JPH0187579U - - Google Patents
Info
- Publication number
- JPH0187579U JPH0187579U JP18471787U JP18471787U JPH0187579U JP H0187579 U JPH0187579 U JP H0187579U JP 18471787 U JP18471787 U JP 18471787U JP 18471787 U JP18471787 U JP 18471787U JP H0187579 U JPH0187579 U JP H0187579U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- parts
- plating
- adjacent
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例を示
す完成品の斜視図及び中間工程品の平面図、第２
図ａ，ｂはそれぞれ従来の印刷配線板の一例を示
す完成品の斜視図及び中間工程品の平面図である
。
１……基板、１Ｘ……親基板、２……回路配線
、３ａ，３ｂ……端子部、４……端子部間めつき
用リード配線、５，５ａ……切断穴、６，７……
めつき用リード配線、３１……外側部、３２……
内側部、３３……スリツト。
Figures 1a and 1b are a perspective view of a finished product and a plan view of an intermediate process product, respectively, showing one embodiment of the present invention.
Figures a and b are a perspective view of a completed product and a plan view of an intermediate process product, respectively, showing an example of a conventional printed wiring board. 1... Board, 1X... Main board, 2... Circuit wiring, 3a, 3b... Terminal section, 4... Lead wiring for plating between terminal sections, 5, 5a... Cutting hole, 6, 7...
Lead wiring for plating, 31...Outside part, 32...
Inner part, 33...slit.
Claims (1)
接続し外部回路と接続するための複数の第１の端
子部と、少なくとも１つは前記第１の端子部と隣
接して設けられ内側で回路配線と接続しスリツト
により内側部と外側部とに分離された複数の第２
の端子部と、千鳥状に配置され隣接する前記第１
の端子部と前記第２の端子部の内側部との間及び
隣接する前記第２の端子部の内側部間を接続する
複数の端子部間めつき用リード配線と、めつき後
にこれら各端子部間めつき用リード配線をそれぞ
れ切断する複数の切断穴とを有することを特徴と
する印刷配線板。 a plurality of first terminal portions provided on one periphery of the substrate for connection to circuit wiring on the inside and for connection to an external circuit; and at least one provided adjacent to the first terminal portion on the inside; A plurality of second parts connected to the circuit wiring and separated into an inner part and an outer part by slits.
and the first terminal portions arranged in a staggered manner and adjacent to each other.
A plurality of lead wires for plating between terminal parts connecting between the terminal part and the inner part of the second terminal part and between the inner parts of the adjacent second terminal parts, and each of these terminals after plating. A printed wiring board characterized by having a plurality of cutting holes for respectively cutting lead wiring for plating between parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471787U JPH0453024Y2 (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471787U JPH0453024Y2 (en) | 1987-12-02 | 1987-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0187579U true JPH0187579U (en) | 1989-06-09 |
| JPH0453024Y2 JPH0453024Y2 (en) | 1992-12-14 |
Family
ID=31476058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18471787U Expired JPH0453024Y2 (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453024Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012886A (en) * | 2005-06-30 | 2007-01-18 | Sumitomo Electric Ind Ltd | Method for manufacturing printed wiring board |
| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
-
1987
- 1987-12-02 JP JP18471787U patent/JPH0453024Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012886A (en) * | 2005-06-30 | 2007-01-18 | Sumitomo Electric Ind Ltd | Method for manufacturing printed wiring board |
| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0453024Y2 (en) | 1992-12-14 |