JPH0189722U - - Google Patents
Info
- Publication number
- JPH0189722U JPH0189722U JP18510787U JP18510787U JPH0189722U JP H0189722 U JPH0189722 U JP H0189722U JP 18510787 U JP18510787 U JP 18510787U JP 18510787 U JP18510787 U JP 18510787U JP H0189722 U JPH0189722 U JP H0189722U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip electronic
- mounting
- resin
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18510787U JPH0189722U ( ) | 1987-12-03 | 1987-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18510787U JPH0189722U ( ) | 1987-12-03 | 1987-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189722U true JPH0189722U ( ) | 1989-06-13 |
Family
ID=31476435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18510787U Pending JPH0189722U ( ) | 1987-12-03 | 1987-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189722U ( ) |
-
1987
- 1987-12-03 JP JP18510787U patent/JPH0189722U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0189722U ( ) | ||
| JPS61199052U ( ) | ||
| JPS6398678U ( ) | ||
| JPS64332U ( ) | ||
| JPS63187330U ( ) | ||
| JPS6127338U (ja) | 混成集積回路装置 | |
| JPS614436U (ja) | 半導体装置用パツケ−ジ | |
| JPH0179832U ( ) | ||
| JPH02122477U ( ) | ||
| JPS6149453U ( ) | ||
| JPS6316455U ( ) | ||
| JPH0158925U ( ) | ||
| JPS6052665U (ja) | 配線基板 | |
| JPH0359640U ( ) | ||
| JPS6192064U ( ) | ||
| JPS6157555U ( ) | ||
| JPH0365275U ( ) | ||
| JPH0288240U ( ) | ||
| JPH03120052U ( ) | ||
| JPS6039269U (ja) | 混成集積回路装置 | |
| JPS58118769U (ja) | 印刷配線板 | |
| JPS606231U (ja) | 混成集積回路の構造 | |
| JPS6079771U (ja) | 多層配線基板 | |
| JPH0385636U ( ) | ||
| JPS63201369U ( ) |