JPH0174275U - - Google Patents

Info

Publication number
JPH0174275U
JPH0174275U JP1987167435U JP16743587U JPH0174275U JP H0174275 U JPH0174275 U JP H0174275U JP 1987167435 U JP1987167435 U JP 1987167435U JP 16743587 U JP16743587 U JP 16743587U JP H0174275 U JPH0174275 U JP H0174275U
Authority
JP
Japan
Prior art keywords
heating furnace
semiconductor
peak temperature
core tube
quartz ampoule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167435U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167435U priority Critical patent/JPH0174275U/ja
Publication of JPH0174275U publication Critical patent/JPH0174275U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の半導体製造用加熱炉の一実施
例を示す断面図、第2図は第1図のA―A′線断
面図、第3図は本考案の他の実施例を示す斜視図
、第4図は半導体製造用加熱炉の温度分布特性を
示す説明図である。 4:加熱炉、6:断熱材、7:耐熱レンガ、8
:炉心管、10,15:ピーク温度発生用ヒータ
、11,16:電極、17:定かつ車、18:ワ
イヤ。
Fig. 1 is a cross-sectional view showing one embodiment of a heating furnace for semiconductor manufacturing of the present invention, Fig. 2 is a cross-sectional view taken along line A-A' in Fig. 1, and Fig. 3 is a cross-sectional view showing another embodiment of the present invention. The perspective view and FIG. 4 are explanatory diagrams showing temperature distribution characteristics of a heating furnace for semiconductor manufacturing. 4: Heating furnace, 6: Insulating material, 7: Heat-resistant brick, 8
: Furnace tube, 10, 15: Heater for peak temperature generation, 11, 16: Electrode, 17: Fixed wheel, 18: Wire.

Claims (1)

【実用新案登録請求の範囲】 (1) 加熱炉の中心部を通つて水平方向に配設さ
れた炉心管に石英アンプルを挿入し、該石英アン
プル内の一端に化合物半導体を構成する元素の一
つを入れて蒸発源とし、他端には他の構成元素と
種結晶と共にボートに入れて配置し、前記加熱炉
により前記石英アンプルを加熱して半導体の単結
晶を成長させる半導体製造用加熱炉において、前
記炉心管の中央部外周に、前記化合物半導体単結
晶の溶融ゾーンを形成する炭化けい素製のピーク
温度発生用ヒータが設けてあることを特徴とする
半導体製造用加熱炉。 (2) 前記ピーク温度発生用ヒータは、垂直方向
上部に発生熱を放流する間隙部を有するものであ
る実用新案登録請求の範囲第1項記載の半導体装
置用加熱炉。 (3) 前記ピーク温度発生用ヒータは、炉心管長
手方向への移動を可能とする駆動機構を有するも
のである実用新案登録請求の範囲第1項記載の半
導体装置用加熱炉。
[Scope of Claim for Utility Model Registration] (1) A quartz ampoule is inserted into a furnace core tube disposed horizontally through the center of the heating furnace, and one end of the quartz ampoule is filled with one of the elements constituting the compound semiconductor. A heating furnace for semiconductor manufacturing in which one end is placed in a boat with other constituent elements and a seed crystal, and the heating furnace heats the quartz ampoule to grow a semiconductor single crystal. A heating furnace for semiconductor manufacturing, characterized in that a peak temperature generating heater made of silicon carbide that forms a melting zone of the compound semiconductor single crystal is provided on the outer periphery of the central portion of the furnace core tube. (2) The heating furnace for a semiconductor device according to claim 1, wherein the peak temperature generation heater has a vertically upper gap portion through which the generated heat is released. (3) The heating furnace for semiconductor devices according to claim 1, wherein the peak temperature generation heater has a drive mechanism that allows movement in the longitudinal direction of the reactor core tube.
JP1987167435U 1987-10-31 1987-10-31 Pending JPH0174275U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167435U JPH0174275U (en) 1987-10-31 1987-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167435U JPH0174275U (en) 1987-10-31 1987-10-31

Publications (1)

Publication Number Publication Date
JPH0174275U true JPH0174275U (en) 1989-05-19

Family

ID=31455727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167435U Pending JPH0174275U (en) 1987-10-31 1987-10-31

Country Status (1)

Country Link
JP (1) JPH0174275U (en)

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