JPH0187557U - - Google Patents
Info
- Publication number
- JPH0187557U JPH0187557U JP1987184581U JP18458187U JPH0187557U JP H0187557 U JPH0187557 U JP H0187557U JP 1987184581 U JP1987184581 U JP 1987184581U JP 18458187 U JP18458187 U JP 18458187U JP H0187557 U JPH0187557 U JP H0187557U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- outer frame
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184581U JPH0187557U (enExample) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184581U JPH0187557U (enExample) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187557U true JPH0187557U (enExample) | 1989-06-09 |
Family
ID=31475931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987184581U Pending JPH0187557U (enExample) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187557U (enExample) |
-
1987
- 1987-12-02 JP JP1987184581U patent/JPH0187557U/ja active Pending