JPH0187557U - - Google Patents

Info

Publication number
JPH0187557U
JPH0187557U JP18458187U JP18458187U JPH0187557U JP H0187557 U JPH0187557 U JP H0187557U JP 18458187 U JP18458187 U JP 18458187U JP 18458187 U JP18458187 U JP 18458187U JP H0187557 U JPH0187557 U JP H0187557U
Authority
JP
Japan
Prior art keywords
resin
lead
semiconductor device
outer frame
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18458187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18458187U priority Critical patent/JPH0187557U/ja
Publication of JPH0187557U publication Critical patent/JPH0187557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP18458187U 1987-12-02 1987-12-02 Pending JPH0187557U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18458187U JPH0187557U (enExample) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18458187U JPH0187557U (enExample) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187557U true JPH0187557U (enExample) 1989-06-09

Family

ID=31475931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18458187U Pending JPH0187557U (enExample) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187557U (enExample)

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