) * | 1984-02-22 | 1985-09-09 | Nec Corp | Coating apparatus to semiconductor substrate |
-
1987
- 1987-10-02 JP JP62247903A patent/JPH0191426A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972140A (en) * | 1982-10-18 | 1984-04-24 | Toshiba Corp | Adhesive applicator |
| JPS58130532A (en) * | 1983-01-10 | 1983-08-04 | Fujitsu Ltd | Spin coating method |
| JPS60175569A (en) * | 1984-02-22 | 1985-09-09 | Nec Corp | Coating apparatus to semiconductor substrate |
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